High Rated Current LanTu Micro SCD3521-100MT Unshielded SMD Power Inductors for Surface Mount Applications
Unshielded SMD Power Inductors - SCD3521 Series
Product Overview
The SCD3521 Series offers unshielded SMD power inductors designed for surface mounting equipment. These low-cost inductors feature a silver-plated type construction, providing a small size with high rated current and low DC resistance. They are suitable for a wide range of applications including power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. The series complies with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SCD3521
- Type: Unshielded SMD Power Inductors
- Construction: Silver plated type, Low cost design
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging: Bulk Package (B), Tape & Reel (T)
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Frequency (L @ 0A) | SRF Typ (MHz) | DCR Typ () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|---|
| SCD3521-1R0M | 1.0 | M (20%) | 100KHz | 120 | 0.045 | 3.30 | 2.20 | 3.52.11.0 |
| SCD3521-1R2M | 1.2 | M (20%) | 100KHz | 100 | 0.050 | 3.00 | 2.10 | 3.52.11.0 |
| SCD3521-1R5M | 1.5 | M (20%) | 100KHz | 85 | 0.055 | 2.70 | 1.70 | 3.52.11.0 |
| SCD3521-1R8M | 1.8 | M (20%) | 100KHz | 75 | 0.070 | 2.50 | 1.65 | 3.52.11.0 |
| SCD3521-2R2M | 2.2 | M (20%) | 100KHz | 62 | 0.085 | 2.30 | 1.60 | 3.52.11.0 |
| SCD3521-2R7M | 2.7 | M (20%) | 100KHz | 53 | 0.100 | 2.20 | 1.40 | 3.52.11.0 |
| SCD3521-3R3M | 3.3 | M (20%) | 100KHz | 47 | 0.120 | 1.95 | 1.04 | 3.52.11.0 |
| SCD3521-3R9M | 3.9 | M (20%) | 100KHz | 41 | 0.125 | 1.85 | 1.00 | 3.52.11.0 |
| SCD3521-4R7M | 4.7 | M (20%) | 100KHz | 38 | 0.135 | 1.60 | 1.00 | 3.52.11.0 |
| SCD3521-5R6M | 5.6 | M (20%) | 100KHz | 33 | 0.145 | 1.55 | 0.95 | 3.52.11.0 |
| SCD3521-6R8M | 6.8 | M (20%) | 100KHz | 31 | 0.200 | 1.40 | 0.95 | 3.52.11.0 |
| SCD3521-8R2M | 8.2 | M (20%) | 100KHz | 27 | 0.250 | 1.20 | 0.92 | 3.52.11.0 |
| SCD3521-100M | 10 | M (20%) | 100KHz | 23 | 0.320 | 1.05 | 0.90 | 3.52.11.0 |
| SCD3521-120M | 12 | M (20%) | 100KHz | 21 | 0.350 | 1.00 | 0.85 | 3.52.11.0 |
| SCD3521-150M | 15 | M (20%) | 100KHz | 19 | 0.460 | 0.90 | 0.75 | 3.52.11.0 |
| SCD3521-180M | 18 | M (20%) | 100KHz | 17 | 0.520 | 0.80 | 0.70 | 3.52.11.0 |
| SCD3521-220M | 22 | M (20%) | 100KHz | 15 | 0.650 | 0.75 | 0.60 | 3.52.11.0 |
| SCD3521-270M | 27 | M (20%) | 100KHz | 14 | 0.750 | 0.70 | 0.55 | 3.52.11.0 |
| SCD3521-330M | 33 | M (20%) | 100KHz | 12 | 0.920 | 0.60 | 0.50 | 3.52.11.0 |
| SCD3521-390M | 39 | M (20%) | 100KHz | 11 | 1.120 | 0.55 | 0.48 | 3.52.11.0 |
| SCD3521-470M | 47 | M (20%) | 100KHz | 10 | 1.270 | 0.50 | 0.45 | 3.52.11.0 |
| SCD3521-560M | 56 | M (20%) | 100KHz | 9.3 | 1.500 | 0.45 | 0.30 | 3.52.11.0 |
| SCD3521-680M | 68 | M (20%) | 100KHz | 8.4 | 2.000 | 0.40 | 0.26 | 3.52.11.0 |
| SCD3521-820M | 82 | M (20%) | 100KHz | 7.5 | 2.150 | 0.35 | 0.23 | 3.52.11.0 |
| SCD3521-101M | 100 | M (20%) | 100KHz | 6.8 | 2.800 | 0.34 | 0.20 | 3.52.11.0 |
| SCD3521-121M | 120 | M (20%) | 100KHz | 6.2 | 3.400 | 0.33 | 0.18 | 3.52.11.0 |
| SCD3521-151M | 150 | M (20%) | 100KHz | 5.5 | 4.200 | 0.28 | 0.16 | 3.52.11.0 |
| SCD3521-181M | 180 | M (20%) | 100KHz | 5.0 | 4.500 | 0.27 | 0.15 | 3.52.11.0 |
| SCD3521-221M | 220 | M (20%) | 100KHz | 4.5 | 5.700 | 0.25 | 0.14 | 3.52.11.0 |
| SCD3521-271M | 270 | M (20%) | 100KHz | 4.0 | 8.500 | 0.22 | 0.10 | 3.52.11.0 |
| SCD3521-331M | 330 | M (20%) | 100KHz | 3.6 | 9.500 | 0.19 | 0.09 | 3.52.11.0 |
Note on Currents:
- Saturation Current: DC current at which inductance drops 10% from its value without current.
- Temperature Rise Current: the actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
- Special remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification
SCD3521-XXXMT where:
- SCD: Type (Unshielded SMD Power Inductors)
- 3521: Series
- XXX: Inductance value (e.g., 100 for 10 H)
- M: Inductance Tolerance (e.g., M: 20%)
- T: Packing (T: Tape & Reel)
Product Dimensions
| Part No. | A (L) | B (W) | C (H) | D | E | F | G |
|---|---|---|---|---|---|---|---|
| SCD3521 | 3.50.3 | 3.00.3 | 2.10.3 | 1.0 | 3.5 | 1.6 | 0.8 |
(Dimensions are in mm)
Recommended Land Pattern
(Refer to datasheet image for diagram)
Packaging
Tape and Reel Specifications:
- Tape Dimension W: 12 mm
- Tape Dimension P: 8 mm
- Tape Dimension W1: 5.5 mm
- Tape Dimension P1: 12.4 mm
- Reel Dimensions A: 100 mm
- Reel Dimensions B: 13 mm
- Reel Dimensions C: 330 mm
- Reel Dimensions D: 3000 PCS
- Outside Carton: 12000 PCS
- Outer Carton: 48,000 PCS
Cover tape peel off condition:
a) Cover tape peel force shall be 10 to 120g
b) Noodle strip peeling angle 165 to 180
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle products carefully to prevent damage.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Allow sufficient thermal design margin as devices generate heat when powered on.
- Non-Magnetic Shield Type: Careful coil layout is required for the circuit board design of non-magnetic shield types to prevent malfunctions due to magnetic interference.
Get in Touch
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