Thin design LanTu Micro SMS1770 470MT SMD power inductor with RoHS Halogen Free and REACH compliance
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1770 Series are ultra-high current SMD power inductors designed for high-density installation. These magnetically shielded inductors offer strong anti-electromagnetic interference, low DC resistance, and ultra-high current capabilities in a thin design. Featuring an integral construction for high reliability and vibration resistance, they utilize a composite structure for ultra-low buzz noise and die-casting with low-loss alloy powder for low impedance and small parasitic capacitance. These inductors achieve high efficiency by reducing winding DC resistance and core eddy-current loss, supporting frequencies up to 3MHz and an absolute maximum voltage of 30VDC. They are RoHS, Halogen Free, and REACH compliant.
Applications: PDA, notebook, desktop, server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Series: SMS1770 Series
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
| Part No | Inductance (H) @0A | Tol | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical (Isat) | Heat Rating Current (A) Typical (Irms) | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|
| SMS1770-R22M | 0.22 | 20% | 0.63 | 0.75 | 75.00 | 57.00 | 17.5017.157.50 |
| SMS1770-R47M | 0.47 | 20% | 0.90 | 1.03 | 72.00 | 55.00 | 17.5017.157.50 |
| SMS1770-1R0M | 1.0 | 20% | 1.60 | 2.30 | 55.00 | 32.00 | 17.5017.157.50 |
| SMS1770-1R5M | 1.5 | 20% | 1.78 | 2.50 | 48.00 | 31.00 | 17.5017.157.50 |
| SMS1770-2R2M | 2.2 | 20% | 2.40 | 2.70 | 34.00 | 29.00 | 17.5017.157.50 |
| SMS1770-3R3M | 3.3 | 20% | 3.68 | 4.20 | 30.00 | 24.00 | 17.5017.157.50 |
| SMS1770-4R7M | 4.7 | 20% | 4.84 | 5.50 | 24.00 | 21.00 | 17.5017.157.50 |
| SMS1770-5R6M | 5.6 | 20% | 6.68 | 7.60 | 23.00 | 20.00 | 17.5017.157.50 |
| SMS1770-6R8M | 6.8 | 20% | 8.40 | 9.20 | 22.00 | 17.00 | 17.5017.157.50 |
| SMS1770-8R2M | 8.2 | 20% | 10.10 | 11.60 | 20.00 | 13.00 | 17.5017.157.50 |
| SMS1770-100M | 10 | 20% | 11.60 | 13.00 | 19.00 | 12.00 | 17.5017.157.50 |
| SMS1770-150M | 15 | 20% | 18.80 | 20.50 | 14.50 | 11.00 | 17.5017.157.50 |
| SMS1770-220M | 22 | 20% | 25.10 | 26.50 | 11.50 | 8.50 | 17.5017.157.50 |
| SMS1770-330M | 33 | 20% | 38.00 | 44.00 | 10.00 | 8.00 | 17.5017.157.50 |
| SMS1770-470M | 47 | 20% | 48.00 | 55.00 | 7.50 | 6.00 | 17.5017.157.50 |
| SMS1770-560M | 56 | 20% | 54.00 | 62.00 | 7.00 | 5.50 | 17.5017.157.50 |
| SMS1770-680M | 68 | 20% | 68.00 | 80.00 | 6.50 | 5.20 | 17.5017.157.50 |
| SMS1770-101M | 100 | 20% | 110.00 | 118.00 | 5.00 | 3.70 | 17.5017.157.50 |
| Inductance Tolerance Options: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |||||||
| Operating Temperature: -55 to +125 (Including coils self-temperature rise) | |||||||
| Absolute Maximum Voltage: 30VDC | |||||||
| Frequency: Up to 3MHz | |||||||
| External Dimensions (LWH): 17.5017.157.50 mm | |||||||
| Test Equipment: L: WK3260B LCR meter or equivalent; Isat & Irms: WK3260B+WK3265B or equivalent; DCR: Chroma 16502 or equivalent | |||||||
| Packaging: Bulk Package (B), Tape & Reel (TF) | |||||||
Shape and Dimensions
| Part No | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS1770 | 17.50.50 | 17.150.30 | 7.50 Max | 12.0 Typ | 2.50 Typ | 12.4 | 19.5 | 12.5 |
(Dimensions are in mm)
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test based on terminal area; Solder paste thickness: 0.12mm; Keep time: 101s; Speed: 1.0mm/s |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Applied force based on terminal diameter; Duration: 10sec |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm; Pressurizing Speed: 0.5mm/sec; Keep time: 30 sec |
| Dropping | No case deformation or change in appearance; No short and no open | Drop packaged products from 1m high, 1 angle, 3 ridges, 6 surfaces, twice in each direction |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage | Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Frequency 10-55 Hz, amplitude 1.5mm, 2 hours in 3 mutually perpendicular directions |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | 100 cycles of temperature cycling between (-55~40) and (85~125) |
| Low temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Temperature: -55~-402; Duration: 962 hours |
| High temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Temperature: 125~852; Duration: 962 hours |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10% | Twice reflow soldering; Peak temperature: 260+0/-5 |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times |
| Overload test | No smoke, no peculiar smell, no fire during test; Characteristics normal after test | Apply twice rated current for 5 minutes |
| Voltage resistance test | No breakdown during test; Characteristics normal after test | DC1000V, Current: 1mA, Time: 1Min |
Recommended Reflow Soldering Curve
(Refer to the visual graph in the source document for the specific temperature curve.)
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle products carefully to prevent damage from dropping.
- Terminal Bending: Do not bend terminals excessively to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Ensure the temperature difference between solder and chip temperature does not exceed 150C.
- Soldering Corrections: Perform after-mounting soldering corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is on; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Careful coil layout is required in PCB design to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina