Magnetic Resin Shielded SMD Power Inductor LanTu Micro SNR4020-101MT with Closed Magnetic Circuit Design
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SNR4020 Series are automatic assembly, magnetic resin shielded SMD power inductors designed to minimize buzz noise to ultra-low levels. They feature a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, large current handling, and low DC resistance. These space-saving and power-efficient inductors are suitable for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, automotive products, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR4020
- Construction: Magnetic resin shielded, automatic assembly
- Magnetic Circuit: Closed
- Certifications: RoHS, Halogen Free, REACH Compliance
- Environmental Operating Temperature: -40 to +125 (including coil self-temperature rise)
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Test Frequency (KHz) | Test Voltage (V) | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|---|---|
| SNR4020-R47M | 0.47 | 20% | 100 | 1.0 | 0.022 | 0.029 | 7.00 | 3.30 | 4.04.02.0 |
| SNR4020-1R0M | 1.0 | 20% | 100 | 1.0 | 0.029 | 0.038 | 4.78 | 2.15 | 4.04.02.0 |
| SNR4020-1R5M | 1.5 | 20% | 100 | 1.0 | 0.035 | 0.045 | 4.45 | 2.15 | 4.04.02.0 |
| SNR4020-2R2M | 2.2 | 20% | 100 | 1.0 | 0.035 | 0.046 | 3.40 | 1.85 | 4.04.02.0 |
| SNR4020-3R3M | 3.3 | 20% | 100 | 1.0 | 0.070 | 0.091 | 3.20 | 1.40 | 4.04.02.0 |
| SNR4020-4R7M | 4.7 | 20% | 100 | 1.0 | 0.075 | 0.098 | 2.35 | 1.34 | 4.04.02.0 |
| SNR4020-6R8M | 6.8 | 20% | 100 | 1.0 | 0.125 | 0.163 | 2.20 | 1.04 | 4.04.02.0 |
| SNR4020-8R2M | 8.2 | 20% | 100 | 1.0 | 0.148 | 0.185 | 1.75 | 1.00 | 4.04.02.0 |
| SNR4020-100M | 10 | 20% | 100 | 1.0 | 0.165 | 0.215 | 1.60 | 0.90 | 4.04.02.0 |
| SNR4020-150M | 15 | 20% | 100 | 1.0 | 0.230 | 0.300 | 1.35 | 0.77 | 4.04.02.0 |
| SNR4020-220M | 22 | 20% | 100 | 1.0 | 0.350 | 0.455 | 1.05 | 0.62 | 4.04.02.0 |
| SNR4020-330M | 33 | 20% | 100 | 1.0 | 0.550 | 0.710 | 0.85 | 0.49 | 4.04.02.0 |
| SNR4020-470M | 47 | 20% | 100 | 1.0 | 0.710 | 0.920 | 0.74 | 0.44 | 4.04.02.0 |
| SNR4020-680M | 68 | 20% | 100 | 1.0 | 1.060 | 1.380 | 0.60 | 0.36 | 4.04.02.0 |
| SNR4020-101M | 100 | 20% | 100 | 1.0 | 1.500 | 1.950 | 0.55 | 0.31 | 4.04.02.0 |
| Inductance Tolerance Codes | Packing Codes |
|---|---|
| J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | B: Bulk Package, T: Tape & Reel |
| Shape and Dimensions (mm) | A | B | C (Max) | D | E | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|
| SNR4020 | 4.00.3 | 4.00.3 | 2.0 | 2.10.2 | 3.30.2 | 1.1 | 1.9 | 3.7 |
| Test Item | Requirements | Test Method and Remarks |
|---|---|---|
| Terminal Strength | Meet requirements without loose terminal | GB/T 2423.60-2008 (SMT/DIP) |
| Resistance to Flexure | No visible mechanical damage, no short, no open | JIS C 5321:1997 |
| Dropping | No case deformation, no change in appearance, no short, no open | GB/T 2423.7-2018 (1m drop) |
| Solderability | Wetting > 75% coverage, Terminals 95% minimum solder coverage | GB/T 2423.28-2005 (2402, 3 sec) |
| Vibration | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | GB/T 2423.10-2019 (10-55 Hz) |
| Thermal Shock | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | GB/T 2423.22-2012 Method Na (100 cycles) |
| Low Temperature Storage | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | GB/T 2423.1-2008 Method Ab (-402, 962 hours) |
| High Temperature Storage | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | GB/T 2423.2-2008 Method Bb (852, 962 hours) |
| Damp Heat (Steady States) | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | GB/T 2423.3-2016 (602, 90-95% RH, 962 hours) |
| Heat endurance of Reflow soldering | No significant defects, L/L10%, Q/Q30%, DCR/DCR10% | GJB 360B-2009 (Twice reflow, Peak temp: 260+0/-5) |
| Resistance to solvent test | No case deformation or change in appearance | IEC 68-2-45:1993 (IPA solvent) |
| Overload test | No smoke, smell, fire; characteristics normal after test | JIS C5311-6.13 (2x rated current for 5 min) |
| Voltage resistance test | No breakdown; characteristics normal after test | MIL-STD-202G Method 301 (DC1000V, 1mA, 1Min) |
Note: Saturation Current is the DC current at which inductance drops 30% from its value without current. Temperature Rise Current is the actual DC current when the temperature rise is T 40 (Ta=25). Rated DC Current is the lesser of Isat or Irms. Component temperature should be verified in the end application due to various factors affecting heat dissipation.
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