molding SMD power inductors LanTu Micro SMS1040 220MT with magnetic shielding and low DC resistance
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Product Description
Molding SMD Power Inductors - SMS1040 Series
Product Overview
The SMS1040 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors with a thin design, low DC resistance, and excellent current handling capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors are ideal for high-density installations. Their integral construction ensures high reliability and superior vibration resistance, while the composite structure minimizes buzz noise. These inductors are designed for high efficiency with low loss alloy powder die-casting, resulting in low impedance and small parasitic capacitance. They operate at frequencies up to 3MHz and have an absolute maximum voltage of 30VDC, complying with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS1040
- Certifications: RoHS, Halogen Free, REACH Compliance
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Technical Specifications
Environmental Data:
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
Test Equipment:
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification:
- Format: SMS 1040 470 M T
- Type: SMS (Molding SMD Power Inductor)
- Inductance: e.g., 470 (47 uH)
- Tolerance: M (20%)
- Dimensions (LWH): 1040 (11.510.04.0 mm)
- Packaging: T (Tape & Reel)
Electrical Characteristics (Electrical specifications at 25):
| Part No. | Inductance (H) @100KHz, 1.0V | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|---|
| SMS1040-R22M | 0.22 | 20% | 1.2 | 1.5 | 60.00 | 35.00 |
| SMS1040-R36M | 0.36 | 20% | 1.7 | 1.9 | 50.00 | 30.00 |
| SMS1040-R47M | 0.47 | 20% | 1.9 | 2.2 | 40.00 | 30.00 |
| SMS1040-R56M | 0.56 | 20% | 2.1 | 2.4 | 33.00 | 25.00 |
| SMS1040-R68M | 0.68 | 20% | 2.3 | 3.0 | 30.00 | 23.00 |
| SMS1040-1R0M | 1.0 | 20% | 3.0 | 4.0 | 28.00 | 18.00 |
| SMS1040-1R5M | 1.5 | 20% | 4.8 | 5.4 | 23.00 | 16.00 |
| SMS1040-2R2M | 2.2 | 20% | 7.2 | 9.0 | 18.00 | 12.00 |
| SMS1040-3R3M | 3.3 | 20% | 10.8 | 11.8 | 16.00 | 10.00 |
| SMS1040-4R7M | 4.7 | 20% | 17.0 | 20.0 | 15.00 | 8.50 |
| SMS1040-5R6M | 5.6 | 20% | 20.5 | 23.0 | 13.00 | 8.00 |
| SMS1040-6R8M | 6.8 | 20% | 22.5 | 25.0 | 12.00 | 7.00 |
| SMS1040-100M | 10 | 20% | 34.0 | 37.0 | 8.50 | 5.50 |
| SMS1040-150M | 15 | 20% | 50.0 | 55.0 | 7.00 | 5.00 |
| SMS1040-220M | 22 | 20% | 60.0 | 66.0 | 6.00 | 4.00 |
| SMS1040-330M | 33 | 20% | 85.0 | 92.0 | 5.00 | 3.50 |
| SMS1040-470M | 47 | 20% | 141.0 | 155.0 | 4.50 | 3.00 |
| SMS1040-680M | 68 | 20% | 200.0 | 220.0 | 3.80 | 2.30 |
| SMS1040-101M | 100 | 20% | 237.0 | 290.0 | 3.00 | 2.00 |
Notes on Current Ratings:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
- Special Reminder: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Shape and Dimensions (dimensions are in mm):
| Part No. | A (Max) | B (0.30) | C (Max) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS1040 | 11.50 | 10.00 | 4.00 | 3.00 | 2.00 | 4.10 | 13.60 | 5.40 |
Inductance Tolerance Codes:
- J: 5%
- K: 10%
- L: 15%
- M: 20%
- P: 25%
- N: 30%
Packaging:
- Bulk Package
- Tape & Reel
Tape and Reel Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS1040 | 24.0 | 16.0 | 11.5 | 24.4 | 100 | 13 | 330 | 1000 | 2000 | 8000 |
Cover tape peel off condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Packing quantity: REEL 13 PE Bag
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test: A8mm2 force5N time:30sec; 8mm2 |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Terminal diameter(d) mm: 0.35d0.50 Applied force:5N Duration: 10sec; 0.50d0.80 Applied force:10N Duration: 10sec; 0.80d1.25 Applied force:20N Duration: 10sec; D1.25 Applied force:40N Duration: 10sec. Pull Force: applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig (glass epoxy board). Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to testing jig. Subject to simple harmonic motion, amplitude 1.5mm, frequency 10 to 55 Hz (traversed in approx. 1 min). Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Start at (85~125) for T time, rush to (-55~40) for T time as one cycle, go through 100 cycles. Transforming interval: Max. 20 sec. Stabilized at normal condition for 1~2 hours. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then drying at room temp for 5Min, brushing 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics are normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristics are normal after test. | For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. |
Recommended reflow soldering curve:
The recommended reflow conditions are set according to our soldering equipment. Due to various manufacturers' equipment, products, process conditions, and setting methods, please adjust and confirm according to user's environment/equipment when setting reflow conditions.
Reminders for Using These Products:
- Storage: Within 12 months. Conditions: Temperature 5~40C, Humidity 35~65% RH or less. Solderability of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid touching electrodes directly with bare hands due to oil secretions that may inhibit soldering. Handle products carefully to prevent damage from dropping or inappropriate removal.
- Terminals: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
- Magnetism: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
- Self-heating: Self-heating (temperature increase) occurs when power is ON; ensure sufficient thermal design margin.
- Layout (Non-magnetic shield type): Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina