Molding SMD Power Inductors LanTu Micro SMS1770-220MT Ultra High Current Low DC Resistance Components
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Product Description
Molding SMD Power Inductors - SMS1770 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1770 Series offers ultra-high current SMD power inductors designed for high-density installations. These inductors feature a thin profile with low DC resistance and ultra-high current capabilities. Their magnetic shielding provides strong anti-electromagnetic interference, while the integral construction ensures high reliability and excellent vibration resistance. The composite structure minimizes buzz noise, and the low-loss alloy powder die-casting results in low impedance and small parasitic capacitance, contributing to high efficiency and reduced core eddy-current loss. These inductors operate at frequencies up to 3MHz and are compliant with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS1770
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Technical Specifications
General Specifications:
| Specification | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Absolute Maximum Voltage | 30VDC |
| Frequency | Up to 3MHz |
Product Identification:
| Component | Description |
|---|---|
| SMS | Molding SMD Power Inductor |
| 1770 | External Dimensions (LWH) (mm): 17.5017.157.50 |
| Inductance Value | e.g., 10 uH |
| Tolerance Code | M: 20% (Others: J:5%, K: 10%, L: 15%, P: 25%, N: 30%) |
| Packing Code | B: Bulk Package, TF: Tape & Reel |
Shape and Dimensions:
| Part No | A (mm) | B (mm) | C (mm) | D (Typ) | E (Typ) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|
| SMS1770 | 17.50.50 | 17.150.30 | 7.50 Max | 12.0 | 2.50 | 12.4 | 19.5 | 12.5 |
Electrical Characteristics: (Electrical specifications at 25)
| Part No | Inductance L(H) '@0A | Tol | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical (Isat) | Heat Rating Current (A) Typical (Irms) |
|---|---|---|---|---|---|---|
| SMS1770-R22M | 0.22 | 20% | 0.63 | 0.75 | 75.00 | 57.00 |
| SMS1770-R47M | 0.47 | 20% | 0.90 | 1.03 | 72.00 | 55.00 |
| SMS1770-1R0M | 1.0 | 20% | 1.60 | 2.30 | 55.00 | 32.00 |
| SMS1770-1R5M | 1.5 | 20% | 1.78 | 2.50 | 48.00 | 31.00 |
| SMS1770-2R2M | 2.2 | 20% | 2.40 | 2.70 | 34.00 | 29.00 |
| SMS1770-3R3M | 3.3 | 20% | 3.68 | 4.20 | 30.00 | 24.00 |
| SMS1770-4R7M | 4.7 | 20% | 4.84 | 5.50 | 24.00 | 21.00 |
| SMS1770-5R6M | 5.6 | 20% | 6.68 | 7.60 | 23.00 | 20.00 |
| SMS1770-6R8M | 6.8 | 20% | 8.40 | 9.20 | 22.00 | 17.00 |
| SMS1770-8R2M | 8.2 | 20% | 10.10 | 11.60 | 20.00 | 13.00 |
| SMS1770-100M | 10 | 20% | 11.60 | 13.00 | 19.00 | 12.00 |
| SMS1770-150M | 15 | 20% | 18.80 | 20.50 | 14.50 | 11.00 |
| SMS1770-220M | 22 | 20% | 25.10 | 26.50 | 11.50 | 8.50 |
| SMS1770-330M | 33 | 20% | 38.00 | 44.00 | 10.00 | 8.00 |
| SMS1770-470M | 47 | 20% | 48.00 | 55.00 | 7.50 | 6.00 |
| SMS1770-560M | 56 | 20% | 54.00 | 62.00 | 7.00 | 5.50 |
| SMS1770-680M | 68 | 20% | 68.00 | 80.00 | 6.50 | 5.20 |
| SMS1770-101M | 100 | 20% | 110.00 | 118.00 | 5.00 | 3.70 |
Notes on Current Ratings:
- Saturation Current (Isat): DC current at which inductance drops 30% from its value without current.
- Heat Rating Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
- Special Remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Packaging:
| Part No | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS1770 | 32.0 | 24.0 | 14.2 | 32.4 | 100 | 13 | 330 | 300 | 600 | 2400 |
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength | Meet requirements without any loose terminal | Pulling test (SMT/DIP), Solder paste thickness, Applied force based on terminal diameter/area. Duration: 10 sec. Speed: 1.0mm/s. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force in specified direction. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Subject to simple harmonic motion, frequency 10-55 Hz, amplitude 1.5mm. Duration: 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock between high (85~125) and low (-55~40) temperatures. Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve:
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products:
- Storage: Within 12 months, under conditions (Temperature: 5~40C, Humidity: 35~65% RH or less). Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions inhibiting soldering. Handle products carefully to prevent damage from dropping or inappropriate removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Self-heating occurs when power is ON; ensure sufficient thermal design margin.
- Layout (Non-magnetic Shield Type): Carefully lay out coils on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina