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High reliability molding SMD power inductor LanTu Micro SMS1770-6R8MT with magnetic shielding and low DCR

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Product Description

Molding SMD Power Inductors - SMS1770 Series

Product Overview

The LANTU SMS1770 Series is an ultra-high current, thin-profile SMD power inductor designed for high-density installations. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability with an integral construction for excellent vibration resistance. Their composite structure minimizes buzz noise, while the low-loss alloy powder die-casting ensures low impedance and small parasitic capacitance, contributing to high efficiency and reduced core eddy-current loss. With a frequency capability up to 3MHz and an absolute maximum voltage of 30VDC, they are suitable for applications like PDA, notebooks, desktops, servers, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems. These inductors are RoHS, Halogen Free, and REACH compliant.

Product Attributes

  • Brand: LANTU (SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.)
  • Series: SMS1770
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: Shenzhen, China

Technical Specifications

Part No Inductance (H) @0A Tolerance DCR (m) Typical DCR (m) Max Saturation Current (A) Typical Heat Rating Current (A) Typical Dimensions (LWH mm) Operating Temperature (C) Absolute Maximum Voltage (VDC)
SMS1770-R22M 0.22 20% 0.63 0.75 75.00 57.00 17.5017.157.50 -55 to +125 30
SMS1770-R47M 0.47 20% 0.90 1.03 72.00 55.00 17.5017.157.50 -55 to +125 30
SMS1770-1R0M 1.0 20% 1.60 2.30 55.00 32.00 17.5017.157.50 -55 to +125 30
SMS1770-1R5M 1.5 20% 1.78 2.50 48.00 31.00 17.5017.157.50 -55 to +125 30
SMS1770-2R2M 2.2 20% 2.40 2.70 34.00 29.00 17.5017.157.50 -55 to +125 30
SMS1770-3R3M 3.3 20% 3.68 4.20 30.00 24.00 17.5017.157.50 -55 to +125 30
SMS1770-4R7M 4.7 20% 4.84 5.50 24.00 21.00 17.5017.157.50 -55 to +125 30
SMS1770-5R6M 5.6 20% 6.68 7.60 23.00 20.00 17.5017.157.50 -55 to +125 30
SMS1770-6R8M 6.8 20% 8.40 9.20 22.00 17.00 17.5017.157.50 -55 to +125 30
SMS1770-8R2M 8.2 20% 10.10 11.60 20.00 13.00 17.5017.157.50 -55 to +125 30
SMS1770-100M 10 20% 11.60 13.00 19.00 12.00 17.5017.157.50 -55 to +125 30
SMS1770-150M 15 20% 18.80 20.50 14.50 11.00 17.5017.157.50 -55 to +125 30
SMS1770-220M 22 20% 25.10 26.50 11.50 8.50 17.5017.157.50 -55 to +125 30
SMS1770-330M 33 20% 38.00 44.00 10.00 8.00 17.5017.157.50 -55 to +125 30
SMS1770-470M 47 20% 48.00 55.00 7.50 6.00 17.5017.157.50 -55 to +125 30
SMS1770-560M 56 20% 54.00 62.00 7.00 5.50 17.5017.157.50 -55 to +125 30
SMS1770-680M 68 20% 68.00 80.00 6.50 5.20 17.5017.157.50 -55 to +125 30
SMS1770-101M 100 20% 110.00 118.00 5.00 3.70 17.5017.157.50 -55 to +125 30

Inductance Tolerance Codes:

  • J: 5%
  • K: 10%
  • L: 15%
  • M: 20%
  • P: 25%
  • N: 30%

Packaging:

  • Bulk Package
  • Tape & Reel

Test Equipment:

  • Inductance (L): WK3260B LCR meter or equivalent
  • Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Definitions:

  • Saturation Current: DC current at which inductance drops 30% from its value without current.
  • Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value between Isat and Irms.

Recommended Land Pattern (Dimensions in mm):

Part No A B C D E F G H
SMS1770 17.50.50 17.150.30 7.50 Max 12.0 Typ 2.50 Typ 12.4 19.5 12.5

Recommended Reflow Soldering Curve:

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.

Reminders for Using These Products:

  • Storage: Within 12 months, at 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
  • Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oils. Handle carefully to prevent damage from dropping.
  • Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
  • Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheating is required before soldering. Temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Post-mounting soldering corrections should adhere to specifications. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Allow sufficient margin for self-heating when power is applied.
  • Non-Magnetic Shield Type: Careful coil layout is needed to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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