Molding SMD Power Inductor LanTu Micro SMS0850-3R3MT with Ultra High Current and Low DC Resistance
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Product Description
Molding SMD Power Inductors - SMS0850 Series
Product Overview
The SMS0850 Series Ultra-high current SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed with a thin profile, low DC resistance, and ultra-high current capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors are ideal for high-density installations. Their integral construction provides high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Utilizing low-loss alloy powder die-casting, they offer low impedance and small parasitic capacitance, contributing to high efficiency and reduced core eddy-current loss. These inductors support frequencies up to 1-2MHz and have an absolute maximum voltage of 30VDC. They are RoHS, Halogen Free, and REACH compliant.
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0850
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
Environmental Data
| Parameter | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
Dimensions
| Part No. | L (mm) | W (mm) | H (mm) |
|---|---|---|---|
| SMS0850 | 8.5 0.50 | 8.0 0.30 | 5.00 Max |
Recommended Land Pattern
| Part No. | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|
| SMS0850 | 8.5 0.50 | 8.0 0.30 | 5.00 Max | 3.0 0.30 | 1.8 0.30 | 4.5 | 9.5 | 3.5 |
Electrical Characteristics
| Part No. | Inductance (H) | Inductance Tolerance | Frequency | Voltage | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|---|---|
| SMS0850-R56M | 0.56 | 20% | 100KHz, 1.0V | 30VDC | 3.0 | 4.5 | 30.00 |
| SMS0850-R68M | 0.68 | 20% | 100KHz, 1.0V | 30VDC | 3.6 | 6.0 | 25.00 |
| SMS0850-1R0M | 1.0 | 20% | 100KHz, 1.0V | 30VDC | 4.1 | 5.5 | 20.00 |
| SMS0850-1R5M | 1.5 | 20% | 100KHz, 1.0V | 30VDC | 5.0 | 7.0 | 19.00 |
| SMS0850-2R2M | 2.2 | 20% | 100KHz, 1.0V | 30VDC | 8.2 | 12.0 | 16.00 |
| SMS0850-3R3M | 3.3 | 20% | 100KHz, 1.0V | 30VDC | 11.0 | 15.0 | 13.00 |
| SMS0850-4R7M | 4.7 | 20% | 100KHz, 1.0V | 30VDC | 15.0 | 20.0 | 12.00 |
| SMS0850-5R6M | 5.6 | 20% | 100KHz, 1.0V | 30VDC | 25.0 | 28.5 | 11.00 |
| SMS0850-100M | 10 | 20% | 100KHz, 1.0V | 30VDC | 35.0 | 45.0 | 8.00 |
| SMS0850-150M | 15 | 20% | 100KHz, 1.0V | 30VDC | 55.0 | 65.0 | 7.00 |
| SMS0850-220M | 22 | 20% | 100KHz, 1.0V | 30VDC | 78.0 | 88.0 | 5.50 |
| SMS0850-330M | 33 | 20% | 100KHz, 1.0V | 30VDC | 120.0 | 140.0 | 6.00 |
| SMS0850-470M | 47 | 20% | 100KHz, 1.0V | 30VDC | 177.0 | 190.0 | 4.00 |
| SMS0850-560M | 56 | 20% | 100KHz, 1.0V | 30VDC | 188.0 | 226.0 | 3.00 |
| SMS0850-680M | 68 | 20% | 100KHz, 1.0V | 30VDC | 280.0 | 310.0 | 2.80 |
Inductance Tolerance Options
| Code | Tolerance |
|---|---|
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Packing Options
| Code | Package Type |
|---|---|
| B | Bulk Package |
| T | Tape & Reel |
Product Identification Example
SMS 0850 100 M T
- SMS: Type
- 0850: External Dimensions (LWH) (mm)
- 100: Inductance (10 uH)
- M: Tolerance (20%)
- T: Packing Type (Tape & Reel)
Test Equipment
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Reliability Testing Summary
| Test Item | Requirements | Test Methods |
|---|---|---|
| Terminal Strength (SMT/DIP) | Meet specified force and duration requirements without loose terminals. | GB/T 2423.60-2008 |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997 |
| Dropping Test | No case deformation, change in appearance, short, or open. | GB/T 2423.7-2018 |
| Solderability | Wetting 75% coverage, Terminals 95% solder coverage. | GB/T 2423.28-2005 |
| Vibration Test | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019 |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na |
| Low Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab |
| High Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | GB/T 2423.3-2016 |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: 30%). Q/Q30%. DCR/DCR10%. | GJB 360B-2009 |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993 |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. | JIS C5311-6.13 |
| Voltage resistance test | During test: no breakdown. Characteristics normal after test. | MIL-STD-202G Method 301 |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user equipment and process conditions.
Reminders for Using These Products
- Storage period: within 12 months. Storage conditions: 5~40C, 35~65% RH.
- Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability.
- Handle products carefully to prevent damage from dropping or inappropriate removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not clean coils; contact SXN if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction due to overheating.
- Ensure sufficient thermal design margin for self-heating when power is on.
- For non-magnetic shield types, careful layout is required to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina