Magnetic resin shielded LanTu Micro SNR4018-330MT power inductors with space saving and power profile

Product Overview

The SNR4018 Series Magnetic Resin Shielded SMD Power Inductors are automatic assembly constructed power inductors designed for high-performance applications. Featuring a magnetic-resin shielded construction, these inductors significantly reduce buzz noise to ultra-low levels. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design for reduced leakage flux and enhanced EMI resistance, and a space-saving, power-efficient profile. These inductors are widely used in electronic devices such as LED backlights, flat-screen TVs, notebooks, servers, graphics cards, and automotive systems, as well as in DC-DC converters. They comply with RoHS, Halogen Free, and REACH standards.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SNR4018
• Construction: Automatic assembly, Magnetic resin shielded
• Certifications: RoHS, Halogen Free, REACH Compliance
• Core Material: Ferrite Core (metallized electrodes)
• Magnetic Circuit: Closed magnetic circuit design

Technical Specifications

Note on Current Ratings:

• Saturation Current: DC current at which inductance drops 30% from its value without current.
• Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value of Isat or Irms.
• Special Remind: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Reminders for Using These Products:

• Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35 to 65% RH or less.
• Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
• Avoid touching electrodes directly with bare hands due to oil secretions that may inhibit soldering.
• Handle products carefully to prevent damage from dropping or inappropriate removal.
• Do not bend terminals with excessive stress to avoid wire fracture.
• Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Do not expose products to magnets or magnetic fields.
• Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
• Allow for sufficient thermal design margin as self-heating occurs when power is on.