LanTu Micro SMS0865 680MT molding SMD power inductor with low parasitic capacitance and high reliability
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Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0865 Series are ultra-high current SMD power inductors designed for high-density mounting. Featuring a thin profile with low DC resistance and ultra-high current capabilities, these magnetic shielding type inductors offer strong anti-electromagnetic interference. Their integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Utilizing low-loss alloy powder die-casting, they achieve low impedance and small parasitic capacitance, contributing to high efficiency and reduced core eddy-current loss. These inductors are suitable for applications requiring DC/DC converters, such as PDAs, notebooks, desktops, servers, high current POL converters, and battery-powered devices, with an absolute maximum voltage of 75VDC and compliance with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS0865
- Certifications: RoHS, Halogen Free, REACH Compliance
- Construction: Integral construction, Magnetic shielding type, Composite structure, Die-casting by low loss alloy powder
Technical Specifications
| Part Number | Inductance (H) | Inductance Tolerance | Test Frequency | Test Voltage | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|---|---|
| SMS0865-4R7M | 4.70 | 20% | 100KHz | 1.0V | 12.50 | 15.00 | 16.00 | 11.0 | 9.08.16.5 |
| SMS0865-6R8M | 6.80 | 20% | 100KHz | 1.0V | 19.00 | 23.00 | 13.00 | 9.00 | 9.08.16.5 |
| SMS0865-100M | 10.00 | 20% | 100KHz | 1.0V | 24.00 | 29.00 | 10.00 | 8.50 | 9.08.16.5 |
| SMS0865-150M | 15.00 | 20% | 100KHz | 1.0V | 24.50 | 35.00 | 8.30 | 8.00 | 9.08.16.5 |
| SMS0865-220M | 22.00 | 20% | 100KHz | 1.0V | 42.00 | 50.00 | 7.00 | 6.00 | 9.08.16.5 |
| SMS0865-330M | 33.00 | 20% | 100KHz | 1.0V | 89.00 | 100.00 | 6.00 | 4.50 | 9.08.16.5 |
| SMS0865-470M | 47.00 | 20% | 100KHz | 1.0V | 135.00 | 155.00 | 5.50 | 3.50 | 9.08.16.5 |
| SMS0865-680M | 68.00 | 20% | 100KHz | 1.0V | 180.00 | 200.00 | 4.50 | 4.00 | 9.08.16.5 |
| SMS0865-101M | 100.00 | 20% | 100KHz | 1.0V | 214.00 | 255.00 | 3.20 | 3.00 | 9.08.16.5 |
| Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |||||||||
| Packaging Codes: B: Bulk Package, T: Tape & Reel | |||||||||
| Operating Temperature: -55 to +125 (Including coils self-temperature rise) | |||||||||
| Absolute Maximum Voltage: 75VDC | |||||||||
| Saturation Current Definition: DC current at which inductance drops 30% from its value without current. | |||||||||
| Heat Rating Current Definition: The actual value of DC current when the temperature rise is T 40 (Ta=25). | |||||||||
| Rated DC Current: The lesser value of Isat or Irms. | |||||||||
Packaging Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0865 | 24.0 | 12.0 | 11.5 | 24.4 | 100 | 13 | 330 | 500 | 1000 | 4000 |
Reliability Testing
| Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet the above requirements without any loose terminal | Pulling test: Define: A: sectional area of terminal A8mm2 force5N time:30sec; 8mm2<A20mm2 force 10N time: 10sec; 20mm2<A force 20N time: 10sec. Solder paste thickness:0.12mm. Pull Force:the force shall be applied gradually to the terminal and then maintained for 10 seconds. Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet the above requirements without any loose terminal. | Terminal diameter(d) mm 0.35d 0.50 Applied force:5N Duration: 10sec; Terminal diameter(d) mm 0.50d 0.80 Applied force:10N Duration: 10sec; Terminal diameter(d) mm 0.80d 1.25 Applied force:20N Duration: 10sec; Terminal diameter(d) mm D 1.25 Applied force:40N Duration: 10sec. Pull Force:the force shall be applied gradually to the terminal and then maintained for 10 seconds. |
| Resistance to Flexure | 1.No visible mechanical damage. 2. Solder the inductor to the test jig (glass epoxy board shown in Using a leadfree solder. 3.Flexure: 2mm. 4.Pressurizing Speed: 0.5mm/sec. 5.Keep time: 30 sec. | JIS C 5321:1997 |
| Dropping Test | 1.No case deformation or change in appearance. 2.No short and no open. | Drop the packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. GB/T 2423.7-2018 |
| Solderability | 1.No visible mechanical damage. 2.Wetting shall exceed 75% coverage for 3.Terminals must have 95% minimum solder coverage | Solder temperature:2402 Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight. GB/T 2423.28-2005 |
| Vibration Test | 1.No visible mechanical damage. 2. Inductance change: Within 10%. 3.Q factor change: Within 20%. | Solder the inductor to the testing jig (glass epoxy board shown in ) using leadfree solder. The inductor shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3 mutually perpendicular directions(total of 6 hours). GB/T 2423.10-2019 |
| Thermal Shock | 1.No visible mechanical damage. 2. Inductance change: Within 10%.(Mn-Zn: Within 30% ) 3.Q factor change: Within 20%. | Start at ( 85~125) for T time, rush to (-55~40) for T time as one cycle, go through 100 cycles. Transforming interval: Max. 20 sec. Tested cycle: 100 cycles. The chip shall be stabilized at normal condition for 1~2 hours. GB/T 2423.22-2012 Method Na |
| Low Temperature Storage | 1.No visible mechanical damage. 2. Inductance change: Within 10%.(Mn-Zn: Within 30% ) 3.Q factor change: Within 20%. | Temperature: M(-55~-402). Duration: 962 hours. The chip shall be stabilized at normal condition for 1~2 hours before measuring. GB/T 2423.1-2008 Method Ab |
| High Temperature Storage | 1.No visible mechanical damage. 2. Inductance change: Within 10%.(Mn-Zn: Within 30% ) 3.Q factor change: Within 20%. | Temperature: N(125~852). Duration: 962 hours. The chip shall be stabilized at normal condition for 1~2 hours before measuring. GB/T 2423.2-2008 Method Bb |
| Damp Heat (Steady States) | 1.No visible mechanical damage. 2. Inductance change: Within 10%.(Mn-Zn: Within 30% ) 3.Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. The chip shall be stabilized at normal condition for 1~2 hours before measuring. GB/T 2423.3-2016 |
| Heat endurance of Reflow soldering | 1.No significant defects in appearance. 2.L/L10% (Mn-Zn: L/L30% ) 3.Q/Q30% SMD series only 4.DCR/DCR10% | Refer to the above reflow curve and go through the reflow for twice. The peak temperature : 260+0/-5. GJB 360B-2009 |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | To dip parts into IPA solvent for 50.5Min, then drying them at room temp for 5Min, at last, to brushing making 10 times. IEC 68-2-45:1993 |
| Overload test | 1.During the test no smoke, no peculiar smell, no fire. 2.The characteristic is normal after test. | Apply twice as rated current for 5 minutes. JIS C5311-6.13 |
| Voltage resistance test | 1.During the test no breakdown. 2.The characteristic is normal after test. | For parts with two coils. DC1000V, Current: 1mA, Time: 1Min. Refer to catalogue of specific products. MIL-STD-202G Method 301 |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Usage Reminders
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Exceeding this period may degrade terminal solderability.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Do not touch electrodes directly with bare hands to prevent solderability issues due to oil secretions. Handle products carefully to avoid damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Ensure components are preheated before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections must be within specified conditions. Overheating can lead to short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina