Compact axial fixed inductors LanTu Micro AL0510-472K ideal for electronic devices and RF applications
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Product Description
Axial Fixed Inductors - AL0510 Series
Product Overview
The AL0510 Series Axial Fixed Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for reliability and performance in a wide range of electronic applications. These compact, lightweight RF chokes feature an epoxy resin coating for enhanced humidity resistance and longevity. With a wide inductance range, high Q values, and high self-resonant frequencies, they are ideal for use in televisions, personal computers, radios, telephones, chargers, and other electronic devices. The series also offers tape packaging for automated insertion, ensuring efficient manufacturing processes.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: AL0510 Series
- Type: Axial Fixed Inductors (Leaded RF Chokes)
- Coating: Epoxy resin
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Tape packaging for auto-insertion, Bulk Package
Technical Specifications
General Specifications
| Parameter | Value |
|---|---|
| Operating Temperature | -25 to +85 (including coils self-temperature rise) |
| External Dimensions (L x H) | 5.0 x 11.0 mm (for AL0510 series) |
| Lead Diameter | 0.600.1 mm |
Electrical Characteristics (at 25)
| Part No | Inductance (uH) | Tolerance | Q Min @ Test Freq. (MHz) | SRF Min (MHz) | DCR Max () | Rated Current (mA) Max |
|---|---|---|---|---|---|---|
| AL0510-3R3M | 3.3 | 20% | 20 @ 7.96MHz | 50 | 0.18 | 1100 |
| AL0510-4R7M | 4.7 | 20% | 20 @ 7.96MHz | 45 | 0.20 | 1000 |
| AL0510-6R8M | 6.8 | 20% | 20 @ 7.96MHz | 45 | 0.25 | 790 |
| AL0510-100K | 10 | 10% | 15 @ 7.96MHz | 30 | 0.45 | 750 |
| AL0510-150K | 15 | 10% | 15 @ 7.96MHz | 30 | 0.50 | 650 |
| AL0510-220K | 22 | 10% | 30 @ 2.52MHz | 8.0 | 0.65 | 500 |
| AL0510-330K | 33 | 10% | 30 @ 2.52MHz | 6.0 | 0.75 | 400 |
| AL0510-470K | 47 | 10% | 30 @ 2.52MHz | 6.3 | 0.8 | 370 |
| AL0510-680K | 68 | 10% | 30 @ 2.52MHz | 5.0 | 0.8 | 350 |
| AL0510-820K | 82 | 10% | 20 @ 2.52MHz | 3.8 | 0.82 | 330 |
| AL0510-101K | 100 | 10% | 20 @ 2.52MHz | 3.5 | 0.90 | 300 |
| AL0510-121K | 120 | 10% | 20 @ 0.796MHz | 3.3 | 1.20 | 250 |
| AL0510-151K | 150 | 10% | 20 @ 0.796MHz | 3.2 | 1.80 | 225 |
| AL0510-181K | 180 | 10% | 20 @ 0.796MHz | 2.8 | 2.00 | 200 |
| AL0510-221K | 220 | 10% | 30 @ 0.796MHz | 2.6 | 2.10 | 180 |
| AL0510-271K | 270 | 10% | 30 @ 0.796MHz | 2.4 | 2.50 | 170 |
| AL0510-331K | 330 | 10% | 30 @ 0.796MHz | 2.2 | 3.00 | 160 |
| AL0510-391K | 390 | 10% | 30 @ 0.796MHz | 2.0 | 3.50 | 150 |
| AL0510-471K | 470 | 10% | 30 @ 0.796MHz | 1.9 | 4.00 | 140 |
| AL0510-561K | 560 | 10% | 30 @ 0.796MHz | 1.8 | 5.40 | 130 |
| AL0510-681K | 680 | 10% | 40 @ 0.796MHz | 1.5 | 6.00 | 120 |
| AL0510-821K | 820 | 10% | 50 @ 0.796MHz | 1.2 | 7.50 | 110 |
| AL0510-102K | 1000 | 10% | 50 @ 0.252MHz | 1.0 | 8.00 | 100 |
| AL0510-122K | 1200 | 10% | 60 @ 0.252MHz | 0.95 | 14.50 | 95 |
| AL0510-152K | 1500 | 10% | 60 @ 0.252MHz | 0.9 | 16.50 | 90 |
| AL0510-182K | 1800 | 10% | 60 @ 0.252MHz | 0.9 | 19.00 | 85 |
| AL0510-222K | 2200 | 10% | 60 @ 0.252MHz | 0.8 | 27.50 | 80 |
| AL0510-272K | 2700 | 10% | 60 @ 0.252MHz | 0.75 | 40.00 | 75 |
| AL0510-332K | 3300 | 10% | 50 @ 0.252MHz | 0.7 | 50.00 | 62 |
| AL0510-392K | 3900 | 10% | 50 @ 0.252MHz | 0.65 | 53.00 | 59 |
| AL0510-472K | 4700 | 10% | 50 @ 0.252MHz | 0.6 | 60.00 | 55 |
| AL0510-562K | 5600 | 10% | 50 @ 0.252MHz | 0.5 | 64.00 | 40 |
| AL0510-682K | 6800 | 10% | 50 @ 0.252MHz | 0.45 | 73.00 | 35 |
| AL0510-822K | 8200 | 10% | 30 @ 0.252MHz | 0.4 | 80.00 | 30 |
| AL0510-103K | 10000 | 10% | 25 @ 79.6KHz | 0.35 | 132.00 | 25 |
| AL0510-123K | 12000 | 10% | 25 @ 79.6KHz | 0.3 | 143.00 | 20 |
| AL0510-153K | 15000 | 10% | 25 @ 79.6KHz | 0.25 | 166.00 | 18 |
| AL0510-183K | 18000 | 10% | 25 @ 79.6KHz | 0.2 | 185.00 | 15 |
| AL0510-223K | 22000 | 10% | 20 @ 79.6KHz | 0.15 | 330.00 | 12 |
| AL0510-273K | 27000 | 10% | 20 @ 79.6KHz | 0.1 | 370.00 | 10 |
| AL0510-333K | 33000 | 10% | 40 @ 79.6KHz | 0.25 | 240.00 | 10 |
Current Definitions
- Saturation Current (Isat): The current at which inductance drops by 10% from its initial value (Ta=25).
- Temperature Rise Current (Irms): The DC current that causes a temperature rise of T 40 (Ta=25).
- Rated DC Current: The lower value between Isat and Irms.
Packaging
| Series Type | Packaging | Quantity (pcs) | Carton Size (mm) (L x W x H) | Parts/Box | Parts/Reel | Parts/Carton |
|---|---|---|---|---|---|---|
| T5A | Tape and reel | 1000 | 440 x 275 x 392 | - | - | 24,000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT/DIP) | Meet requirements without any loose terminal. | Refer to GB/T 2423.60-2008. Specific forces and durations vary based on terminal size. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm, Speed: 0.5mm/s, Keep time: 30s. |
| Dropping | No case deformation or change in appearance, no short and no open. | GB/T 2423.7-2018. Packaged products dropped from 1m height. |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temperature: 2402, Duration: 3s. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Frequency 10-55 Hz, amplitude 1.5mm, 2 hours in 3 directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.22-2012 (Method Na). 100 cycles between -55~40 and 85~125. |
| Low Temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.1-2008 (Method Ab). Temperature: -55~-402, Duration: 962 hours. |
| High Temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.2-2008 (Method Bb). Temperature: 125~852, Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602, Humidity: 90%-95% RH, Duration: 962 hours. |
| Heat Endurance of Reflow Soldering | No significant defALts in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | GJB 360B-2009. Peak temperature: 260+0/-5. Tested twice. |
| Resistance to Solvent Test | No case deformation or change in appearance or obliteration of marking. | IAL 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload Test | During test: no smoke, no pALuliar smell, no fire. Characteristics normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage Resistance Test | During test: no breakdown. Characteristics normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. |
Recommended Lead-free Wave Soldering (DIP-Type)
The recommended wave soldering is a reference. Users should adjust and confirm soldering conditions based on their specific environment and equipment.
Soldering Iron (Rework)
- Use soldering iron by hand; times do not exceed 350 degrees for 3 times.
- Avoid contacting the inductor itself or the wire when soldering.
- Soldering by soldering iron is not recommended.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Deterioration of solderability may occur beyond this period.
- Environment: Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle carefully to prevent damage from dropping.
- Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not clean the products; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Keep away from magnets or objects with magnetic force.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Correction: Post-mounting soldering corrections must be within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Account for self-heating when power is ON in thermal design.
- Non-Magnetic Shield Type: Carefully consider coil placement on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina