Molding SMD Power Inductors - SMS0518 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0518 Series offers ultra-high current SMD power inductors with a thin design, low DC resistance, and excellent anti-electromagnetic interference capabilities due to magnetic shielding. These inductors feature an integral construction for high reliability and vibration resistance, composite construction for ultra-low buzz noise, and are manufactured using low-loss alloy powder for low impedance and small parasitic capacitance. They achieve high efficiency with low winding DC resistance and core eddy-current loss, supporting frequencies up to 3MHz. These inductors are suitable for applications such as PDA, notebooks, desktop and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0518
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
General Specifications
| Parameter | Value | Notes |
| Operating Temperature | -55 to +125 | (Including coils self-temperature rise) |
| Frequency Support | Up to 3MHz | |
| Absolute Maximum Voltage | 30VDC | |
| Test Equipment (Inductance) | WK3260B or equivalent | |
| Test Equipment (Current) | WK3260B+WK3265B or equivalent | |
| Test Equipment (DCR) | Chroma 16502 or equivalent | |
Product Identification
| Component | Description |
| SMS 0518 | Type (Molding SMD Power Inductor) |
| 4R7 | Inductance (e.g., 4.7 uH) |
| M | Tolerance (e.g., 20%) |
| T | Packing (Tape & Reel) |
| 0518 | External Dimensions (LWH) in mm (5.55.21.8) |
Electrical Characteristics (SMS0518 Series)
| Part No. | Inductance (H) | Tol. | DCR (m) Typical | Saturation Current Typical (A) | Heat Rating Current Typical (A) |
| SMS0518-R33M | 0.33 | 20% | 6.0 | 17.0 | 12.0 |
| SMS0518-R47M | 0.47 | 20% | 7.7 | 15.5 | 10.5 |
| SMS0518-R56M | 0.56 | 20% | 8.0 | 15.0 | 9.5 |
| SMS0518-R68M | 0.68 | 20% | 10.0 | 12.0 | 9.0 |
| SMS0518-1R0M | 1.00 | 20% | 15.0 | 9.0 | 8.0 |
| SMS0518-1R5M | 1.50 | 20% | 21.0 | 9.0 | 7.5 |
| SMS0518-2R2M | 2.20 | 20% | 30.0 | 6.5 | 5.0 |
| SMS0518-3R3M | 3.30 | 20% | 52.0 | 5.0 | 4.5 |
| SMS0518-4R7M | 4.70 | 20% | 78.0 | 4.0 | 3.5 |
| SMS0518-6R8M | 6.80 | 20% | 107.0 | 3.4 | 2.8 |
| SMS0518-100M | 10.00 | 20% | 140.0 | 3.0 | 2.5 |
| SMS0518-150M | 15.00 | 20% | 240.0 | 2.2 | 1.8 |
Note: Saturation Current: DC current at which inductance drops 30% from its value without current. Heat Rating Current: the actual value of DC current when the temperature rise is T 40 (Ta=25). Rated DC Current: The less value which is Isat or Irms.
Shape and Dimensions
| Part No. | A (mm) | B (mm) | C (mm) | D (Typ) (mm) | E (Typ) (mm) | F (mm) | G (mm) | H (mm) |
| SMS0518 | 5.500.30 | 5.200.20 | 1.80Max | 2.30 | 1.20 | 3.00 | 7.00 | 2.50 |
Inductance Tolerance Codes
| Code | Tolerance |
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Packaging
| Packing Type | Description |
| Bulk Package | |
| Tape & Reel | |
Tape and Reel Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
| SMS0518 | 12.0 | 8.0 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Reliability Testing Summary
| Test Item | Requirements | Test Method Reference |
| Terminal Strength | Varies by terminal cross-sectional area (e.g., 5N for 8mm, 10N for 8-20mm, 20N for >20mm) | GB/T 2423.60-2008 |
| Resistance to Flexure | No visible mechanical damage; Flexure: 2mm | JIS C 5321:1997 |
| Dropping Test | No case deformation or change in appearance; No short/open | GB/T 2423.7-2018 |
| Solderability | Wetting >75% coverage; Terminals 95% minimum solder coverage | GB/T 2423.28-2005 |
| Vibration Test | No visible mechanical damage; Inductance change: 10%; Q factor change: 20% | GB/T 2423.10-2019 |
| Thermal Shock | No visible mechanical damage; Inductance change: 10% (Mn-Zn: 30%); Q factor change: 20% | GB/T 2423.22-2012 (Method Na) |
| Low Temperature Storage | No visible mechanical damage; Inductance change: 10% (Mn-Zn: 30%); Q factor change: 20% | GB/T 2423.1-2008 (Method Ab) |
| High Temperature Storage | No visible mechanical damage; Inductance change: 10% (Mn-Zn: 30%); Q factor change: 20% | GB/T 2423.2-2008 (Method Bb) |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: 10% (Mn-Zn: 30%); Q factor change: 20% | GB/T 2423.3-2016 |
| Heat endurance of Reflow soldering | No significant defects; L/L10% (Mn-Zn: 30%); Q/Q30%; DCR/DCR10% | GJB 360B-2009 |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | IEC 68-2-45:1993 |
| Overload test | No smoke, peculiar smell, or fire during test; Characteristics normal after test | JIS C5311-6.13 |
| Voltage resistance test | No breakdown during test; Characteristics normal after test | MIL-STD-202G Method 301 |
Recommended Reflow Soldering Curve
Users should adjust and confirm reflow conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage period: within 12 months. Storage conditions: temperature 5~40C, humidity 35-65% RH or less.
- Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals with bare hands to prevent solderability issues.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid overheating.
- Allow sufficient thermal design margin for self-heating when power is on.
- For non-magnetic shield types, careful layout is needed to prevent malfunction due to magnetic interference.
