Epoxy coated axial fixed inductors LanTu Micro AL0307-330K designed for RF choke and electronic devices
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Product Description
Axial Fixed Inductors - AL0307 Series
Product Overview
The AL0307 Series Axial Fixed Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for RF choke applications. These inductors feature an epoxy resin coating for enhanced humidity resistance and longevity. Their compact, lightweight design, wide inductance range, high Q factor, and high self-resonant frequencies make them suitable for various electronic products. They are available in tape packaging for automated insertion and comply with RoHS, Halogen Free, and REACH standards. Applications include televisions, personal computers, radios, telephones, chargers, and fast-charge devices.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: AL0307 Series
- Product Type: Axial Fixed Inductors
- Coating: Epoxy resin
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Bulk Package (B), Tape Packaging (TF)
Technical Specifications
Environmental Data:
- Operating Temperature: -25 to +85 (Including coils self-temperature rise)
Dimensions:
| Part No | External Dimensions (LH) (mm) | Diameter () (mm) | Length (B) (mm) | Lead Diameter () (mm) |
|---|---|---|---|---|
| AL0307 | 3.27.62 | 3.0 / 3.2 Max | 7.62 Max | 0.50 0.10 |
Product Identification:
Format: AL 0307 [Inductance] [Tolerance] [Packing]
- Series Type: AL (Axial Fixed Inductors)
- Outer Dimensions: 0307 (3.27.62 mm)
- Inductance: e.g., 100 (10 uH)
- Inductance Tolerance: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: B (Bulk Package), TF (Tape)
Electrical Characteristics:
| Part No | Inductance (H) | Tole. | Q Min | Test Freq. (MHz) | SRF Min (MHz) | DCR Max () | Rated Current Max (mA) |
|---|---|---|---|---|---|---|---|
| AL0307-1R0M | 1.0 | 20% | 40 | 25.2 | 150 | 0.15 | 740 |
| AL0307-1R2M | 1.2 | 20% | 40 | 7.96 | 150 | 0.18 | 740 |
| AL0307-1R5M | 1.5 | 20% | 40 | 7.96 | 150 | 0.20 | 700 |
| AL0307-1R8M | 1.8 | 20% | 50 | 7.96 | 125 | 0.23 | 655 |
| AL0307-2R2M | 2.2 | 20% | 50 | 7.96 | 110 | 0.27 | 630 |
| AL0307-2R7M | 2.7 | 20% | 50 | 7.96 | 95 | 0.28 | 595 |
| AL0307-3R3M | 3.3 | 20% | 50 | 7.96 | 70 | 0.30 | 575 |
| AL0307-3R9M | 3.9 | 20% | 50 | 7.96 | 65 | 0.32 | 555 |
| AL0307-4R7M | 4.7 | 20% | 50 | 7.96 | 36 | 0.35 | 530 |
| AL0307-5R6M | 5.6 | 20% | 50 | 7.96 | 32 | 0.40 | 500 |
| AL0307-6R8M | 6.8 | 20% | 50 | 7.96 | 28 | 0.48 | 470 |
| AL0307-8R2M | 8.2 | 20% | 50 | 7.96 | 23 | 0.56 | 425 |
| AL0307-100K | 10 | 10% | 50 | 7.96 | 18 | 0.75 | 370 |
| AL0307-120K | 12 | 10% | 50 | 2.52 | 17 | 0.80 | 350 |
| AL0307-150K | 15 | 10% | 50 | 2.52 | 16 | 0.93 | 335 |
| AL0307-180K | 18 | 10% | 50 | 2.52 | 15 | 1.00 | 315 |
| AL0307-220K | 22 | 10% | 50 | 2.52 | 13 | 1.20 | 285 |
| AL0307-270K | 27 | 10% | 50 | 2.52 | 11 | 1.80 | 270 |
| AL0307-330K | 33 | 10% | 50 | 2.52 | 10 | 2.20 | 255 |
| AL0307-390K | 39 | 10% | 50 | 2.52 | 9.5 | 2.30 | 240 |
| AL0307-470K | 47 | 10% | 50 | 2.52 | 8.5 | 2.60 | 205 |
| AL0307-560K | 56 | 10% | 50 | 2.52 | 7.5 | 2.90 | 195 |
| AL0307-680K | 68 | 10% | 50 | 2.52 | 6.5 | 3.30 | 185 |
| AL0307-820K | 82 | 10% | 50 | 2.52 | 6.0 | 3.80 | 175 |
| AL0307-101K | 100 | 10% | 50 | 2.52 | 5.5 | 4.20 | 165 |
| AL0307-121K | 120 | 10% | 50 | 0.796 | 5.4 | 4.70 | 160 |
| AL0307-151K | 150 | 10% | 50 | 0.796 | 4.7 | 5.40 | 150 |
| AL0307-181K | 180 | 10% | 50 | 0.796 | 4.3 | 6.00 | 140 |
| AL0307-221K | 220 | 10% | 60 | 0.796 | 4.0 | 7.00 | 130 |
| AL0307-271K | 270 | 10% | 60 | 0.796 | 3.7 | 7.70 | 120 |
| AL0307-331K | 330 | 10% | 60 | 0.796 | 3.4 | 11.1 | 100 |
| AL0307-391K | 390 | 10% | 60 | 0.796 | 2.8 | 12.6 | 95 |
| AL0307-471K | 470 | 10% | 60 | 0.796 | 2.5 | 14.0 | 90 |
| AL0307-561K | 560 | 10% | 60 | 0.796 | 2.3 | 15.5 | 85 |
| AL0307-681K | 680 | 10% | 60 | 0.796 | 2.0 | 25.3 | 75 |
| AL0307-821K | 820 | 10% | 60 | 0.796 | 1.5 | 27.5 | 65 |
| AL0307-102K | 1000 | 10% | 50 | 0.796 | 1.2 | 31.4 | 60 |
Current Definitions:
- Saturation Current (Isat): The current at which inductance drops by 10% from its initial value (Ta=25).
- Temperature Rise Current (Irms): The DC current that causes a temperature rise of T 40 (Ta=25).
- Rated DC Current: The lower value between Isat and Irms.
Packaging Specifications:
| Series Type | Packaging | Quantity (pcs) | Carton Size (mm) (LWH) | Parts/Box | Parts/Reel | Parts/Carton |
|---|---|---|---|---|---|---|
| T5A | Tape and reel | 3000 | 440275392 | - | - | 72,000 |
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT/DIP) | Meet requirements without any loose terminal. | Refer to GB/T 2423.60-2008 for SMT; refer to JIS C 5321:1997 for DIP. Specific forces and durations vary by terminal size. |
| Resistance to Flexure | No visible mechanical damage. | Refer to JIS C 5321:1997. Flexure: 2mm. Speed: 0.5mm/s. Keep time: 30s. |
| Dropping | No case deformation or change in appearance. No short and no open. | Refer to GB/T 2423.7-2018. Packaged products dropped from 1m high, 3 angles, 3 ridges, 6 surfaces, twice each direction. |
| Solderability | Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. | Refer to GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3s. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | Inductance change: Within 10%. Q factor change: Within 20%. No visible mechanical damage. | Refer to GB/T 2423.10-2019. Simple harmonic motion, 10-55 Hz, 1.5mm amplitude, 2 hours per direction (total 6 hours). |
| Thermal Shock | Inductance change: Within 10%. Q factor change: Within 20%. No visible mechanical damage. | Refer to GB/T 2423.22-2012 Method Na. 100 cycles of temperature change between (85~125) and (-55~40). Transforming interval: Max. 20s. |
| Low temperature Storage | Inductance change: Within 10%. Q factor change: Within 20%. No visible mechanical damage. | Refer to GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | Inductance change: Within 10%. Q factor change: Within 20%. No visible mechanical damage. | Refer to GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | Inductance change: Within 10%. Q factor change: Within 20%. No visible mechanical damage. | Refer to GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. No significant defALts in appearance. | Refer to GJB 360B-2009. Peak temperature: 260+0/-5. Performed twice. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Refer to IAL 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. | Refer to JIS C5311-6.13. Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During test: no breakdown. Characteristics normal after test. | Refer to MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. |
Recommended Lead-free Wave Soldering Curve (DIP-Type):
Note: The recommended curve is a reference. Adjust and confirm based on user's environment and equipment.
Soldering Iron (Rework):
- Hand soldering: Max 350 degrees, not exceeding 3 times.
- Avoid direct contact with the inductor body and wire.
- Hand soldering is not recommended.
Reminders for Using These Products:
- Storage: Within 12 months. Conditions: 5~40C, 35~65% RH. Terminal solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle carefully to prevent damage from dropping.
- Terminals: Do not bend terminals excessively to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetism: Keep away from magnets or magnetic objects.
- Preheating: Preheat before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Correction: Perform within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-heating: Account for self-heating when designing for thermal management.
- Non-magnetic Shield Type: Careful PCB layout is required to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina