Power Inductors LanTu Micro SMS0420-2R2MT Molding SMD Type with High Frequency and Low DC Resistance
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Product Description
Molding SMD Power Inductors - SMS0420 Series
Product Overview
The SMS0420 Series Ultra-high current SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installations requiring low DC resistance and ultra-high current capabilities in a thin profile. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability with an integral construction for excellent vibration resistance. Their composite structure minimizes buzz noise, while the low-loss alloy powder die-casting ensures low impedance and small parasitic capacitance, contributing to high efficiency and reduced core eddy-current loss. These inductors are suitable for frequencies up to 3MHz and have an absolute maximum voltage of 30VDC. They comply with RoHS, Halogen Free, and REACH standards.
Applications:
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Origin: SHENZHEN, CHINA
- Product Type: Molding SMD Power Inductor
- Series: SMS0420
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
Environmental Data
Operating Temperature: -55 to +125 (Including coils self-temperature rise)
Test Equipment
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification
Format: SMS 0420 100 M T
- SMS: Type (Molding SMD Power Inductor)
- 0420: External Dimensions (LWH) in mm (4.64.22.0)
- 100: Inductance value (e.g., 100 = 10 uH)
- M: Inductance Tolerance (M = 20%)
- T: Packing Type (T = Tape & Reel)
Shape and Dimensions
(Dimensions are in mm)
| Part No | A (L) | B (W) | C (H) | D (Typ) | E (Typ) | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|
| SMS0420 | 4.600.30 | 4.200.20 | 2.00Max | 1.50Typ | 0.80 Typ | 2.20 | 5.20 | 2.50 |
Inductance Tolerance
- J: 5%
- K: 10%
- L: 15%
- M: 20%
- P: 25%
- N: 30%
Specifications
(Electrical specifications at 25)
| Part No | Inductance (L) @100KHz, 1.0V (H) | Tol | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|---|
| SMS0420-R10M | 0.10 | 20% | 3.5 | 4.0 | 25.00 | 13.00 |
| SMS0420-R22M | 0.22 | 20% | 6.0 | 6.8 | 13.00 | 9.50 |
| SMS0420-R33M | 0.33 | 20% | 8.0 | 11.0 | 11.00 | 7.00 |
| SMS0420-R47M | 0.47 | 20% | 12.0 | 14.0 | 9.50 | 8.00 |
| SMS0420-R56M | 0.56 | 20% | 14.0 | 16.0 | 9.00 | 7.00 |
| SMS0420-R68M | 0.68 | 20% | 18.0 | 21.0 | 8.00 | 7.00 |
| SMS0420-1R0M | 1.0 | 20% | 24.0 | 27.0 | 7.00 | 6.00 |
| SMS0420-1R2M | 1.2 | 20% | 25.0 | 27.0 | 6.00 | 5.50 |
| SMS0420-1R5M | 1.5 | 20% | 40.0 | 46.0 | 5.50 | 5.00 |
| SMS0420-2R2M | 2.2 | 20% | 52.0 | 58.0 | 5.00 | 4.50 |
| SMS0420-3R3M | 3.3 | 20% | 70.0 | 87.0 | 4.00 | 3.50 |
| SMS0420-4R7M | 4.7 | 20% | 105.0 | 126.0 | 3.00 | 2.80 |
| SMS0420-6R8M | 6.8 | 20% | 120.0 | 135.0 | 2.50 | 2.40 |
| SMS0420-100M | 10 | 20% | 220.0 | 258.0 | 2.00 | 1.60 |
| SMS0420-150M | 15 | 20% | 280.0 | 320.0 | 1.90 | 1.40 |
| SMS0420-220M | 22 | 20% | 450.0 | 510.0 | 1.50 | 1.20 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
Packaging
| Part No | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0420 | 12.0 | 8.0 | 5.5 | 12.4 | 100 | 13 | 330 | 3000 | 12,000 | 48,000 |
Cover Tape Peel Off Condition
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing
| Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet specified pull force requirements without any loose terminal. | Pulling test with defined forces based on terminal cross-sectional area (A). Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet specified pull force requirements without any loose terminal. | Pulling test with defined forces based on terminal diameter (d). Pull Force applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | Inductor soldered to test jig, flexure of 2mm applied. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. No visible mechanical damage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Subjected to simple harmonic motion (10 to 55 Hz, 1.5mm amplitude) for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | Refer to recommended reflow curve, processed twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. | Apply twice the rated current for 5 minutes, repeated twice. |
| Voltage resistance test | During the test no breakdown. Characteristics are normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to our soldering equipment. Users should adjust and confirm according to their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate if the storage period elapses.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that can inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact LANTU MICRO ELECTRIC TECHNOLOGY if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Ensure preheating before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating (temperature increase) when power is ON; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: For non-magnetic shield types, careful coil layout is required on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina