unshielded dip power inductor LanTu Micro SPK0810-151MB for spike suppression and power applications
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Product Description
Unshielded DIP Power Inductors - SPK Series
Product Overview
The SPK Series Unshielded DIP Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for spike suppression and general power applications. These inductors offer a low-cost solution with high power handling, high saturation, and low resistance. Their unshielded construction, coupled with core encapsulation in UL heat shrink tubing, provides excellent mechanical and environmental protection. Available in various package sizes and a wide inductance range, they are suitable for automated insertion processes. The SPK series is RoHS, Halogen Free, and REACH compliant, making them a reliable choice for modern electronic designs.
Product Attributes
- Brand: LANTU
- Origin: SHENZHEN
- Product Series: SPK
- Type: Unshielded DIP Power Inductor, Spike suppression coil
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Tape packaging for auto-insertion, Bulk Package
Technical Specifications
| Model | Inductance Range | Dimensions (L x W x H, mm) | Operating Temperature | Inductance Tolerance |
|---|---|---|---|---|
| SPK0406 | 1.0 H to 563 H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK0608 | 3.3 H to 154 H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK0707 | 1.0 H to 152 H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK0807 | 2.2 H to 152 K H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK0810 | 3.3 H to 104 H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK0912 | 1.0 H to 333 H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK1010 | 3.3 H to 153 K H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK1012 | 3.3 H to 393 K H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK1016 | 4.7 H to 103 K H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
| SPK1018 | 4.7 K H to 104 K H | (Refer to Shape and Dimensions table) | -40 to +125 | K (10%) |
| SPK1213 | 10 M H to 103 K H | (Refer to Shape and Dimensions table) | -40 to +125 | M (20%), K (10%) |
Applications
- TVs and Audio equipment
- Telecommunication devices
- Noise filters
- Chargers, fast charge
- DC/DC converters
Test Equipment Used
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Saturation Current (Isat) & RMS Current (Irms): HP4284+42841A or equivalent
- Self-Resonant Frequency (SRF): HM 9461 or equivalent
- Quality Factor (Q): HP4285A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Shape and Dimensions (mm)
| Part No | A (Max) | B (Min) | C () | D (Max) | E () | F | H |
|---|---|---|---|---|---|---|---|
| SPK0406 | 8.0 | 15.0 | 2.0 | 5.0 | 0.55 | 0.85 | 2.0 |
| SPK0608 | 11.0 | 15.0 | 2.5 | 7.0 | 0.65 | 0.95 | 2.5 |
| SPK0707 | 9.5 | 15.0 | 5.0 | 8.0 | 0.65 | 0.95 | 5.0 |
| SPK0807 | 9.5 | 15.0 | 5.0 | 9.0 | 0.65 | 0.95 | 5.0 |
| SPK0810 | 13.0 | 15.0 | 5.0 | 9.0 | 0.65 | 0.95 | 5.0 |
| SPK0912 | 15.0 | 15.0 | 5.0 | 10.0 | 0.80 | 1.1 | 5.0 |
| SPK1010 | 13.0 | 15.0 | 5.0 | 12.0 | 0.80 | 1.1 | 5.0 |
| SPK1012 | 15.0 | 15.0 | 6.0 | 12.0 | 0.80 | 1.1 | 6.0 |
| SPK1016 | 19.0 | 15.0 | 6.0 | 12.0 | 0.80 | 1.1 | 6.0 |
| SPK1018 | 21.0 | 15.0 | 6.0 | 12.0 | 0.80 | 1.1 | 6.0 |
| SPK1213 | 16.0 | 15.0 | 7.5 | 14.0 | 0.80 | 1.1 | 7.5 |
Product Identification
SPK 0608 503 K TF
- SPK: Type
- 0608: External Dimensions (L x H) (mm)
- 503: Inductance (50 mH)
- K: Inductance Tolerance (e.g., J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%)
- TF: Packaging (TF: Tape)
Reliability Testing
| Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT/DIP) | Meet requirements without loose terminals | Pulling test, Solder paste thickness, Terminal diameter based force application |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation, no short/open | Drop from 1m height, 1 angle, 3 ridges, 6 surfaces, twice each |
| Solderability | Wetting > 75% coverage, Terminals 95% minimum solder coverage | Solder temp: 2402, Duration: 3 sec, Solder: Sn/3.0Ag/0.5Cu |
| Vibration | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | 10-55 Hz frequency sweep, 2 hours in 3 perpendicular directions |
| Thermal Shock | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | 100 cycles of temperature cycling (-55~40 to 85~125) |
| Low Temperature Storage | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | -402 for 962 hours |
| High Temperature Storage | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | 852 for 962 hours |
| Damp Heat (Steady States) | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | 602, 90%-95% RH for 962 hours |
| Heat Endurance of Reflow Soldering | Appearance normal, L/L10%, Q/Q30%, DCR/DCR10% | Peak temp: 260+0/-5, Twice reflow |
| Resistance to Solvent Test | No case deformation or obliteration of marking | Dip in IPA solvent, brush 10 times |
| Overload Test | No smoke, smell, fire; characteristics normal after test | Apply twice rated current for 5 minutes |
| Voltage Resistance Test | No breakdown; characteristics normal after test | DC1000V, Current: 1mA, Time: 1Min |
Reminders for Using These Products
- Storage period within 12 months; conditions: 5~40C, 35~65% RH.
- Avoid use/storage in corrosive gas environments (salt, acid, alkali).
- Do not touch terminals directly with bare hands to maintain solderability.
- Handle carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact manufacturer if cleaning is necessary.
- Keep away from magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid overheating.
- Allow for sufficient thermal design margin due to self-heating when power is on.
- For non-magnetic shield types, careful coil layout is needed to prevent malfunction due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina