Product Overview

The SDRH104R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high saturation current and low DCR, featuring a close magnetic circuit design to minimize leakage. Their high-accuracy dimensions ensure suitability for automatic mounting, and they are available in various package sizes and inductance ranges. These inductors comply with RoHS, Halogen Free, and REACH standards, making them ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

• Brand: LANTU MICRO ELECTRIC
• Series: SDRH104R
• Type: Shielded SMD Power Inductors
• Certifications: RoHS, Halogen Free, REACH Compliance
• Origin: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.

Technical Specifications

Environmental Data

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment

• Inductance (L): HP4284A or HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification

Format: SDRH 104R [Inductance] [Tolerance] [Packing]

• Type: SDRH (Shielded SMD Power Inductors)
• Outer Dimensions: 104R (10.310.34.0 mm)
• Inductance: e.g., 100 = 10 H
• Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
• Packing: T (Tape & Reel), B (Bulk Package)

Shape and Dimensions

External Dimensions (LWH): 10.3 Max 10.5 Max 4.0 Max (mm)

Recommended Land Pattern Dimensions (mm): A=7.7, B=3.0, C=1.2, D=3.6, E=1.7, F=7.3

Packaging

Tape and Reel Specifications:

• Tape Dimension W: 24 mm
• Tape Dimension P: 16 mm
• Tape Dimension W1: 11.5 mm
• Reel Dimension (Diameter): 24.4 mm
• Reel Dimension (Hub Diameter): 60 mm
• Reel Dimension (Center Hole): 13 mm
• Reel Quantity (PCS): 1000
• Inside Box Quantity (PCS): 2000
• Outside Carton Quantity (PCS): 8000

Cover tape peel off condition:

• Cover tape peel force: 10 to 120g
• Noodle strip peeling angle: 165 to 180

Reliability Testing

Terminal Strength: Tested according to GB/T 2423.60-2008 for SMT and DIP, with specified forces and durations based on terminal size/diameter.

Resistance to Flexure: Tested according to JIS C 5321:1997. Requires no visible mechanical damage, with specified flexure (2mm) and speed (0.5mm/sec).

Dropping: Tested according to GB/T 2423.7-2018. Packaged products dropped from 1m high onto 6 surfaces, 3 ridges, and 1 angle, twice in each direction. Requires no case deformation or change in appearance, and no short/open circuits.

Solderability: Tested according to GB/T 2423.28-2005. Requires wetting exceeding 75% coverage and 95% minimum solder coverage on terminals at 2402 for 3 sec.

Vibration: Tested according to GB/T 2423.10-2019. Subjected to simple harmonic motion (10-55 Hz, 1.5mm amplitude) for 2 hours in 3 perpendicular directions. Requires no visible mechanical damage, with inductance change within 10% and Q factor change within 20%.

Thermal Shock: Tested according to GB/T 2423.22-2012 Method Na. 100 cycles of temperature changes between -55~40 and 85~125. Requires no visible mechanical damage, with inductance change within 10% (or 30% for Mn-Zn) and Q factor change within 20%.

Low Temperature Storage: Tested according to GB/T 2423.1-2008 Method Ab. Stored at -55~-402 for 962 hours. Requires no visible mechanical damage, with inductance change within 10% (or 30% for Mn-Zn) and Q factor change within 20%.

High Temperature Storage: Tested according to GB/T 2423.2-2008 Method Bb. Stored at 125~852 for 962 hours. Requires no visible mechanical damage, with inductance change within 10% (or 30% for Mn-Zn) and Q factor change within 20%.

Damp Heat (Steady States): Tested according to GB/T 2423.3-2016. Held at 602 and 90%-95% RH for 962 hours. Requires no visible mechanical damage, with inductance change within 10% (or 30% for Mn-Zn) and Q factor change within 20%.

Heat endurance of Reflow soldering: Tested according to GJB 360B-2009. Subjected to reflow soldering twice with peak temperature 260+0/-5. Requires no significant defects in appearance, L/L10% (or 30% for Mn-Zn), Q/Q30%, and DCR/DCR10%.

Resistance to solvent test: Tested according to IEC 68-2-45:1993. Dipped in IPA solvent for 50.5 min, dried for 5 min, and brushed 10 times. Requires no case deformation, change in appearance, or obliteration of marking.

Overload test: Tested according to JIS C5311-6.13. Applied twice the rated current for 5 minutes. Requires no smoke, peculiar smell, or fire, and normal characteristics after test.

Voltage resistance test: Tested according to MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. Requires no breakdown during test and normal characteristics after test.

Recommended Reflow Soldering Curve

Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm conditions based on their specific equipment and environment.

Reminders for Using These Products

• Storage: Within 12 months, at 5~40C and 35~65% RH. Extended storage may degrade terminal solderability.
• Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali).
• Handling: Avoid direct contact with terminals to prevent contamination that inhibits soldering. Handle carefully to prevent damage from dropping.
• Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
• Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Do not expose products to magnets or magnetic fields.
• Preheating: Preheat components before soldering; ensure the temperature difference between solder and chip temperature does not exceed 150C.
• Soldering Corrections: Post-mounting soldering corrections should be within specified conditions to avoid short circuits, performance degradation, or reduced lifespan due to overheating.
• Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
• Layout (Non-shielded): For non-magnetic shielded types, careful coil placement on the PCB is required to prevent malfunctions due to magnetic interference.