Magnetic Resin Shielded SMD Power Inductors LanTu Micro SNR4030-221MT Compact Design Saving PCB Space
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Product Description
Magnetic Resin Shielded SMD Power Inductors - SNR4030 Series
Product Overview
The SNR4030 Series is an automatic assembly constructed power inductor, featuring magnetic resin shielding to significantly reduce buzz noise to ultra-low levels. Designed for high current and low DCR applications, these inductors utilize a closed magnetic circuit structure that minimizes leakage flux and enhances EMI resistance. Their compact size saves PCB real estate and reduces power consumption. Metallization on the ferrite core ensures excellent shock resistance and durability. These inductors are widely used in LED backlights, flat-screen TVs, notebooks, servers, graphic cards, automotive systems, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR4030
- Construction: Magnetic resin shielded, automatic assembly
- Certifications: RoHS, Halogen Free and REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
General Specifications:
| Item | Description |
|---|---|
| Type | SNR (Shielded SMD Power Inductors) |
| Magnetic Circuit | Closed magnetic circuit design |
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A or equivalent |
| Test Equipment (Current) | HP4284+42841A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
| RoHS/Halogen Free/REACH | Compliant |
Product Identification:
| Component | Description |
|---|---|
| Type | SNR |
| Inductance | e.g., 100 (for 10 H) |
| Inductance Tolerance | M (20%) |
| Dimensions (LWH) | 4030 (4.0 4.0 3.0 mm) |
| Packing | T (Tape & Reel) |
Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Codes: B: Bulk Package, T: Tape & Reel
Shape and Dimensions:
| Part No | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|
| SNR4030 | 4.00.3 | 4.00.3 | 3.0 Max | 2.10.2 | 3.30.2 | 1.1 Typ | 1.9 Typ | 3.7 Typ |
Electrical Characteristics:
| Part No | L (H) | Inductance @ 100KHz, 1.0V Tol | DCR () Typical | DCR () Max | Saturation Current Isat (A) Max | Temperature Rise Current Irms (A) Max |
|---|---|---|---|---|---|---|
| SNR4030-1R0M | 1.0 | 20% | 0.014 | 0.018 | 5.26 | 4.15 |
| SNR4030-1R2M | 1.2 | 20% | 0.015 | 0.020 | 5.26 | 3.82 |
| SNR4030-1R5M | 1.5 | 20% | 0.020 | 0.026 | 4.84 | 3.34 |
| SNR4030-1R8M | 1.8 | 20% | 0.025 | 0.033 | 4.84 | 3.20 |
| SNR4030-2R2M | 2.2 | 20% | 0.030 | 0.039 | 4.40 | 2.95 |
| SNR4030-3R3M | 3.3 | 20% | 0.040 | 0.050 | 3.30 | 2.40 |
| SNR4030-4R7M | 4.7 | 20% | 0.060 | 0.076 | 2.90 | 2.00 |
| SNR4030-5R6M | 5.6 | 20% | 0.073 | 0.091 | 2.75 | 1.90 |
| SNR4030-6R8M | 6.8 | 20% | 0.090 | 0.115 | 2.60 | 1.60 |
| SNR4030-8R2M | 8.2 | 20% | 0.095 | 0.122 | 2.10 | 1.60 |
| SNR4030-100M | 10 | 20% | 0.100 | 0.130 | 1.95 | 1.50 |
| SNR4030-120M | 12 | 20% | 0.135 | 0.172 | 1.70 | 1.30 |
| SNR4030-150M | 15 | 20% | 0.190 | 0.230 | 1.65 | 1.11 |
| SNR4030-220M | 22 | 20% | 0.225 | 0.290 | 1.30 | 1.00 |
| SNR4030-330M | 33 | 20% | 0.330 | 0.420 | 1.10 | 0.84 |
| SNR4030-470M | 47 | 20% | 0.445 | 0.570 | 0.95 | 0.72 |
| SNR4030-680M | 68 | 20% | 0.868 | 1.100 | 0.72 | 0.52 |
| SNR4030-820M | 82 | 20% | 1.060 | 1.280 | 0.66 | 0.47 |
| SNR4030-101M | 100 | 20% | 1.150 | 1.480 | 0.60 | 0.45 |
| SNR4030-121M | 120 | 20% | 1.350 | 1.700 | 0.55 | 0.42 |
| SNR4030-151M | 150 | 20% | 1.750 | 2.300 | 0.53 | 0.35 |
| SNR4030-221M | 220 | 20% | 2.400 | 3.200 | 0.50 | 0.35 |
| SNR4030-331M | 330 | 20% | 3.950 | 5.000 | 0.40 | 0.26 |
Definitions:
- Saturation Current (Isat): DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Packaging:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR4030 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Cover Tape Peel Off Condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test: Defined by terminal area. Solder paste thickness: 0.12mm. Force applied gradually. Keep time: 101s. Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pull Force: Applied gradually and maintained for 10 seconds. Force varies by terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to jig, subjected to harmonic motion (10-55 Hz). Applied for 2 hours in 3 perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | 100 cycles of temperature extremes (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition before measuring. |
| High Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 85~1252. Duration: 962 hours. Stabilize at normal condition before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition before measuring. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L 10% (Mn-Zn: 30%). Q/Q 30% (SMD series only). DCR/DCR 10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | No smoke, no peculiar smell, no fire during test. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended Reflow Soldering Curve:
The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products:
- Storage: Within 12 months, at 5~40C and 35~65% RH. Terminal solderability may deteriorate if storage period elapses.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that inhibit soldering. Handle carefully to prevent damage from dropping or improper removal.
- Terminals: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetism: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating can cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for self-heating when power is ON.
- Layout: For non-magnetic shielded types, careful coil layout on the circuit board is required to prevent malfunction due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina