Magnetic Shielded Molding SMD Power Inductor LanTu Micro SMS1040-3R3MT for Distributed Power Systems
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Product Description
Molding SMD Power Inductors - SMS1040 Series
Product Overview
The SMS1040 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors with a thin design, low DC resistance, and superior current handling capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference and an integral construction for high reliability and vibration resistance, these inductors are ideal for high-density installations. Their composite structure minimizes buzz noise, while the low-loss alloy powder die-casting ensures low impedance and small parasitic capacitance, contributing to high efficiency. Operating up to 3MHz with an absolute maximum voltage of 30VDC, these RoHS, Halogen Free, and REACH compliant inductors are suitable for a wide range of applications including PDAs, notebooks, servers, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS1040
- Certifications: RoHS, Halogen Free, REACH Compliance
- Construction: Integral construction, Magnetic shielding type, Composite structure
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|
| SMS1040-R22M | 0.22 | 20% | 1.2 | 60.00 | 35.00 | 11.510.04.0 |
| SMS1040-R36M | 0.36 | 20% | 1.7 | 50.00 | 30.00 | 11.510.04.0 |
| SMS1040-R47M | 0.47 | 20% | 1.9 | 40.00 | 30.00 | 11.510.04.0 |
| SMS1040-R56M | 0.56 | 20% | 2.1 | 33.00 | 25.00 | 11.510.04.0 |
| SMS1040-R68M | 0.68 | 20% | 2.3 | 30.00 | 23.00 | 11.510.04.0 |
| SMS1040-1R0M | 1.0 | 20% | 3.0 | 28.00 | 18.00 | 11.510.04.0 |
| SMS1040-1R5M | 1.5 | 20% | 4.8 | 23.00 | 16.00 | 11.510.04.0 |
| SMS1040-2R2M | 2.2 | 20% | 7.2 | 18.00 | 12.00 | 11.510.04.0 |
| SMS1040-3R3M | 3.3 | 20% | 10.8 | 16.00 | 10.00 | 11.510.04.0 |
| SMS1040-4R7M | 4.7 | 20% | 17.0 | 15.00 | 8.50 | 11.510.04.0 |
| SMS1040-5R6M | 5.6 | 20% | 20.5 | 13.00 | 8.00 | 11.510.04.0 |
| SMS1040-6R8M | 6.8 | 20% | 22.5 | 12.00 | 7.00 | 11.510.04.0 |
| SMS1040-100M | 10 | 20% | 34.0 | 8.50 | 5.50 | 11.510.04.0 |
| SMS1040-150M | 15 | 20% | 50.0 | 7.00 | 5.00 | 11.510.04.0 |
| SMS1040-220M | 22 | 20% | 60.0 | 6.00 | 4.00 | 11.510.04.0 |
| SMS1040-330M | 33 | 20% | 85.0 | 5.00 | 3.50 | 11.510.04.0 |
| SMS1040-470M | 47 | 20% | 141.0 | 4.50 | 3.00 | 11.510.04.0 |
| SMS1040-680M | 68 | 20% | 200.0 | 3.80 | 2.30 | 11.510.04.0 |
| SMS1040-101M | 100 | 20% | 237.0 | 3.00 | 2.00 | 11.510.04.0 |
General Specifications
| Parameter | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Frequency | Up to 3MHz |
| Absolute Maximum Voltage | 30VDC |
| Inductance Test Conditions | 100KHz, 1.0V |
| Saturation Current Definition | DC current at which inductance drops 30% from its value without current. |
| Heat Rating Current Definition | The actual value of DC current when the temperature rise is T 40 (Ta=25). |
| Rated DC Current | The lesser value of Isat or Irms. |
Shape and Dimensions
| Part No. | A (Max) | B (0.30) | C (Max) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS1040 | 11.50 | 10.00 | 4.00 | 3.00 | 2.00 | 4.10 | 13.60 | 5.40 |
Inductance Tolerance Codes
| Code | Tolerance |
|---|---|
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Packaging
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS1040 | 24.0 | 16.0 | 11.5 | 24.4 | 100 | 13 | 330 | 1000 | 2000 | 8000 |
Cover Tape Peel Off Condition
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing
| Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without loose terminal | Pulling test (force based on terminal area), Solder paste thickness: 0.12mm |
| Terminal Strength (DIP) | Meet requirements without loose terminal | Pull force (based on terminal diameter), Duration: 10 sec |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation or change in appearance; No short and no open | Drop packaged products from 1m high (1 angle, 3 ridges, 6 surfaces, twice each direction) |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage | Solder temperature: 2402, Duration: 3 sec |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Frequency 10-55 Hz, Amplitude 1.5mm, Duration 2 hours in each 3 mutually perpendicular directions |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | 100 cycles of temperature shock (-55~40 to 85~125) |
| Low Temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Temperature: -55~-402, Duration: 962 hours |
| High Temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Temperature: 125~852, Duration: 962 hours |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10% | Reflow twice, Peak temperature: 260+0/-5 |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times |
| Overload test | During test no smoke, no peculiar smell, no fire; Characteristics normal after test | Apply twice rated current for 5 minutes |
| Voltage resistance test | During test no breakdown; Characteristics normal after test | DC1000V, Current: 1mA, Time: 1Min |
Recommended Reflow Soldering Curve
The recommended reflow conditions are provided as a guideline. Users should adjust and confirm according to their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals to prevent solderability issues. Handle products carefully to prevent damage.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for self-heating when power is ON.
- Layout (Non-magnetic shield type): Carefully lay out coils on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina