Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Magnetic Resin Shielded LanTu Micro SNR5040-102MT Power Inductor with Low DCR and High Shock Resistance

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Product Description

Product Overview

The SNR5040 Series are automatic assembly constructed, magnetic resin shielded SMD power inductors designed to reduce buzz noise to ultra-low levels. They feature a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, large current handling capability with low DCR, and metallization on the ferrite core for excellent shock resistance and durability. These space-saving and power-efficient inductors are compliant with RoHS, Halogen Free, and REACH standards. They are widely used in applications such as LED backlights, flat-screen TVs, set-top boxes, notebooks, desktops, servers, graphic cards, portable gaming devices, personal navigation systems, multimedia devices, automotive products, telecommunication equipment, and DC-DC converters.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SNR5040
  • Construction: Magnetic Resin Shielded, Automatic Assembly
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Magnetic Circuit: Closed

Technical Specifications

Part No. Inductance (H) Inductance Tolerance Test Frequency (100KHz, 1.0V) DCR () Typical DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max
SNR5040-1R0M 1.0 20% N/A 0.012 0.018 7.35 4.90
SNR5040-1R2M 1.2 20% N/A 0.016 0.021 6.50 4.30
SNR5040-1R5M 1.5 20% N/A 0.015 0.020 6.30 4.30
SNR5040-2R2M 2.2 20% N/A 0.019 0.025 4.90 3.80
SNR5040-3R3M 3.3 20% N/A 0.024 0.031 3.95 3.40
SNR5040-4R7M 4.7 20% N/A 0.030 0.039 3.50 3.00
SNR5040-6R8M 6.8 20% N/A 0.043 0.056 2.90 2.50
SNR5040-8R2M 8.2 20% N/A 0.050 0.070 2.70 2.30
SNR5040-100M 10 20% N/A 0.064 0.082 2.35 2.10
SNR5040-120M 12 20% N/A 0.077 0.102 2.20 2.00
SNR5040-150M 15 20% N/A 0.086 0.115 2.00 2.00
SNR5040-220M 22 20% N/A 0.129 0.167 1.60 1.50
SNR5040-330M 33 20% N/A 0.188 0.244 1.30 1.20
SNR5040-470M 47 20% N/A 0.272 0.353 1.10 1.00
SNR5040-680M 68 20% N/A 0.400 0.520 0.90 0.80
SNR5040-820M 82 20% N/A 0.560 0.660 0.80 0.75
SNR5040-101M 100 20% N/A 0.509 0.728 0.75 0.70
SNR5040-121M 120 20% N/A 0.665 0.864 0.70 0.65
SNR5040-151M 150 20% N/A 0.750 0.975 0.65 0.60
SNR5040-221M 220 20% N/A 1.400 1.820 0.48 0.40
SNR5040-331M 330 20% N/A 2.000 2.730 0.42 0.40
SNR5040-471M 470 20% N/A 3.000 3.900 0.37 0.35
SNR5040-681M 680 20% N/A 3.900 5.070 0.30 0.25
SNR5040-102M 1000 20% N/A 6.000 7.800 0.21 0.23

Dimensions

Part No. L (mm) W (mm) H (mm) A (mm) B (mm) C (mm) D (mm) E (mm) F (Typ mm) G (Typ mm) H (Typ mm)
SNR5040 5.00.3 5.00.3 4.0 Max 2.50.2 4.00.2 1.4 2.3 4.2 N/A N/A N/A

Environmental Data

Parameter Value
Operating Temperature -40 to +125 (Including coils self-temperature rise)

Product Identification

Format: SNR 5040 [Inductance Code] [Tolerance Code] [Packing Code]

Example: SNR5040-470M T

  • Type: SNR (Shielded SMD Power Inductors)
  • External Dimensions (LWH) (mm): 5040 (5.04.04.0)
  • Inductance: 470 (47 H)
  • Tolerance: M (20%)
  • Packing: T (Tape & Reel)

Inductance Tolerance Codes

  • J: 5%
  • K: 10%
  • L: 15%
  • M: 20%
  • P: 25%
  • N: 30%

Packing Codes

  • B: Bulk Package
  • T: Tape & Reel

Packaging Specifications (Tape & Reel)

Part No. Tape Width (W) (mm) Pitch (P) (mm) Tape Width (W1) (mm) Reel Diameter (A) (mm) Reel Hub Diameter (B) (mm) Reel Flange Diameter (C) (mm) Reel Width (D) (mm) Reel Quantity (PCS) Inside Box Quantity (PCS) Outside Carton Quantity (PCS)
SNR5040 12 8 5.5 100 13 330 1500 6000 24,000 N/A

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test based on terminal area; Solder paste thickness: 0.12mm.
Terminal Strength (DIP) Meet requirements without any loose terminal. Pull force applied gradually for 10 seconds, varies by terminal diameter.
Resistance to Flexure No visible mechanical damage. Flexure: 2mm; Speed: 0.5mm/sec; Duration: 30 sec.
Dropping No case deformation or change in appearance; No short and no open. Drop from 1m height, 1 angle, 3 ridges, 6 surfaces, twice each.
Solderability Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Frequency 10-55 Hz, amplitude 1.5mm, 2 hours in 3 directions.
Thermal Shock No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. 100 cycles of temperature shock (-55~40 to 85~125).
Low Temperature Storage No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Temperature: -55~-402; Duration: 962 hours.
High Temperature Storage No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Temperature: 85~1252; Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10%. Reflow twice, peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times.
Overload test No smoke, no peculiar smell, no fire; Characteristics normal after test. Apply twice rated current for 5 minutes.
Voltage resistance test No breakdown during test; Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min.

Recommended Reflow Soldering Curve

Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on user's environment and equipment.

Reminders for Using These Products

  • Storage: Within 12 months, under 5~40C and 35~65% RH.
  • Environment: Avoid gas corrosive environments (salt, acid, alkali).
  • Handling: Avoid direct contact with terminals due to hand grease. Handle carefully to prevent damage.
  • Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
  • Cleaning: Do not rinse coils; contact manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose to magnets or magnetic fields.
  • Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Perform within specified conditions; overheating may cause issues.
  • Self-Heating: Account for self-heating when designing for thermal management.
  • Non-Magnetic Shielded Type: Careful layout is required to prevent malfunction due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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