Molding SMD Power Inductors LanTu Micro SMS0518-R47M Ultra High Current Low DC Resistance Inductor
Molding SMD Power Inductors
Product Overview
SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. presents the SMS0518 Series Ultra-high current SMD power inductors. These thin-profile inductors feature low DC resistance and ultra-high current capabilities, making them suitable for high-density installations due to their magnetic shielding and strong anti-electromagnetic interference. The integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Designed for high efficiency, these inductors operate at frequencies up to 3MHz and are compliant with RoHS, Halogen Free, and REACH standards. They are ideal for applications such as PDA, notebooks, desktop and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS0518
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
General Specifications
| Item | Specification |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Frequency Range | Up to 3MHz |
| Absolute Maximum Voltage | 30VDC |
| Inductance Tolerance | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Packing | Bulk Package (B), Tape & Reel (T) |
Electrical Characteristics (Electrical specifications at 25)
| Part No | Inductance (H) | Inductance @0A Tol | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|
| SMS0518-R33M | 0.33 | 20% | 6.0 | 17.0 | 12.0 |
| SMS0518-R47M | 0.47 | 20% | 7.7 | 15.5 | 10.5 |
| SMS0518-R56M | 0.56 | 20% | 8.0 | 15.0 | 9.5 |
| SMS0518-R68M | 0.68 | 20% | 10.0 | 12.0 | 9.0 |
| SMS0518-1R0M | 1.00 | 20% | 15.0 | 9.0 | 8.0 |
| SMS0518-1R5M | 1.50 | 20% | 21.0 | 9.0 | 7.5 |
| SMS0518-2R2M | 2.20 | 20% | 30.0 | 6.5 | 5.0 |
| SMS0518-3R3M | 3.30 | 20% | 52.0 | 5.0 | 4.5 |
| SMS0518-4R7M | 4.70 | 20% | 78.0 | 4.0 | 3.5 |
| SMS0518-6R8M | 6.80 | 20% | 107.0 | 3.4 | 2.8 |
| SMS0518-100M | 10.00 | 20% | 140.0 | 3.0 | 2.5 |
| SMS0518-150M | 15.00 | 20% | 240.0 | 2.2 | 1.8 |
Shape and Dimensions (dimensions are in mm)
| Part No | A | B | C | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS0518 | 5.500.30 | 5.200.20 | 1.80Max | 2.30 | 1.20 | 3.00 | 7.00 | 2.50 |
Product Identification Example: SMS 0518 4R7 M T
- : Type (SMS), Series (0518), Inductance Value (4R7 = 4.7 uH)
- : Inductance Tolerance (M = 20%)
- : Packing (T = Tape & Reel)
Packaging - Tape and Reel Specifications
| Part No | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0518 | 12.0 | 8.0 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Reliability Testing Summary
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength | Meet requirements without any loose terminal | Pulling test, Solder paste thickness: 0.12mm, Force applied gradually |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation or change in appearance, No short and no open | Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction |
| Solderability | Wetting shall exceed 75% coverage, Terminals must have 95% minimum solder coverage | Solder temperature: 2402, Duration: 3 sec |
| Vibration | No visible mechanical damage, Inductance change: Within 10%, Q factor change: Within 20% | Frequency 10-55 Hz, Total amplitude 1.5mm, Applied for 2 hours in 3 perpendicular directions |
| Thermal Shock | No visible mechanical damage, Inductance change: Within 10%, Q factor change: Within 20% | 100 cycles of temperature shock between -55~40 and 85~125 |
| Low temperature Storage | No visible mechanical damage, Inductance change: Within 10%, Q factor change: Within 20% | Temperature: -55~-402, Duration: 962 hours |
| High temperature Storage | No visible mechanical damage, Inductance change: Within 10%, Q factor change: Within 20% | Temperature: 85~1252, Duration: 962 hours |
| Damp Heat (Steady States) | No visible mechanical damage, Inductance change: Within 10%, Q factor change: Within 20% | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours |
| Heat endurance of Reflow soldering | No significant defects in appearance, L/L10%, Q/Q30%, DCR/DCR10% | Refer to reflow curve, Peak temperature: 260+0/-5, Performed twice |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times |
| Overload test | During the test no smoke, no peculiar smell, no fire; Characteristics normal after test | Apply twice rated current for 5 minutes |
| Voltage resistance test | During the test no breakdown; Characteristics normal after test | DC1000V, Current: 1mA, Time: 1Min |
Recommended reflow soldering curve
The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm according to their environment/equipment.
Reminders for Using These Products
- Storage period is within 12 months under conditions (temperature: 5~40C, humidity: 35-65% RH or less).
- Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions; overheating may cause issues.
- Allow sufficient thermal design margin for self-heating when power is ON.
- For non-magnetic shield types, careful layout is needed to prevent malfunctions due to magnetic interference.
Get in Touch
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