Unshielded SMD Power Inductors LanTu Micro SSD0804-100MT with Various Inductance and Packaging Options
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Unshielded SMD Power Inductors - SSD0804 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SSD0804 Series offers high-power, unshielded SMD power inductors designed for surface mounting applications. These inductors feature high saturation and low DC resistance, making them suitable for a wide range of electronic devices including laptop computers, LCD televisions, and DC/DC converters. They are available in various package sizes and inductance ranges, and comply with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SSD0804
- Type: Unshielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
General Specifications
| Parameter | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Frequency for L | 100KHz |
| Test Frequency for SRF | 100KHz |
| Inductance Tolerance (Standard) | 20% (M) |
| Inductance Tolerance (Optional) | 5% (J), 10% (K), 15% (L), 25% (P), 30% (N) |
| External Dimensions (LWH) | 0804 (12.959.45.21 mm) |
Electrical Characteristics
| Part No. | Inductance (H) | Tolerance | SRF (MHz) Typ | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|
| SSD0804-1R0M | 1.0 | 20% | 100 | 0.009 | 9.00 | 6.80 |
| SSD0804-1R5M | 1.5 | 20% | 90 | 0.010 | 8.00 | 6.40 |
| SSD0804-2R2M | 2.2 | 20% | 80 | 0.012 | 7.00 | 6.10 |
| SSD0804-3R3M | 3.3 | 20% | 65 | 0.015 | 6.40 | 5.40 |
| SSD0804-4R7M | 4.7 | 20% | 45 | 0.018 | 5.40 | 4.80 |
| SSD0804-6R8M | 6.8 | 20% | 38 | 0.027 | 4.60 | 4.40 |
| SSD0804-100M | 10 | 20% | 30 | 0.038 | 3.80 | 3.90 |
| SSD0804-150M | 15 | 20% | 27 | 0.046 | 3.50 | 3.10 |
| SSD0804-220M | 22 | 20% | 19 | 0.085 | 3.00 | 2.70 |
| SSD0804-330M | 33 | 20% | 15 | 0.100 | 2.60 | 2.10 |
| SSD0804-470M | 47 | 20% | 12 | 0.140 | 2.00 | 1.60 |
| SSD0804-680M | 68 | 20% | 10 | 0.200 | 1.60 | 1.40 |
| SSD0804-101M | 100 | 20% | 9 | 0.280 | 1.40 | 1.20 |
| SSD0804-151K | 150 | 10% | 6 | 0.400 | 1.20 | 1.00 |
| SSD0804-221K | 220 | 10% | 5 | 0.610 | 1.00 | 0.80 |
| SSD0804-331K | 330 | 10% | 4.5 | 1.020 | 0.60 | 0.60 |
| SSD0804-471K | 470 | 10% | 3.5 | 1.270 | 0.50 | 0.50 |
| SSD0804-681K | 680 | 10% | 2.5 | 2.020 | 0.40 | 0.40 |
| SSD0804-102K | 1000 | 10% | 2.0 | 3.000 | 0.30 | 0.30 |
Dimensions (mm)
| Part No. | A (Max) | B (Max) | C (Max) | D | E | F | H | I | J |
|---|---|---|---|---|---|---|---|---|---|
| SSD0804 | 12.95 | 9.4 | 5.21 | 7.62 | 2.54 | 2.54 | 2.79 | 2.92 | 7.37 |
Packaging Quantity
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SSD0804 | 24 | 16 | 11.5 | 24.4 | 100 | 13 | 330 | 1000 | 2000 | 8000 |
Reliability Testing Summary
| Test Item | Requirements | Test Method Reference |
|---|---|---|
| Terminal Strength | Varies based on terminal cross-sectional area (e.g., 5N for 8mm, 10N for 8-20mm, 20N for >20mm), 10s duration. Solder paste thickness 0.12mm. Meet requirements without loose terminals. | GB/T 2423.60-2008 |
| Resistance to Flexure | No visible mechanical damage. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. | JIS C 5321:1997 |
| Dropping Test | No case deformation or appearance change. No short/open circuit. Drop from 1m height, 1 angle, 3 ridges, 6 surfaces, twice each direction. | GB/T 2423.7-2018 |
| Solderability | No visible mechanical damage. Wetting >75% coverage. Terminals 95% minimum solder coverage. Solder temp: 2402. Duration: 3 sec. | GB/T 2423.28-2005 |
| Vibration Test | No visible mechanical damage. Inductance change: 10%. Q factor change: 20%. Amplitude 1.5mm, 10-55 Hz, 2 hours per direction (total 6 hours). | GB/T 2423.10-2019 |
| Thermal Shock | No visible mechanical damage. Inductance change: 10%. Q factor change: 20%. 100 cycles (-55~40 to 85~125). Max transforming interval: 20 sec. | GB/T 2423.22-2012 Method Na |
| Low Temperature Storage | No visible mechanical damage. Inductance change: 10%. Q factor change: 20%. Temp: -55~-402. Duration: 962 hours. | GB/T 2423.1-2008 Method Ab |
| High Temperature Storage | No visible mechanical damage. Inductance change: 10%. Q factor change: 20%. Temp: 85~1252. Duration: 962 hours. | GB/T 2423.2-2008 Method Bb |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: 10%. Q factor change: 20%. Temp: 602. Humidity: 90-95% RH. Duration: 962 hours. | GB/T 2423.3-2016 |
| Heat Endurance of Reflow Soldering | No significant defects. L/L10%. Q/Q30%. DCR/DCR10%. Performed twice according to reflow curve (Peak temp: 260+0/-5). | GJB 360B-2009 |
| Resistance to Solvent Test | No case deformation, appearance change, or obliteration of marking. Dip in IPA for 50.5min, dry 5min, brush 10 times. | IEC 68-2-45:1993 |
| Overload Test | No smoke, smell, or fire during test. Characteristics normal after test. Apply twice rated current for 5 minutes. | JIS C5311-6.13 |
| Voltage Resistance Test | No breakdown during test. Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min. | MIL-STD-202G Method 301 |
Recommended Reflow Soldering Curve
The recommended reflow conditions are provided as a guideline. Users should adjust and confirm conditions based on their specific equipment, process, and environment.
Reminders for Using These Products
- Storage: Within 12 months, under 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting soldering. Handle with care to prevent damage from dropping.
- Terminal Bending: Do not bend terminals excessively to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform after mounting within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is ON; ensure sufficient thermal design margin.
- Layout: For non-magnetic shield types, careful coil placement on the PCB is required to prevent malfunctions due to magnetic interference.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina