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Shielded SMD Power Inductors LanTu Micro SDRH105R-3R3NT for VTRs LCD Televisions and Notebook PCs

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Product Description

Product Overview

The SDRH105R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. These inductors feature a closed magnetic circuit for reduced leakage flux, high saturation current, and low DCR. Their highly accurate dimensions ensure compatibility with automatic mounting processes. Available in various package sizes and a wide inductance range, they meet RoHS, Halogen Free, and REACH compliance. Ideal for use in VTRs, LCD televisions, Notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

  • Brand: LANTU MICRO
  • Series: SDRH105R
  • Type: Shielded SMD Power Inductors
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.

Technical Specifications

Part No. Inductance (H) Tolerance Test Freq. DCR () Max @ 0A Saturation Current (A) Max Temperature Rise Current (A) Max Dimensions (LWH) (mm)
SDRH105R-3R3N 3.3 30% 100KHz 0.013 9.50 6.50 10.310.55.0
SDRH105R-4R7N 4.7 30% 100KHz 0.016 9.20 6.30 10.310.55.0
SDRH105R-6R8N 6.8 30% 100KHz 0.020 7.00 6.00 10.310.55.0
SDRH105R-8R2N 8.2 30% 100KHz 0.023 5.50 5.00 10.310.55.0
SDRH105R-100N 10 30% 100KHz 0.250 5.10 4.40 10.310.55.0
SDRH105R-120N 12 30% 100KHz 0.032 4.90 4.00 10.310.55.0
SDRH105R-150N 15 30% 100KHz 0.040 4.20 3.60 10.310.55.0
SDRH105R-180M 18 20% 100KHz 0.046 3.70 3.40 10.310.55.0
SDRH105R-220M 22 20% 100KHz 0.058 3.30 3.20 10.310.55.0
SDRH105R-270M 27 20% 100KHz 0.650 3.20 3.00 10.310.55.0
SDRH105R-330M 33 20% 100KHz 0.810 2.70 2.60 10.310.55.0
SDRH105R-390M 39 20% 100KHz 0.103 2.48 2.50 10.310.55.0
SDRH105R-470M 47 20% 100KHz 0.122 2.35 2.30 10.310.55.0
SDRH105R-560M 56 20% 100KHz 0.144 2.30 2.10 10.310.55.0
SDRH105R-680M 68 20% 100KHz 0.193 2.00 1.90 10.310.55.0
SDRH105R-820M 82 20% 100KHz 0.219 1.80 1.60 10.310.55.0
SDRH105R-101M 100 20% 100KHz 0.247 1.50 1.35 10.310.55.0
SDRH105R-121M 120 20% 100KHz 0.298 1.40 1.18 10.310.55.0
SDRH105R-151M 150 20% 100KHz 0.355 1.30 1.10 10.310.55.0
SDRH105R-181M 180 20% 100KHz 0.393 1.20 1.00 10.310.55.0
SDRH105R-221M 220 20% 100KHz 0.483 1.08 0.94 10.310.55.0
SDRH105R-271M 270 20% 100KHz 0.632 0.88 0.80 10.310.55.0
SDRH105R-331M 330 20% 100KHz 0.780 0.85 0.73 10.310.55.0
SDRH105R-391M 390 20% 100KHz 0.957 0.78 0.70 10.310.55.0
SDRH105R-471M 470 20% 100KHz 1.220 0.71 0.54 10.310.55.0
SDRH105R-561M 560 20% 100KHz 1.352 0.65 0.52 10.310.55.0
SDRH105R-681M 680 20% 100KHz 1.519 0.59 0.51 10.310.55.0
SDRH105R-821M 820 20% 100KHz 1.694 0.51 0.48 10.310.55.0
SDRH105R-102M 1000 20% 100KHz 1.946 0.49 0.42 10.310.55.0

Environmental Data

  • Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment

  • Inductance (L): HP4284A, HP4285A LCR meter or equivalent
  • Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A
  • DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification

SDRH 105R 100 N T

  • Type: SDRH (Shielded SMD Power Inductors)
  • Outer Dimensions: 105R (10.310.55.0 mm)
  • Inductance: 100 (10 H)
  • Inductance Tolerance: N (30%) (J:5%, K: 10%, L: 15%, M: 20%, P: 25%)
  • Packing: T (Tape & Reel), B (Bulk Package)

Shape and Dimensions

External Dimensions (LWH): 10.3 Max 10.5 Max 5.0 Max (mm)

Part No. A (Max) B (Max) C (Max) D E F H I J
SDRH105R 10.3 10.5 5.0 7.7 3.0 1.2 3.6 1.7 7.3

Packaging Specifications

Tape and Reel Specifications

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SDRH105R 24 16 11.5 24.4 60 13 330 800 1600 6400

Cover Tape Peel Off Condition

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Packing Quantity

REEL | PE Bag | Inside Box | Outside Carton

(Insufficient full cartons will be filled with inner boxes or cushioning material)

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test based on terminal sectional area (8mm, 8-20mm, >20mm). Solder the inductor using lead-free solder. Apply force gradually and maintain for 101s at 1.0mm/s speed. Solder paste thickness: 0.12mm. Reference documents: GB/T 2423.60-2008.
Terminal Strength (DIP) Meet requirements without any loose terminal. Pull Force applied to terminal for 10 seconds based on terminal diameter (0.35-0.50mm, 0.50-0.80mm, 0.80-1.25mm, >1.25mm). Reference documents: GB/T 2423.60-2008.
Resistance to Flexure No visible mechanical damage. Solder inductor to test jig (glass epoxy board) using lead-free solder. Apply force in specified direction with 2mm flexure at 0.5mm/sec speed for 30 sec. Reference: JIS C 5321:1997.
Dropping No case deformation or change in appearance. No short and no open. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. Reference documents: GB/T 2423.7-2018.
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. Reference documents: GB/T 2423.28-2005.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Solder inductor to test jig. Subject to simple harmonic motion (10-55 Hz, 1.5mm amplitude) for 2 hours in 3 mutually perpendicular directions (total 6 hours). Reference documents: GB/T 2423.10-2019.
Thermal Shock No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec. Stabilize at normal condition for 1-2 hours before measuring. Reference documents: GB/T 2423.22-2012 Method Na.
Low temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring. Reference documents: GB/T 2423.1-2008 Method Ab.
High temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: 85~1252. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring. Reference documents: GB/T 2423.2-2008 Method Bb.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring. Reference documents: GB/T 2423.3-2016.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. Perform reflow soldering twice according to the recommended curve. Peak temperature: 260+0/-5. Reference documents: GJB 360B-2009.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. Reference documents: IEC 68-2-45:1993.
Overload test During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. Apply twice the rated current for 5 minutes. Reference documents: JIS C5311-6.13.
Voltage resistance test During the test no breakdown. Characteristics are normal after test. DC1000V, Current: 1mA, Time: 1Min. For parts with two coils. Reference: Catalogue of specific products. Reference documents: MIL-STD-202G Method 301.

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to soldering equipment. Adjust and confirm according to user's environment/equipment.

Reminders for Using These Products

  • Storage: Within 12 months, under conditions (5~40C, 35-65% RH or less). Soldering of terminal electrodes may deteriorate if storage period elapses.
  • Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oil secretions that may inhibit soldering. Handle products carefully to prevent damage from dropping or inappropriate removal.
  • Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
  • Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Be sure to preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
  • Soldering Corrections: Post-mounting soldering corrections should be within specification limits. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Allow sufficient margin for thermal design, as self-heating occurs when power is ON.
  • Non-Magnetic Shield Type: Carefully lay out the coil on the circuit board to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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