Product Overview

The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0420 Series are ultra-high current SMD power inductors designed for high-density installations. These molded inductors feature a thin profile with low DC resistance and ultra-high current handling capabilities. Their magnetic shielding provides strong anti-electromagnetic interference, making them suitable for demanding applications. The integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. These inductors offer high efficiency due to low loss alloy powder die-casting, resulting in low impedance and small parasitic capacitance. They are capable of operating at frequencies up to 3MHz and have an absolute maximum voltage of 30VDC. The series is RoHS, Halogen Free, and REACH compliant.

Product Attributes

• Brand: LANTU MICRO ELECTRIC TECHNOLOGY
• Origin: SHENZHEN
• Product Type: Molding SMD Power Inductor
• Series: SMS0420
• Compliance: RoHS, Halogen Free, REACH

Technical Specifications

Applications

• PDA, notebook, desktop, server applications
• High current POL converters
• Battery powered devices
• DC/DC converters in distributed power systems

Environmental Data

• Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Test Equipment

• Inductance (L): WK3260B LCR meter or equivalent
• Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Packaging

• Tape & Reel Specifications: Tape Dimension 12.0mm, Pitch 8.0mm, W1 5.5mm. Reel Dimensions: A 12.4mm, B 100mm, C 330mm, D 3000 PCS.
• Packing Quantity: REEL 13 PE Bag, Inside Box 3000 PCS, Outside Carton 12,000 PCS.

Usage Reminders

• Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
• Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
• Avoid direct contact with terminals by bare hands to prevent solderability issues.
• Handle products carefully to prevent damage from dropping or improper removal.
• Do not bend terminals with excessive stress to avoid wire fracture.
• Do not rinse coils; contact SXN if cleaning is necessary.
• Do not expose products to magnets or magnetic fields.
• Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
• Ensure sufficient thermal design margin due to self-heating when power is on.