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Molding SMD Power Inductors LanTu Micro SMS0850-470MT designed for high density electronic applications

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Product Description

Molding SMD Power Inductors - SMS0850 Series

The SMS0850 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors designed for demanding applications. These inductors feature a thin profile with low DC resistance and ultra-high current capabilities. Their magnetic shielding provides strong anti-electromagnetic interference, making them suitable for high-density installations. The integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Utilizing low-loss alloy powder die-casting, these inductors offer low impedance and small parasitic capacitance, contributing to high efficiency and reduced core eddy-current loss. They operate at frequencies up to 1-2MHz and have an absolute maximum voltage of 30VDC. The series is RoHS, Halogen Free, and REACH compliant.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SMS0850
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance

Applications

  • PDA, notebook, desktop, server applications
  • High current POL converters
  • Battery powered devices
  • DC/DC converters in distributed power systems

Technical Specifications

Part No. Inductance (H) Inductance Tolerance Test Frequency (KHz) Test Voltage (V) DCR (m) Typical DCR (m) Max Saturation Current (A) Typical Heat Rating Current (A) Typical Dimensions (LWH) (mm)
SMS0850-R56M 0.56 20% 100 1.0 3.0 4.5 30.00 24.00 8.58.05.0
SMS0850-R68M 0.68 20% 100 1.0 3.6 6.0 25.00 23.00 8.58.05.0
SMS0850-1R0M 1.0 20% 100 1.0 4.1 5.5 20.00 19.00 8.58.05.0
SMS0850-1R5M 1.5 20% 100 1.0 5.0 7.0 19.00 17.00 8.58.05.0
SMS0850-2R2M 2.2 20% 100 1.0 8.2 12.0 16.00 14.00 8.58.05.0
SMS0850-3R3M 3.3 20% 100 1.0 11.0 15.0 13.00 12.00 8.58.05.0
SMS0850-4R7M 4.7 20% 100 1.0 15.0 20.0 12.00 9.50 8.58.05.0
SMS0850-5R6M 5.6 20% 100 1.0 25.0 28.5 11.00 9.00 8.58.05.0
SMS0850-100M 10 20% 100 1.0 35.0 45.0 8.00 6.20 8.58.05.0
SMS0850-150M 15 20% 100 1.0 55.0 65.0 7.00 5.40 8.58.05.0
SMS0850-220M 22 20% 100 1.0 78.0 88.0 5.50 4.80 8.58.05.0
SMS0850-330M 33 20% 100 1.0 120.0 140.0 6.00 3.50 8.58.05.0
SMS0850-470M 47 20% 100 1.0 177.0 190.0 4.00 2.90 8.58.05.0
SMS0850-560M 56 20% 100 1.0 188.0 226.0 3.00 2.50 8.58.05.0
SMS0850-680M 68 20% 100 1.0 280.0 310.0 2.80 2.00 8.58.05.0

Environmental Data

  • Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Test Equipment

  • Inductance (L): WK3260B LCR meter or equivalent
  • Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification

Model Number Structure: SMS 0850 [Inductance Value] [Tolerance Code] [Packing Code]

  • Type: SMS
  • Dimensions: 0850 (8.58.05.0 mm)
  • Inductance: e.g., 100 (10 H)
  • Tolerance Code: M (20%)
  • Packing Code: T (Tape & Reel)

Shape and Dimensions

External Dimensions (LWH): 8.58.05.0 mm

Part No. A (0.50) B (0.30) C (Max) D (0.30) E (0.30) F G H
SMS0850 8.5 8.0 5.00 3.0 1.8 4.5 9.5 3.5

(Dimensions are in mm)

Recommended Land Pattern

(Refer to provided diagram for land pattern details)

Packaging

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SMS0850 24.0 12.0 11.5 24.4 100 13 330 1000 2000 8000

(Tape and Reel Specifications provided)

Reliability Testing

(Detailed reliability test items, requirements, and methods are provided in the original document, including Terminal Strength, Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low temperature Storage, High temperature Storage, Damp Heat, Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test.)

Recommended Reflow Soldering Curve

(A recommended reflow soldering curve is provided in the original document. Users should adjust and confirm conditions based on their specific environment and equipment.)

Reminders for Using These Products

  • Storage: Within 12 months, under conditions of 5~40C and 35~65% RH.
  • Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oils affecting solderability. Handle carefully to prevent damage.
  • Terminal Bending: Do not excessively bend terminals to prevent wire fracture.
  • Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Magnetism: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Perform after mounting within specified conditions; overheating can cause issues.
  • Thermal Design: Allow sufficient margin for self-heating when power is on.
  • Non-Magnetic Shield Type: Careful layout is needed on the circuit board to avoid malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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