LanTu Micro SMS0630 470MT ultra high current molding power inductor with low impedance and low noise
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0630 Series are ultra-high current SMD power inductors designed for high-density installation. These magnetically shielded inductors offer strong anti-electromagnetic interference, low DC resistance, and ultra-high current capabilities in a thin profile. Featuring an integral construction for high reliability and vibration resistance, they also provide ultra-low buzz noise due to their composite structure. Die-casting with low-loss alloy powder results in low impedance and small parasitic capacitance, contributing to high efficiency by reducing winding DC resistance and core eddy-current loss. These inductors are suitable for frequencies up to 3MHz and have an absolute maximum voltage of 30VDC. They are compliant with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0630
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
Key Features & Applications
- Features: Low RDC, ultra-high current thin design, magnetic shielding, high anti-electromagnetic interference, suitable for high-density installation, high reliability, high vibration resistance, ultra-low buzz noise, low impedance, small parasitic capacitance, high efficiency, frequency up to 3MHz, absolute maximum voltage 30VDC.
- Applications: PDA, notebook, desktop, server applications, high current POL converters, battery powered devices, DC/DC converters in distributed power systems.
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
Electrical Characteristics
| Part No | Inductance (H) @0A | Tol | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|
| SMS0630-R10M | 0.10 | 20% | 1.40 | 60.00 | 32.00 |
| SMS0630-R15M | 0.15 | 20% | 1.55 | 41.00 | 30.00 |
| SMS0630-R22M | 0.22 | 20% | 1.60 | 35.00 | 25.00 |
| SMS0630-R47M | 0.47 | 20% | 4.00 | 20.00 | 18.00 |
| SMS0630-R68M | 0.68 | 20% | 4.75 | 19.00 | 16.00 |
| SMS0630-1R0M | 1.0 | 20% | 7.60 | 16.00 | 13.00 |
| SMS0630-1R5M | 1.5 | 20% | 13.20 | 14.00 | 12.50 |
| SMS0630-2R2M | 2.2 | 20% | 16.50 | 11.50 | 8.50 |
| SMS0630-3R3M | 3.3 | 20% | 24.50 | 9.50 | 7.00 |
| SMS0630-4R7M | 4.7 | 20% | 35.00 | 6.55 | 6.00 |
| SMS0630-5R6M | 5.6 | 20% | 36.00 | 6.35 | 5.70 |
| SMS0630-6R8M | 6.8 | 20% | 44.30 | 6.00 | 5.10 |
| SMS0630-8R2M | 8.2 | 20% | 60.00 | 6.00 | 5.00 |
| SMS0630-100M | 10 | 20% | 64.50 | 5.50 | 4.50 |
| SMS0630-150M | 15 | 20% | 103.00 | 4.50 | 3.10 |
| SMS0630-220M | 22 | 20% | 180.00 | 3.50 | 2.60 |
| SMS0630-330M | 33 | 20% | 250.00 | 3.00 | 2.00 |
| SMS0630-470M | 47 | 20% | 310.00 | 2.00 | 1.50 |
Dimensions (mm)
| Part No | A | B | C (Max) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS0630 | 7.100.30 | 6.600.20 | 3.00 | 3.00 | 1.60 | 3.70 | 8.40 | 3.50 |
Inductance Tolerance
J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packaging
Tape & Reel Specifications:
| Part No | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0630 | 16.0 | 12.0 | 7.5 | 16.4 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Reliability Testing Summary
- Terminal Strength: Tested per GB/T 2423.60-2008 (SMT & DIP) with defined forces and durations.
- Resistance to Flexure: Tested per JIS C 5321:1997 with flexure of 2mm.
- Dropping Test: Tested per GB/T 2423.7-2018 from 1m height.
- Solderability: Tested per GB/T 2423.28-2005 with wetting exceeding 75% coverage.
- Vibration: Tested per GB/T 2423.10-2019 with amplitude of 1.5mm, frequency 10-55 Hz.
- Thermal Shock: Tested per GB/T 2423.22-2012 Method Na (100 cycles).
- Low temperature Storage: Tested per GB/T 2423.1-2008 Method Ab (-55~-402 for 962 hours).
- High temperature Storage: Tested per GB/T 2423.2-2008 Method Bb (125~852 for 962 hours).
- Damp Heat (Steady States): Tested per GB/T 2423.3-2016 (602, 90% to 95% RH for 962 hours).
- Heat endurance of Reflow soldering: Tested per GJB 360B-2009 (Peak temperature 260+0/-5).
- Resistance to solvent test: Tested per IEC 68-2-45:1993 with IPA solvent.
- Overload test: Tested per JIS C5311-6.13 (twice rated current for 5 minutes).
- Voltage resistance test: Tested per MIL-STD-202G Method 301 (DC1000V, 1mA, 1Min).
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on user's environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, at 5~40C and 35-65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali).
- Handling: Avoid direct contact with terminals to prevent soldering issues. Handle with care to prevent damage.
- Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is required.
- Magnetism: Keep away from magnets or magnetic fields.
- Preheating: Preheat components before soldering, with a temperature difference not exceeding 150C between solder and chip temperature.
- Soldering Corrections: Perform within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is on.
- Layout: For non-magnetic shield types, careful coil layout is needed to prevent malfunction due to magnetic interference.
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