LanTu Micro SMS0865 100MT molding SMD power inductors suitable for PDAs notebooks and DC DC converters
Molding SMD Power Inductors - SMS0865 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0865 Series offers ultra-high current, thin-profile SMD power inductors designed for high-density installations. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors utilize an integral construction for high reliability and excellent vibration resistance. Their composite structure ensures ultra-low buzz noise, while the low-loss alloy powder die-casting contributes to low impedance and small parasitic capacitance, resulting in high efficiency and reduced core eddy-current loss. They are suitable for applications requiring low DC resistance and ultra-high current capabilities, including PDAs, notebooks, desktop and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS0865
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company location)
Technical Specifications
| Part Number | Inductance (H) | Inductance Tolerance | Test Frequency | Test Voltage | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|---|---|---|
| SMS0865-4R7M | 4.70 | 20% | 100KHz | 1.0V | 12.50 | 15.00 | 16.00 | 11.0 | 9.08.16.5 |
| SMS0865-6R8M | 6.80 | 20% | 100KHz | 1.0V | 19.00 | 23.00 | 13.00 | 9.00 | 9.08.16.5 |
| SMS0865-100M | 10.00 | 20% | 100KHz | 1.0V | 24.00 | 29.00 | 10.00 | 8.50 | 9.08.16.5 |
| SMS0865-150M | 15.00 | 20% | 100KHz | 1.0V | 24.50 | 35.00 | 8.30 | 8.00 | 9.08.16.5 |
| SMS0865-220M | 22.00 | 20% | 100KHz | 1.0V | 42.00 | 50.00 | 7.00 | 6.00 | 9.08.16.5 |
| SMS0865-330M | 33.00 | 20% | 100KHz | 1.0V | 89.00 | 100.00 | 6.00 | 4.50 | 9.08.16.5 |
| SMS0865-470M | 47.00 | 20% | 100KHz | 1.0V | 135.00 | 155.00 | 5.50 | 3.50 | 9.08.16.5 |
| SMS0865-680M | 68.00 | 20% | 100KHz | 1.0V | 180.00 | 200.00 | 4.50 | 4.00 | 9.08.16.5 |
| SMS0865-101M | 100.00 | 20% | 100KHz | 1.0V | 214.00 | 255.00 | 3.20 | 3.00 | 9.08.16.5 |
General Specifications:
- Operating Temperature: -55 to +125 (Including coil self-temperature rise)
- Absolute Maximum Voltage: 75VDC
- Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: B (Bulk Package), T (Tape & Reel)
Test Equipment:
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Environmental Data:
- Operating Temperature: -55 to +125 (Including coil self-temperature rise)
Product Identification Example: SMS 0865 100 M T
- : Inductance (e.g., 100 for 10 H)
- : Outer Dimensions (0865 for 9.08.16.5 mm)
- : Type (SMS for Molding SMD Power Inductor)
Shape and Dimensions (mm):
| ITEM | A (Max) | B (0.3) | C (Max) | D (0.3) | E (0.3) | F (Ref) | G (Ref) | H (Ref) |
|---|---|---|---|---|---|---|---|---|
| SMS0865 | 9.0 | 8.10 | 6.50 | 3.00 | 1.90 | 4.50 | 9.00 | 3.50 |
Recommended Land Pattern: (Refer to visual diagram in source document)
Packaging:
- Tape and Reel Specifications: (Refer to visual diagrams in source document for Tape and Reel Dimensions, Cover tape peel off condition, and Packing quantity)
- Reel Dimensions: (Refer to visual diagrams in source document)
- Tape Dimension: (Refer to visual diagrams in source document)
- Cover tape peel off condition: a) Peel force: 10 to 120g, b) Peel angle: 165 to 180
- Packing quantity: SMS0865: 500 PCS/REEL, 1000 PCS/Inside Box, 4000 PCS/Outside Carton
Reminders for Using These Products:
- Storage period: within 12 months. Storage conditions: 5~40C, 35~65% RH.
- Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact SXN if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Sufficient thermal design margin is required due to self-heating when power is on.
- For non-magnetic shield types, careful coil layout is needed on the circuit board to prevent malfunctions due to magnetic interference.
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