Space Magnetic Resin Shielded Power Inductor LanTu Micro SNR4020-4R7MT with Strong EMI Resistance Features
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Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SNR4020 Series are automatic assembly, magnetic resin shielded SMD power inductors designed to minimize buzz noise to ultra-low levels. These inductors feature a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, large current capacity with low DC resistance, and metallization on the ferrite core for excellent shock resistance and durability. They are space-saving and power-efficient, suitable for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, automotive products, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR4020
- Construction: Magnetic-resin shielded, automatic assembly
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|---|
| SNR4020-R47M | 0.47 | 20% | 0.022 | 0.029 | 7.00 | 3.30 | 4.04.02.0 |
| SNR4020-1R0M | 1.0 | 20% | 0.029 | 0.038 | 4.78 | 2.15 | 4.04.02.0 |
| SNR4020-1R5M | 1.5 | 20% | 0.035 | 0.045 | 4.45 | 2.15 | 4.04.02.0 |
| SNR4020-2R2M | 2.2 | 20% | 0.035 | 0.046 | 3.40 | 1.85 | 4.04.02.0 |
| SNR4020-3R3M | 3.3 | 20% | 0.070 | 0.091 | 3.20 | 1.40 | 4.04.02.0 |
| SNR4020-4R7M | 4.7 | 20% | 0.075 | 0.098 | 2.35 | 1.34 | 4.04.02.0 |
| SNR4020-6R8M | 6.8 | 20% | 0.125 | 0.163 | 2.20 | 1.04 | 4.04.02.0 |
| SNR4020-8R2M | 8.2 | 20% | 0.148 | 0.185 | 1.75 | 1.00 | 4.04.02.0 |
| SNR4020-100M | 10 | 20% | 0.165 | 0.215 | 1.60 | 0.90 | 4.04.02.0 |
| SNR4020-150M | 15 | 20% | 0.230 | 0.300 | 1.35 | 0.77 | 4.04.02.0 |
| SNR4020-220M | 22 | 20% | 0.350 | 0.455 | 1.05 | 0.62 | 4.04.02.0 |
| SNR4020-330M | 33 | 20% | 0.550 | 0.710 | 0.85 | 0.49 | 4.04.02.0 |
| SNR4020-470M | 47 | 20% | 0.710 | 0.920 | 0.74 | 0.44 | 4.04.02.0 |
| SNR4020-680M | 68 | 20% | 1.060 | 1.380 | 0.60 | 0.36 | 4.04.02.0 |
| Inductance Tolerance Options | Packing Options |
|---|---|
| J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | B: Bulk Package, T: Tape & Reel |
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment
- Inductance (L): HP4284A, HP4285A or equivalent LCR meter
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test based on GB/T 2423.60-2008 |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Pulling test based on GB/T 2423.60-2008 |
| Resistance to Flexure | No visible mechanical damage | JIS C 5321:1997, Flexure: 2mm |
| Dropping | No case deformation or change in appearance; No short and no open | GB/T 2423.7-2018, 1m high drop test |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage | GB/T 2423.28-2005, Solder temperature: 2402, Duration: 3 sec |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | GB/T 2423.10-2019, 10-55 Hz, 2 hours in 3 directions |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | GB/T 2423.22-2012 Method Na, 100 cycles |
| Low temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | GB/T 2423.1-2008 Method Ab, -402, 962 hours |
| High temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | GB/T 2423.2-2008 Method Bb, 852, 962 hours |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | GB/T 2423.3-2016, 602, 90% to 95% RH, 962 hours |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10% | GJB 360B-2009, Peak temperature: 260+0/-5 |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | IEC 68-2-45:1993, IPA solvent dip test |
| Overload test | During the test no smoke, no peculiar smell, no fire; The characteristic is normal after test | JIS C5311-6.13, Apply twice rated current for 5 minutes |
| Voltage resistance test | During the test no breakdown; The characteristic is normal after test | MIL-STD-202G Method 301, DC1000V, Current: 1mA, Time: 1Min |
Recommended Reflow Soldering Curve
The recommended reflow conditions are provided as a guideline. Users should adjust and confirm these conditions based on their specific equipment, process, and environment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals with bare hands due to potential solderability issues. Handle carefully to prevent damage.
- Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Keep away from magnets or magnetic objects.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
- Thermal Design: Account for self-heating when power is applied.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina