SMD power inductor LanTu Micro SNR4020-470MT featuring metallization on ferrite core and low DCR values
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The SNR4020 Series are automatic assembly, magnetic resin shielded SMD power inductors designed to minimize buzz noise to ultra-low levels. They feature a closed magnetic circuit for reduced leakage flux and enhanced EMI resistance, large current capacity with low DCR, and metallization on the ferrite core for excellent shock resistance. These space-saving and power-efficient inductors are suitable for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, graphics cards, automotive systems, and DC-DC converters. They are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR4020
- Construction: Magnetic Resin Shielded SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Test Frequency | Test Voltage | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|---|---|
| SNR4020-R47M | 0.47 | 20% | 100KHz | 1.0V | 0.022 | 0.029 | 7.00 | 3.30 | 4.04.02.0 |
| SNR4020-1R0M | 1.0 | 20% | 100KHz | 1.0V | 0.029 | 0.038 | 4.78 | 2.15 | 4.04.02.0 |
| SNR4020-1R5M | 1.5 | 20% | 100KHz | 1.0V | 0.035 | 0.045 | 4.45 | 2.15 | 4.04.02.0 |
| SNR4020-2R2M | 2.2 | 20% | 100KHz | 1.0V | 0.035 | 0.046 | 3.40 | 1.85 | 4.04.02.0 |
| SNR4020-3R3M | 3.3 | 20% | 100KHz | 1.0V | 0.070 | 0.091 | 3.20 | 1.40 | 4.04.02.0 |
| SNR4020-4R7M | 4.7 | 20% | 100KHz | 1.0V | 0.075 | 0.098 | 2.35 | 1.34 | 4.04.02.0 |
| SNR4020-6R8M | 6.8 | 20% | 100KHz | 1.0V | 0.125 | 0.163 | 2.20 | 1.04 | 4.04.02.0 |
| SNR4020-8R2M | 8.2 | 20% | 100KHz | 1.0V | 0.148 | 0.185 | 1.75 | 1.00 | 4.04.02.0 |
| SNR4020-100M | 10 | 20% | 100KHz | 1.0V | 0.165 | 0.215 | 1.60 | 0.90 | 4.04.02.0 |
| SNR4020-150M | 15 | 20% | 100KHz | 1.0V | 0.230 | 0.300 | 1.35 | 0.77 | 4.04.02.0 |
| SNR4020-220M | 22 | 20% | 100KHz | 1.0V | 0.350 | 0.455 | 1.05 | 0.62 | 4.04.02.0 |
| SNR4020-330M | 33 | 20% | 100KHz | 1.0V | 0.550 | 0.710 | 0.85 | 0.49 | 4.04.02.0 |
| SNR4020-470M | 47 | 20% | 100KHz | 1.0V | 0.710 | 0.920 | 0.74 | 0.44 | 4.04.02.0 |
| SNR4020-680M | 68 | 20% | 100KHz | 1.0V | 1.060 | 1.380 | 0.60 | 0.36 | 4.04.02.0 |
| Inductance Tolerance Options: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |||||||||
| Packing Options: B: Bulk Package, T: Tape & Reel | |||||||||
Environmental Data
Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification
Example: SNR 4020 470 M T
- Type: SNR (Shielded SMD Power Inductors)
- Dimensions: 4020 (4.04.02.0 mm)
- Inductance: 470 (47 H)
- Tolerance: M (20%)
- Packing: T (Tape & Reel)
Shape and Dimensions
| Item | A | B | C | D | E | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|
| SNR4020 | 4.0 0.3 | 4.0 0.3 | 2.0 Max | 2.1 0.2 | 3.3 0.2 | 1.1 | 1.9 | 3.7 |
| (Dimensions are in mm) | ||||||||
Packaging Specifications
Tape and Reel Dimensions:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel Quantity (PCS) | Inside Box Quantity (PCS) | Outside Carton Quantity (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR4020 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 3000 | 12,000 | 48,000 |
Cover tape peel off condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Force varies with terminal cross-sectional area (A): A8mm, force5N; 8mm |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Force varies with terminal diameter (d): 0.35d0.50mm, 5N; 0.50d0.80mm, 10N; 0.80d1.25mm, 20N; D1.25mm, 40N. Duration: 10sec. Pull Force applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | Based on JIS C 5311:1997. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Based on GB/T 2423.7-2018. Packaged products dropped from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. No visible mechanical damage. | Based on GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol by weight. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Based on GB/T 2423.10-2019. Solder the inductor to a testing jig. Subjected to simple harmonic motion, amplitude 1.5mm, frequency 10-55 Hz and return. Traversed in approximately 1 minute. Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Based on GB/T 2423.22-2012 Method Na. One cycle: (85~125) for T time, rush to (-55~40) for T time. 100 cycles. Transforming interval: Max. 20 sec. Stabilized at normal condition for 1-2 hours. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Based on GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. Stabilized at normal condition for 1-2 hours before measuring. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Based on GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. Stabilized at normal condition for 1-2 hours before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Based on GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilized at normal condition for 1-2 hours before measuring. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Based on GJB 360B-2009. Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Based on IEC 68-2-45:1993. Dip parts into IPA solvent for 50.5Min, dry at room temp for 5Min, brush 10 times. |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. | Based on JIS C5311-6.13. Apply twice the rated current for 5 minutes. Repeat twice. |
| Voltage resistance test | During test: no breakdown. Characteristics normal after test. | Based on MIL-STD-202G Method 301. For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals with bare hands to prevent solderability issues. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or strong magnetic fields.
- Preheating: Ensure preheating before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform post-mounting soldering corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is applied. Ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Carefully consider coil layout in PCB design to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina