Molding SMD Power Inductors LanTu Micro SMS0420-100MT with ultra high current and low DC resistance
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Product Description
Molding SMD Power Inductors - SMS0420 Series
Product Overview
The SMS0420 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors designed for thin profiles with low DC resistance. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors are ideal for high-density installations. Their integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. These inductors are manufactured using low-loss alloy powder for die-casting, resulting in low impedance and small parasitic capacitance, leading to high efficiency. They are suitable for frequencies up to 3MHz and have an absolute maximum voltage of 30VDC. The series complies with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS0420
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: China (implied by company location)
Technical Specifications
General Features
| Feature | Description |
|---|---|
| Design | Thin design with low DC resistance and ultra-high current capability |
| Shielding | Magnetic shielding for strong anti-electromagnetic interference, suitable for high-density installation |
| Construction | Integral construction for high reliability and excellent vibration resistance |
| Noise | Ultra-low buzz noise due to composite construction |
| Material | Low-loss alloy powder die-casting |
| Impedance & Capacitance | Low impedance, small parasitic capacitance |
| Efficiency | High efficiency, reduced winding DC resistance and core eddy-current loss |
| Frequency Range | Up to 3MHz |
| Max Voltage | 30VDC |
| Operating Temperature | -55 to +125 (including coil self-temperature rise) |
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Test Equipment
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification
SMS 0420 - [Inductance] M T
- SMS0420: Series Name
- Inductance: e.g., 100 (10 uH)
- M: Tolerance (M: 20%)
- T: Packing Type (T: Tape & Reel)
Dimensions
| Part No. | External Dimensions (LWH) (mm) | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|---|
| SMS0420 | 4.64.22.0 | 4.600.30 | 4.200.20 | 2.00Max | 1.50Typ | 0.80 Typ | 2.20 | 5.20 | 2.50 |
Electrical Characteristics
| Part No. | Inductance (H) @ 100KHz, 1.0V | Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|
| SMS0420-R10M | 0.10 | 20% | 3.5 | 25.00 | 13.00 |
| SMS0420-R22M | 0.22 | 20% | 6.0 | 13.00 | 9.50 |
| SMS0420-R33M | 0.33 | 20% | 8.0 | 11.00 | 7.00 |
| SMS0420-R47M | 0.47 | 20% | 12.0 | 9.50 | 8.00 |
| SMS0420-R56M | 0.56 | 20% | 14.0 | 9.00 | 7.00 |
| SMS0420-R68M | 0.68 | 20% | 18.0 | 8.00 | 7.00 |
| SMS0420-1R0M | 1.0 | 20% | 24.0 | 7.00 | 6.00 |
| SMS0420-1R2M | 1.2 | 20% | 25.0 | 6.00 | 5.50 |
| SMS0420-1R5M | 1.5 | 20% | 40.0 | 5.50 | 5.00 |
| SMS0420-2R2M | 2.2 | 20% | 52.0 | 5.00 | 4.50 |
| SMS0420-3R3M | 3.3 | 20% | 70.0 | 4.00 | 3.50 |
| SMS0420-4R7M | 4.7 | 20% | 105.0 | 3.00 | 2.80 |
| SMS0420-6R8M | 6.8 | 20% | 120.0 | 2.50 | 2.40 |
| SMS0420-100M | 10 | 20% | 220.0 | 2.00 | 1.60 |
| SMS0420-150M | 15 | 20% | 280.0 | 1.90 | 1.40 |
| SMS0420-220M | 22 | 20% | 450.0 | 1.50 | 1.20 |
Definitions
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
Inductance Tolerance Options
| Code | Tolerance |
|---|---|
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Packing Options
| Code | Type |
|---|---|
| B | Bulk Package |
| T | Tape & Reel |
Packaging Specifications (Tape & Reel)
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel Quantity (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0420 | 12.0 | 8.0 | 5.5 | 12.4 | 100 | 13 | 330 | 3000 | 12,000 | 48,000 |
Cover Tape Peel Off Condition
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test (force varies by terminal area), Solder paste thickness: 0.12mm |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Pulling test (force varies by terminal diameter) |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency 10-55 Hz, amplitude 1.5mm, 2 hours in 3 perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402, Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852, Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Reflow for twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, at 5~40C and 35~65% RH. Solderability may deteriorate if storage period elapses.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting soldering. Handle products carefully to prevent damage from dropping or improper removal.
- Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetism: Do not expose products to magnets or magnetic fields.
- Preheating: Ensure preheating before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform after mounting within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for self-heating (temperature increase) when power is ON.
- Layout (Non-magnetic Shield Type): Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina