Molding SMD Power Inductors LanTu Micro SMS1770-4R7MT Ultra High Current Low DC Resistance Components
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Product Description
Molding SMD Power Inductors - SMS1770 Series
Product Overview
The SMS1770 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors designed for high-density installation. These magnetically shielded inductors provide strong anti-electromagnetic interference, low DC resistance, and ultra-high current capabilities in a thin profile. Featuring an integral construction for high reliability and vibration resistance, they also boast composite construction for ultra-low buzz noise and die-casting with low-loss alloy powder for low impedance and small parasitic capacitance. With high efficiency, these inductors support frequencies up to 3MHz and an absolute maximum voltage of 30VDC, while complying with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS1770
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Technical Specifications
General Specifications:
| Parameter | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Frequency Range | Up to 3MHz |
| Absolute Maximum Voltage | 30VDC |
Dimensions:
| Part No. | L (mm) | W (mm) | H (mm) |
|---|---|---|---|
| SMS1770 | 17.50 0.50 | 17.15 0.30 | 7.50 Max |
Recommended Land Pattern (dimensions in mm):
| Part No. | A (Typ) | B (Typ) | C (Max) | D (Typ) | E (Typ) | F | G | H | |
|---|---|---|---|---|---|---|---|---|---|
| SMS1770 | 12.0 | 2.50 | 7.50 | 12.4 | 19.5 | 12.5 | - | - | - |
Electrical Characteristics (at 25):
| Part No. | Inductance (H) @ 0A | Tol. | L (H) @ 100KHz, 1.0V | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|---|---|
| SMS1770-R22M | 0.22 | 20% | 0.22 | 0.63 | 0.75 | 75.00 | 57.00 |
| SMS1770-R47M | 0.47 | 20% | 0.47 | 0.90 | 1.03 | 72.00 | 55.00 |
| SMS1770-1R0M | 1.0 | 20% | 1.0 | 1.60 | 2.30 | 55.00 | 32.00 |
| SMS1770-1R5M | 1.5 | 20% | 1.5 | 1.78 | 2.50 | 48.00 | 31.00 |
| SMS1770-2R2M | 2.2 | 20% | 2.2 | 2.40 | 2.70 | 34.00 | 29.00 |
| SMS1770-3R3M | 3.3 | 20% | 3.3 | 3.68 | 4.20 | 30.00 | 24.00 |
| SMS1770-4R7M | 4.7 | 20% | 4.7 | 4.84 | 5.50 | 24.00 | 21.00 |
| SMS1770-5R6M | 5.6 | 20% | 5.6 | 6.68 | 7.60 | 23.00 | 20.00 |
| SMS1770-6R8M | 6.8 | 20% | 6.8 | 8.40 | 9.20 | 22.00 | 17.00 |
| SMS1770-8R2M | 8.2 | 20% | 8.2 | 10.10 | 11.60 | 20.00 | 13.00 |
| SMS1770-100M | 10 | 20% | 10 | 11.60 | 13.00 | 19.00 | 12.00 |
| SMS1770-150M | 15 | 20% | 15 | 18.80 | 20.50 | 14.50 | 11.00 |
| SMS1770-220M | 22 | 20% | 22 | 25.10 | 26.50 | 11.50 | 8.50 |
| SMS1770-330M | 33 | 20% | 33 | 38.00 | 44.00 | 10.00 | 8.00 |
| SMS1770-470M | 47 | 20% | 47 | 48.00 | 55.00 | 7.50 | 6.00 |
| SMS1770-560M | 56 | 20% | 56 | 54.00 | 62.00 | 7.00 | 5.50 |
| SMS1770-680M | 68 | 20% | 68 | 68.00 | 80.00 | 6.50 | 5.20 |
| SMS1770-101M | 100 | 20% | 100 | 110.00 | 118.00 | 5.00 | 3.70 |
Inductance Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
- Note: Part temperature should be verified in the end application, as it is affected by circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions.
Packaging:
| Packing Type | Description |
|---|---|
| B | Bulk Package |
| TF | Tape & Reel |
Tape and Reel Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS1770 | 32.0 | 24.0 | 14.2 | 32.4 | 100 | 13 | 330 | 300 | 600 | 2400 |
Cover tape peel off condition:
- a) Cover tape peel force shall be 10 to 120g.
- b) Noodle strip peeling angle 165 to 180.
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test: Force applied based on terminal cross-sectional area (5N for 8mm, 10N for 8-20mm, 20N for >20mm), duration 10-30 sec. Solder paste thickness: 0.12mm. Solder with lead-free solder. Force applied gradually and maintained for 101s at 1.0mm/s speed. (Ref: GB/T 2423.60-2008) |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (5N for 0.35-0.50mm, 10N for 0.50-0.80mm, 20N for 0.80-1.25mm, 40N for >1.25mm), duration 10 sec. Pull force applied gradually and maintained for 10 sec. (Ref: GB/T 2423.60-2008) |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig (glass epoxy board) with lead-free solder. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. (Ref: JIS C 5321:1997) |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. (Ref: GB/T 2423.7-2018) |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol by weight. (Ref: GB/T 2423.28-2005) |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to testing jig (glass epoxy board) with lead-free solder. Simple harmonic motion, amplitude 1.5mm, frequency 10-55 Hz (traversed in 1 min). Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). (Ref: GB/T 2423.10-2019) |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Start at (85~125) for T time, rush to (-55~40) for T time as one cycle, go through 100 cycles. Transforming interval: Max. 20 sec. Stabilize at normal condition for 1-2 hours before measuring. (Ref: GB/T 2423.22-2012 Method Na) |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring. (Ref: GB/T 2423.1-2008 Method Ab) |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring. (Ref: GB/T 2423.2-2008 Method Bb) |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring. (Ref: GB/T 2423.3-2016) |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. (Ref: GJB 360B-2009) |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then dry at room temp for 5Min, then brush 10 times. (Ref: IEC 68-2-45:1993) |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. | Apply twice the rated current for 5 minutes. (Ref: JIS C5311-6.13) |
| Voltage resistance test | During the test no breakdown. Characteristics are normal after test. | For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. (Ref: MIL-STD-202G Method 301) |
Recommended Reflow Soldering Curve:
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products:
- Storage: Within 12 months. Conditions: 5~40C, 35-65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for self-heating (temperature increase) when power is ON.
- Layout (Non-magnetic shield type): Carefully lay out coils to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina