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axial fixed inductors LanTu Micro AL0510-681K with self resonant frequencies and epoxy resin coating

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Product Description

Axial Fixed Inductors - AL0510 Series

Product Overview
The AL0510 Series Axial Fixed Inductors, manufactured by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD., are designed for reliable performance in a wide range of electronic applications. These compact and lightweight RF chokes feature an epoxy resin coating for enhanced humidity resistance and longevity. With a broad inductance range, high Q factors, and self-resonant frequencies, they are suitable for use in televisions, personal computers, radios, telephones, chargers, and other electronic devices. The series offers tape packaging for automated insertion, ensuring efficient manufacturing processes.


Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: AL0510 Series
  • Type: Axial Fixed Inductors
  • Coating: Epoxy resin
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Packaging Options: Tape packaging for auto-insertion, Bulk Package

Technical Specifications

Environmental Data:

  • Operating Temperature: -25 to +85 (Including coils self-temperature rise)

Dimensions:

Part No A (mm) B (mm) C (mm) (mm) L (mm)
AL0510 5.0 Max 11.0 Max 0.600.1 5.0 11.0

Product Identification:

Example: AL 0510 100 K T

  • Type: AL Axial Fixed Inductors
  • Outer Dimensions (LH): 0510 (5.011.0 mm)
  • Inductance: 100 (Represents 10 uH)
  • Inductance Tolerance: K (10%)
  • Packing: T (Tape)

Inductance Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Packing Codes: B: Bulk Package, TF: Tape

Electrical Characteristics: (Electrical specifications at 25)

Part No Inductance (uH) Tolerance Q Min @ Test Freq. (MHz) SRF Min (MHz) DCR Max () Rated Current (mA) Max
AL0510-3R3M 3.3 20% 20 @ 7.96MHz 50 0.18 1100
AL0510-4R7M 4.7 20% 20 @ 7.96MHz 45 0.20 1000
AL0510-6R8M 6.8 20% 20 @ 7.96MHz 45 0.25 790
AL0510-100K 10 10% 15 @ 7.96MHz 30 0.45 750
AL0510-150K 15 10% 15 @ 7.96MHz 30 0.50 650
AL0510-220K 22 10% 30 @ 2.52 MHz 8.0 0.65 500
AL0510-330K 33 10% 30 @ 2.52 MHz 6.0 0.75 400
AL0510-470K 47 10% 30 @ 2.52 MHz 6.3 0.8 370
AL0510-680K 68 10% 30 @ 2.52 MHz 5.0 0.8 350
AL0510-820K 82 10% 20 @ 2.52 MHz 3.8 0.82 330
AL0510-101K 100 10% 20 @ 2.52 MHz 3.5 0.90 300
AL0510-121K 120 10% 20 @ 0.796 MHz 3.3 1.20 250
AL0510-151K 150 10% 20 @ 0.796 MHz 3.2 1.80 225
AL0510-181K 180 10% 20 @ 0.796 MHz 2.8 2.00 200
AL0510-221K 220 10% 30 @ 0.796 MHz 2.6 2.10 180
AL0510-271K 270 10% 30 @ 0.796 MHz 2.4 2.50 170
AL0510-331K 330 10% 30 @ 0.796 MHz 2.2 3.00 160
AL0510-391K 390 10% 30 @ 0.796 MHz 2.0 3.50 150
AL0510-471K 470 10% 30 @ 0.796 MHz 1.9 4.00 140
AL0510-561K 560 10% 30 @ 0.796 MHz 1.8 5.40 130
AL0510-681K 680 10% 40 @ 0.796 MHz 1.5 6.00 120
AL0510-821K 820 10% 50 @ 0.796 MHz 1.2 7.50 110
AL0510-102K 1000 10% 50 @ 0.252 MHz 1.0 8.00 100
AL0510-122K 1200 10% 60 @ 0.252 MHz 0.95 14.50 95
AL0510-152K 1500 10% 60 @ 0.252 MHz 0.9 16.50 90
AL0510-182K 1800 10% 60 @ 0.252 MHz 0.9 19.00 85
AL0510-222K 2200 10% 60 @ 0.252 MHz 0.8 27.50 80
AL0510-272K 2700 10% 60 @ 0.252 MHz 0.75 40.00 75
AL0510-332K 3300 10% 50 @ 0.252 MHz 0.7 50.00 62
AL0510-392K 3900 10% 50 @ 0.252 MHz 0.65 53.00 59
AL0510-472K 4700 10% 50 @ 0.252 MHz 0.6 60.00 55
AL0510-562K 5600 10% 50 @ 0.252 MHz 0.5 64.00 40
AL0510-682K 6800 10% 50 @ 0.252 MHz 0.45 73.00 35
AL0510-822K 8200 10% 30 @ 0.252 MHz 0.4 80.00 30
AL0510-103K 10000 10% 25 @ 79.6 KHz 0.35 132.00 25
AL0510-123K 12000 10% 25 @ 79.6 KHz 0.3 143.00 20
AL0510-153K 15000 10% 25 @ 79.6 KHz 0.25 166.00 18
AL0510-183K 18000 10% 25 @ 79.6 KHz 0.2 185.00 15
AL0510-223K 22000 10% 20 @ 79.6 KHz 0.15 330.00 12
AL0510-273K 27000 10% 20 @ 79.6 KHz 0.1 370.00 10
AL0510-333K 33000 10% 40 @ 79.6 KHz 0.25 240.00 10

Current Definitions:

  • Saturation Current (Isat): The current at which inductance drops by 10% from its initial value (Ta=25).
  • Temperature Rise Current (Irms): The DC current that causes a temperature rise of T 40 (Ta=25).
  • Rated DC Current: The lesser value between Isat and Irms.

Packaging:

Series Type Packaging Quantity (pcs) Carton Size (mm) L x W x H Parts/Box Parts/Reel Parts/Carton
T5A Tape and reel 1000 440 x 275 x 392 24,000 - 24,000

Note: Outside Carton. Insufficient full cartons will be filled with inner boxes or cushioning material.

Reliability Testing:

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal Pulling test: Force based on terminal cross-sectional area (5N to 20N). Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s.
Terminal Strength (DIP) Meet requirements without any loose terminal Applied force based on terminal diameter (5N to 40N). Duration: 10s.
Resistance to Flexure No visible mechanical damage. Flexure: 2mm. Pressurizing Speed: 0.5mm/s. Keep time: 30s.
Dropping No case deformation or change in appearance. No short and no open. Drop packaged products from 1m high, 1 angle, 3 ridges, 6 surfaces, twice in each direction.
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402. Duration: 3s. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Frequency varied between 10 and 55 Hz, applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours).
Thermal Shock No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20s.
Low temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: -55~-402. Duration: 962 hours.
High temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 125~852. Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. Refer to reflow curve, performed twice. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times.
Overload test During test: no smoke, no peculiar smell, no fire. Characteristic is normal after test. Apply twice the rated current for 5 minutes.
Voltage resistance test During test: no breakdown. Characteristic is normal after test. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils)

Recommended Lead-free Wave Soldering Curve (DIP-Type):

Note: The recommended wave soldering is a reference. Adjust and confirm according to user's environment/equipment.

Soldering Iron (Rework):

  • Use soldering iron by hand; times do not exceed 3 times at 350 degrees.
  • Avoid contacting the inductor itself or the wire when soldering.
  • Soldering by soldering iron is not recommended.

Reminders for Using These Products:

  • Storage: Within 12 months. Conditions: Temperature 5~40C, Humidity 35~66% RH. Solderability may deteriorate after storage period.
  • Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle products carefully to prevent damage from dropping or improper removal.
  • Terminals: Do not bend terminals with excessive stress to avoid wire fracture.
  • Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
  • Soldering Correction: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Self-heating: Allow sufficient margin for thermal design due to self-heating when power is ON.
  • Non-magnetic Shield Type: Carefully lay out coils on the circuit board to avoid malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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