Thin profile LanTu Micro SMS252010 100MT SMD power inductor with RoHS Halogen Free and REACH compliance
Product Overview
The SMS252010 Series Ultra-high current SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation with a thin profile, low DC resistance, and ultra-high current capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability and excellent vibration resistance due to their T-core molding structure. They are ideal for applications requiring extremely low DCR and ultra-low AC losses at high switching frequencies, including DC/DC converters for notebook CPUs, mobile phones, tablets, servers, base stations, and various power modules. These components comply with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Common Mode Choke / Molding SMD Power Inductor
- Series: SMS252010
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|---|
| SMS252010-R22M | 0.22 | 20% | 12.0 | 17.0 | 8.60 | 6.80 | 2.52.01.0 |
| SMS252010-R24M | 0.24 | 20% | 12.0 | 17.5 | 8.50 | 6.70 | 2.52.01.0 |
| SMS252010-R33M | 0.33 | 20% | 13.0 | 19.0 | 7.60 | 6.50 | 2.52.01.0 |
| SMS252010-R47M | 0.47 | 20% | 15.0 | 22.0 | 6.90 | 6.10 | 2.52.01.0 |
| SMS252010-R68M | 0.68 | 20% | 23.0 | 27.0 | 5.90 | 5.60 | 2.52.01.0 |
| SMS252010-1R0M | 1.0 | 20% | 25.0 | 30.0 | 5.40 | 4.70 | 2.52.01.0 |
| SMS252010-1R5M | 1.5 | 20% | 45.0 | 55.0 | 4.30 | 3.40 | 2.52.01.0 |
| SMS252010-2R2M | 2.2 | 20% | 62.0 | 70.0 | 3.30 | 2.40 | 2.52.01.0 |
| SMS252010-3R3M | 3.3 | 20% | 86.0 | 100.0 | 2.80 | 2.50 | 2.52.01.0 |
| SMS252010-4R7M | 4.7 | 20% | 160.0 | 180.0 | 2.60 | 2.00 | 2.52.01.0 |
| SMS252010-6R8M | 6.8 | 20% | 270.0 | 320.0 | 2.40 | 1.60 | 2.52.01.0 |
| SMS252010-100M | 10 | 20% | 500.0 | 560.0 | 1.55 | 1.05 | 2.52.01.0 |
| SMS252010-220M | 22 | 20% | 1100.0 | 1300.0 | 1.10 | 0.85 | 2.52.01.0 |
| Part No. | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | H (mm) |
|---|---|---|---|---|---|---|---|
| SMS252010 | 2.500.20 | 2.000.20 | 1.00 Max | 0.90 Typ | 2.80 Typ | 1.00 Typ | 2.10 Typ |
Environmental Data:
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment:
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification Example: SMS 252010 R47 M T
- Inductance: 0.47 uH
- Type: SMS (Molding SMD Power Inductor)
- External Dimensions (LWH) (mm): 252010 (2.52.01.0)
- Inductance Tolerance: M (20%)
- Packing: T (Tape & Reel)
Packaging Specifications (Tape and Reel):
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|
| SMS252010 | 8.0 | 4.0 | 3.5 | 3000 | 30,000 | 120,000 |
Cover tape peel off condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing:
- Terminal Strength: Meets specified force and duration requirements without loose terminals.
- Resistance to Flexure: No visible mechanical damage after flexure test.
- Dropping Test: No case deformation or appearance change; no short/open circuits after dropping.
- Solderability: Minimum 75% wetting coverage, 95% minimum solder coverage on terminals.
- Vibration: No visible mechanical damage; Inductance change within 10%; Q factor change within 20%.
- Thermal Shock: No visible mechanical damage; Inductance change within 10%; Q factor change within 20% after 100 cycles.
- Low Temperature Storage: No visible mechanical damage; Inductance change within 10%; Q factor change within 20%.
- High Temperature Storage: No visible mechanical damage; Inductance change within 10%; Q factor change within 20%.
- Damp Heat (Steady States): No visible mechanical damage; Inductance change within 10%; Q factor change within 20%.
- Heat endurance of Reflow soldering: No significant defects; L/L 10%; Q/Q 30%; DCR/DCR 10%.
- Resistance to solvent test: No case deformation, appearance change, or obliteration of marking.
- Overload test: No smoke, peculiar smell, or fire during test; characteristics normal after test.
- Voltage resistance test: No breakdown during test; characteristics normal after test.
Recommended Reflow Soldering Curve: Refer to the provided curve for soldering equipment settings, adjust based on user environment/equipment.
Reminders for Using These Products:
- Storage period is within 12 months under conditions (5~40C, 35~65% RH).
- Avoid use and storage in corrosive gas environments (salt, acid, alkali).
- Do not touch terminals directly with bare hands.
- Handle products carefully to prevent damage.
- Do not bend terminals excessively.
- Do not rinse coils; contact manufacturer if cleaning is required.
- Keep away from magnets or magnetic fields.
- Preheat components before soldering; temperature difference should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid overheating.
- Allow sufficient thermal design margin for self-heating when power is on.
- For non-magnetic shield types, careful layout is needed to prevent malfunction due to magnetic interference.
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