Magnetic Resin Shielded SMD Power Inductor LanTu Micro SNR6028-220MT for High Current Applications
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Product Description
Product Overview
The SNR6028 Series is an automatically assembled, magnetic resin shielded SMD power inductor designed for high-current applications with low DC resistance. Its construction significantly reduces buzz noise to ultra-low levels and offers strong EMI resistance due to a closed magnetic circuit design. This series is space-saving and power-efficient, making it suitable for a wide range of electronic devices including LED backlights, flat-screen TVs, notebooks, servers, graphics cards, and automotive products, as well as DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR6028
- Construction: Magnetic resin shielded, automatic assembly
- Certifications: RoHS, Halogen Free, REACH Compliance
- Core Material: Ferrite Core (Metallization on Ferrite Core)
- Magnetic Circuit: Closed magnetic circuit design
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Frequency | Voltage | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|---|---|---|
| SNR6028-R68M | 0.68 | 20% | 100KHz | 1.0V | 0.010 | 0.013 | 6.90 | 5.20 | 6.06.03.0 |
| SNR6028-1R0M | 1.0 | 20% | 100KHz | 1.0V | 0.010 | 0.013 | 5.75 | 5.20 | 6.06.03.0 |
| SNR6028-1R5M | 1.5 | 20% | 100KHz | 1.0V | 0.013 | 0.016 | 5.50 | 4.58 | 6.06.03.0 |
| SNR6028-2R2M | 2.2 | 20% | 100KHz | 1.0V | 0.020 | 0.026 | 5.10 | 3.75 | 6.06.03.0 |
| SNR6028-3R3M | 3.3 | 20% | 100KHz | 1.0V | 0.025 | 0.032 | 4.15 | 3.48 | 6.06.03.0 |
| SNR6028-4R7M | 4.7 | 20% | 100KHz | 1.0V | 0.030 | 0.039 | 3.00 | 3.08 | 6.06.03.0 |
| SNR6028-6R8M | 6.8 | 20% | 100KHz | 1.0V | 0.047 | 0.061 | 2.60 | 2.40 | 6.06.03.0 |
| SNR6028-8R2M | 8.2 | 20% | 100KHz | 1.0V | 0.055 | 0.071 | 2.30 | 2.25 | 6.06.03.0 |
| SNR6028-100M | 10 | 30% | 100KHz | 1.0V | 0.074 | 0.093 | 2.04 | 1.95 | 6.06.03.0 |
| SNR6028-120M | 12 | 30% | 100KHz | 1.0V | 0.080 | 0.104 | 1.80 | 1.85 | 6.06.03.0 |
| SNR6028-150M | 15 | 30% | 100KHz | 1.0V | 0.125 | 0.162 | 1.75 | 1.45 | 6.06.03.0 |
| SNR6028-180M | 18 | 30% | 100KHz | 1.0V | 0.120 | 0.169 | 1.52 | 1.45 | 6.06.03.0 |
| SNR6028-220M | 22 | 30% | 100KHz | 1.0V | 0.140 | 0.182 | 1.45 | 1.40 | 6.06.03.0 |
| SNR6028-330M | 33 | 20% | 100KHz | 1.0V | 0.185 | 0.240 | 1.35 | 1.22 | 6.06.03.0 |
| SNR6028-390M | 39 | 20% | 100KHz | 1.0V | 0.225 | 0.292 | 1.25 | 1.10 | 6.06.03.0 |
| SNR6028-470M | 47 | 20% | 100KHz | 1.0V | 0.315 | 0.400 | 1.15 | 1.06 | 6.06.03.0 |
| SNR6028-680M | 68 | 20% | 100KHz | 1.0V | 0.360 | 0.468 | 0.80 | 0.86 | 6.06.03.0 |
| SNR6028-820M | 82 | 20% | 100KHz | 1.0V | 0.500 | 0.650 | 0.75 | 0.70 | 6.06.03.0 |
| SNR6028-101M | 100 | 20% | 100KHz | 1.0V | 0.550 | 0.675 | 0.65 | 0.70 | 6.06.03.0 |
| Operating Temperature: -40 to +125 (Including coils self-temperature rise) | |||||||||
| External Dimensions (LWH): 6.06.03.0 mm | |||||||||
| Inductance Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |||||||||
| Packing Codes: B: Bulk Package, T: Tape & Reel | |||||||||
Packaging Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel Quantity (PCS) | Inside Box Quantity (PCS) | Outside Carton Quantity (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR6028 | 16 | 12 | 7.5 | 16.4 | 100 | 13 | 330 | 2000 | 6000 | 24,000 |
Reliability Testing Summary
| Test Item | Requirements | Test Method Reference |
|---|---|---|
| Terminal Strength (SMT/DIP) | Varies based on terminal area/diameter; no loose terminals. | GB/T 2423.60-2008 |
| Resistance to Flexure | No visible mechanical damage; flexure 2mm. | JIS C 5321:1997 |
| Dropping Test | No case deformation or appearance change; no short/open. | GB/T 2423.7-2018 |
| Solderability | Wetting >75% coverage; 95% minimum solder coverage on terminals. | GB/T 2423.28-2005 |
| Vibration Test | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | GB/T 2423.10-2019 |
| Thermal Shock | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | GB/T 2423.22-2012 (Method Na) |
| Low Temperature Storage | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | GB/T 2423.1-2008 (Method Ab) |
| High Temperature Storage | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | GB/T 2423.2-2008 (Method Bb) |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | GB/T 2423.3-2016 |
| Heat endurance of Reflow soldering | No significant defects; L/L10%; Q/Q30%; DCR/DCR10%. | GJB 360B-2009 |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993 |
| Overload test | No smoke, smell, fire; characteristics normal after test. | JIS C5311-6.13 |
| Voltage resistance test | No breakdown during test; characteristics normal after test. | MIL-STD-202G Method 301 |
Usage Reminders
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Terminal solderability may deteriorate after storage.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage from dropping.
- Terminal Bending: Do not excessively bend terminals to prevent wire fracture.
- Cleaning: Do not rinse coils independently; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Ensure preheating before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform post-mounting soldering corrections within specified conditions to avoid overheating, short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina