Low Buzz Noise Magnetic Resin Shielded SMD Power Inductor LanTu Micro SNR4020-3R3MT with EMI Resistance
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Product Description
Product Overview
The SNR4020 Series are automatic assembly, magnetic resin shielded SMD power inductors designed to minimize buzz noise to ultra-low levels. They feature a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, large current capacity with low DCR, and metallization on the ferrite core for excellent shock resistance and durability. These space-saving and power-efficient inductors are ideal for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, automotive systems, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR4020 Series
- Construction: Magnetic resin shielded, automatic assembly
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part Number | Inductance (H) | Inductance Tolerance | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) | Operating Temperature (C) |
|---|---|---|---|---|---|---|---|---|
| SNR4020-R47M | 0.47 | 20% | 0.022 | 0.029 | 7.00 | 3.30 | 4.04.02.0 | -40 to +125 |
| SNR4020-1R0M | 1.0 | 20% | 0.029 | 0.038 | 4.78 | 2.15 | 4.04.02.0 | -40 to +125 |
| SNR4020-1R5M | 1.5 | 20% | 0.035 | 0.045 | 4.45 | 2.15 | 4.04.02.0 | -40 to +125 |
| SNR4020-2R2M | 2.2 | 20% | 0.035 | 0.046 | 3.40 | 1.85 | 4.04.02.0 | -40 to +125 |
| SNR4020-3R3M | 3.3 | 20% | 0.070 | 0.091 | 3.20 | 1.40 | 4.04.02.0 | -40 to +125 |
| SNR4020-4R7M | 4.7 | 20% | 0.075 | 0.098 | 2.35 | 1.34 | 4.04.02.0 | -40 to +125 |
| SNR4020-6R8M | 6.8 | 20% | 0.125 | 0.163 | 2.20 | 1.04 | 4.04.02.0 | -40 to +125 |
| SNR4020-8R2M | 8.2 | 20% | 0.148 | 0.185 | 1.75 | 1.00 | 4.04.02.0 | -40 to +125 |
| SNR4020-100M | 10 | 20% | 0.165 | 0.215 | 1.60 | 0.90 | 4.04.02.0 | -40 to +125 |
| SNR4020-150M | 15 | 20% | 0.230 | 0.300 | 1.35 | 0.77 | 4.04.02.0 | -40 to +125 |
| SNR4020-220M | 22 | 20% | 0.350 | 0.455 | 1.05 | 0.62 | 4.04.02.0 | -40 to +125 |
| SNR4020-330M | 33 | 20% | 0.550 | 0.710 | 0.85 | 0.49 | 4.04.02.0 | -40 to +125 |
| SNR4020-470M | 47 | 20% | 0.710 | 0.920 | 0.74 | 0.44 | 4.04.02.0 | -40 to +125 |
| SNR4020-680M | 68 | 20% | 1.060 | 1.380 | 0.60 | 0.36 | 4.04.02.0 | -40 to +125 |
Applications
- LED backlight
- Flat-screen TVs
- Blue-ray disc set top boxes
- Notebooks
- Desktop computers
- Servers
- Graphic cards
- Portable gaming devices
- Personal navigation systems
- Personal multimedia devices
- Automotive systems
- Telecommunication base stations
- DC-DC converters
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Physical Dimensions
External Dimensions: 4.04.02.0 mm
Recommended Land Pattern (Dimensions in mm):
| ITEM | A | B | C (Max) | D | E | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|
| SNR4020 | 4.00.3 | 4.00.3 | 2.0 | 2.10.2 | 3.30.2 | 1.1 | 1.9 | 3.7 |
Packaging Information
- Packing: Bulk Package (B) or Tape & Reel (T)
- Tape Dimension (mm): W=12, P=8, W1=5.5
- Reel Dimensions (mm): A=12.4
- Packing Quantity: Reel: 3000 PCS, Inside Box: 12,000 PCS, Outside Carton: 48,000 PCS
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008 with varying forces based on terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Packaged products dropped from 1m high. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temperature: 2402, Duration: 3 sec. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Frequency 10-55 Hz, amplitude 1.5mm. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature extremes. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402, Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852, Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | GJB 360B-2009. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip into IPA solvent. |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm according to their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, temperature 5~40C, humidity 35~65% RH or less.
- Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage from dropping.
- Bending: Do not excessively bend terminals to prevent wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose to magnets or magnetic fields.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions; overheating may cause issues.
- Thermal Design: Allow sufficient margin for self-heating when power is on.
- Layout: For non-magnetic shield types, careful coil layout is needed to prevent magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina