Shielded SMD Power Inductors LanTu Micro SDRI125-680MT with RoHS Halogen Free and REACH Compliance

Shielded SMD Power Inductors - SDRI125 Series

Product Overview

The SDRI125 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit design to minimize leakage flux, these inductors offer high saturation current and low DC resistance. Their highly accurate dimensions ensure compatibility with automatic mounting processes. Available in various package sizes and a wide inductance range, they are RoHS, Halogen Free, and REACH compliant, making them suitable for a broad spectrum of electronic devices.

Product Attributes

• Brand: LANTU MICRO
• Series: SDRI125
• Type: Shielded SMD Power Inductors
• Certifications: RoHS, Halogen Free, REACH Compliance
• Origin: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.

Applications

• Power supply for VTRs
• LCD televisions
• Notebook PCs
• Portable communication equipment
• DC/DC converters

Technical Specifications

General Specifications:

Product Identification Example: SDRI 125 470 M T

Available Inductance Tolerances: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Available Packing: B (Bulk Package), T (Tape & Reel)

Electrical Characteristics (SDRI125 Series):

Definitions:

• Saturation Current: DC current at which inductance drops 30% from its value without current.
• Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value of Isat or Irms.

Shape and Dimensions (mm):

Packaging Specifications:

Cover tape peel off condition:

• Cover tape peel force shall be 10 to 120g.
• Noodle strip peeling angle 165 to 180.

Reminders for Using These Products:

• Storage period is within 12 months. Storage conditions: 5~40C, 35~65% RH or less.
• Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
• Avoid direct contact with terminals by bare hands due to potential soldering inhibition from oils.
• Handle products carefully to prevent damage from dropping or improper removal.
• Do not bend terminals with excessive stress to avoid wire fracture.
• Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Do not expose products to magnets or magnetic fields.
• Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
• Allow for sufficient thermal design margin due to self-heating when power is on.
• For non-magnetic shielded types, carefully lay out coils on the PCB to prevent malfunctions due to magnetic interference.