Ultra Low AC Losses SMD Power Inductor LanTu Micro SMS252010-1R5MT with T Core Molding and High Reliability
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Product Description
Common Mode Choke - SMS252010 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS252010 Series is an ultra-high current SMD power inductor designed with a thin profile, low DC resistance, and high current capability. Featuring magnetic shielding for strong anti-electromagnetic interference, it is suitable for high-density installations. Its T-core molding structure ensures excellent vibration resistance and high reliability. The series offers extremely low DCR and ultra-low AC losses, making it ideal for high switching frequencies. Applications include DC/DC converters for notebook PC CPUs, mobile phones, tablets, HDDs, DVCs, PDAs, 5G modules, servers, base stations, and various DC-DC conversion power modules.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS252010
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
General Specifications
| Parameter | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coil self-temperature rise) |
| Test Equipment - Inductance (L) | WK3260B LCR meter or equivalent |
| Test Equipment - Saturation Current (Isat) & Heat Rating Current (Irms) | WK3260B+WK3265B or equivalent |
| Test Equipment - DC Resistance (DCR) | Chroma 16502 or equivalent |
Product Identification
Format: SMS 252010 R47 M T
| Component | Description |
|---|---|
| Inductance Value (e.g., R47 = 0.47 uH) | |
| External Dimensions (LWH) (mm) (e.g., 252010 = 2.52.01.0) | |
| Type (SMS = Molding SMD Power Inductor) | |
| Inductance Tolerance (J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%) | |
| Packing (B = Bulk Package, T = Tape & Reel) |
Electrical Characteristics (SMS252010 Series)
| Part No. | Inductance (L) H | Tol. | DCR (m) Typical | DCR (m) Max | Saturation Current (Isat) Typical (A) | Heat Rating Current (Irms) Typical (A) |
|---|---|---|---|---|---|---|
| SMS252010-R22M | 0.22 | 20% | 12.0 | 17.0 | 8.60 | 6.80 |
| SMS252010-R24M | 0.24 | 20% | 12.0 | 17.5 | 8.50 | 6.70 |
| SMS252010-R33M | 0.33 | 20% | 13.0 | 19.0 | 7.60 | 6.50 |
| SMS252010-R47M | 0.47 | 20% | 15.0 | 22.0 | 6.90 | 6.10 |
| SMS252010-R68M | 0.68 | 20% | 23.0 | 27.0 | 5.90 | 5.60 |
| SMS252010-1R0M | 1.0 | 20% | 25.0 | 30.0 | 5.40 | 4.70 |
| SMS252010-1R5M | 1.5 | 20% | 45.0 | 55.0 | 4.30 | 3.40 |
| SMS252010-2R2M | 2.2 | 20% | 62.0 | 70.0 | 3.30 | 2.40 |
| SMS252010-3R3M | 3.3 | 20% | 86.0 | 100.0 | 2.80 | 2.50 |
| SMS252010-4R7M | 4.7 | 20% | 160.0 | 180.0 | 2.60 | 2.00 |
| SMS252010-6R8M | 6.8 | 20% | 270.0 | 320.0 | 2.40 | 1.60 |
| SMS252010-100M | 10 | 20% | 500.0 | 560.0 | 1.55 | 1.05 |
| SMS252010-220M | 22 | 20% | 1100.0 | 1300.0 | 1.10 | 0.85 |
Notes on Currents:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat or Irms.
- Special remind: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Shape and Dimensions
| Part No. | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | H (mm) |
|---|---|---|---|---|---|---|---|
| SMS252010 | 2.500.20 | 2.000.20 | 1.00 Max | 0.90 Typ | 2.80 Typ | 1.00 Typ | 2.10 Typ |
(Dimensions are in mm)
Packaging Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|
| SMS252010 | 8.0 | 4.0 | 3.5 | 3000 | 30,000 | 120,000 |
Reliability Testing Summary
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength | Meet requirements without any loose terminal. | Reference documents: GB/T 2423.60-2008 (SMT & DIP variations) |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Amplitude 1.5mm, frequency 10-55 Hz. Applied for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature extremes. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | GJB 360B-2009. Peak temperature: 260+0/-5. Tested twice. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip into IPA solvent for 50.5Min, drying at room temp for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | JIS C5311-6.13. Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to specific soldering equipment. Users should adjust and confirm according to their environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months. Conditions: Temperature 5~40C, Humidity 35~65% RH or less. Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands as oil secretions may inhibit soldering. Handle products carefully to prevent damage from dropping or inappropriate removal.
- Terminals: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Ensure preheating before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
- Thermal Design: Account for self-heating (temperature increase) when power is ON. Ensure sufficient tolerance for thermal design.
- Layout (Non-magnetic shield type): Carefully lay out the coil on the circuit board design. Malfunctions may occur due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina