Epoxy resin coated LanTu Micro AL0307-1R0M axial fixed inductors designed for RF choke in electronic devices
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The AL0307 Series Axial Fixed Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for RF choke applications. These inductors feature an epoxy resin coating for enhanced humidity resistance and longevity. Their compact, lightweight design, wide inductance range, high Q, and self-resonant frequencies make them suitable for automated insertion processes. They are RoHS, Halogen Free, and REACH compliant, finding applications in televisions, personal computers, radios, telephones, chargers, fast charge systems, and various other electronic products.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Series: AL0307 Series
- Product Type: Leaded RF Chokes / Axial Fixed Inductors
- Coating: Epoxy resin
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Bulk Package (B), Tape Packaging (TF)
Technical Specifications
| Product Model | Inductance (H) | Tolerance | Q Min @ Test Freq. (MHz) | SRF Min (MHz) | DCR Max () | Rated Current Max (mA) | Dimensions (LH) (mm) |
|---|---|---|---|---|---|---|---|
| AL0307-1R0M | 1.0 | 20% | 40 @ 25.2MHz | 150 | 0.15 | 740 | 3.27.62 |
| AL0307-1R2M | 1.2 | 20% | 40 @ 7.96MHz | 150 | 0.18 | 740 | 3.27.62 |
| AL0307-1R5M | 1.5 | 20% | 40 @ 7.96MHz | 150 | 0.20 | 700 | 3.27.62 |
| AL0307-1R8M | 1.8 | 20% | 50 @ 7.96MHz | 125 | 0.23 | 655 | 3.27.62 |
| AL0307-2R2M | 2.2 | 20% | 50 @ 7.96MHz | 110 | 0.27 | 630 | 3.27.62 |
| AL0307-2R7M | 2.7 | 20% | 50 @ 7.96MHz | 95 | 0.28 | 595 | 3.27.62 |
| AL0307-3R3M | 3.3 | 20% | 50 @ 7.96MHz | 70 | 0.30 | 575 | 3.27.62 |
| AL0307-3R9M | 3.9 | 20% | 50 @ 7.96MHz | 65 | 0.32 | 555 | 3.27.62 |
| AL0307-4R7M | 4.7 | 20% | 50 @ 7.96MHz | 36 | 0.35 | 530 | 3.27.62 |
| AL0307-5R6M | 5.6 | 20% | 50 @ 7.96MHz | 32 | 0.40 | 500 | 3.27.62 |
| AL0307-6R8M | 6.8 | 20% | 50 @ 7.96MHz | 28 | 0.48 | 470 | 3.27.62 |
| AL0307-8R2M | 8.2 | 20% | 50 @ 7.96MHz | 23 | 0.56 | 425 | 3.27.62 |
| AL0307-100K | 10 | 10% | 50 @ 7.96MHz | 18 | 0.75 | 370 | 3.27.62 |
| AL0307-120K | 12 | 10% | 50 @ 2.52MHz | 17 | 0.80 | 350 | 3.27.62 |
| AL0307-150K | 15 | 10% | 50 @ 2.52MHz | 16 | 0.93 | 335 | 3.27.62 |
| AL0307-180K | 18 | 10% | 50 @ 2.52MHz | 15 | 1.00 | 315 | 3.27.62 |
| AL0307-220K | 22 | 10% | 50 @ 2.52MHz | 13 | 1.20 | 285 | 3.27.62 |
| AL0307-270K | 27 | 10% | 50 @ 2.52MHz | 11 | 1.80 | 270 | 3.27.62 |
| AL0307-330K | 33 | 10% | 50 @ 2.52MHz | 10 | 2.20 | 255 | 3.27.62 |
| AL0307-390K | 39 | 10% | 50 @ 2.52MHz | 9.5 | 2.30 | 240 | 3.27.62 |
| AL0307-470K | 47 | 10% | 50 @ 2.52MHz | 8.5 | 2.60 | 205 | 3.27.62 |
| AL0307-560K | 56 | 10% | 50 @ 2.52MHz | 7.5 | 2.90 | 195 | 3.27.62 |
| AL0307-680K | 68 | 10% | 50 @ 2.52MHz | 6.5 | 3.30 | 185 | 3.27.62 |
| AL0307-820K | 82 | 10% | 50 @ 2.52MHz | 6.0 | 3.80 | 175 | 3.27.62 |
| AL0307-101K | 100 | 10% | 50 @ 2.52MHz | 5.5 | 4.20 | 165 | 3.27.62 |
| AL0307-121K | 120 | 10% | 50 @ 0.796MHz | 5.4 | 4.70 | 160 | 3.27.62 |
| AL0307-151K | 150 | 10% | 50 @ 0.796MHz | 4.7 | 5.40 | 150 | 3.27.62 |
| AL0307-181K | 180 | 10% | 50 @ 0.796MHz | 4.3 | 6.00 | 140 | 3.27.62 |
| AL0307-221K | 220 | 10% | 60 @ 0.796MHz | 4.0 | 7.00 | 130 | 3.27.62 |
| AL0307-271K | 270 | 10% | 60 @ 0.796MHz | 3.7 | 7.70 | 120 | 3.27.62 |
| AL0307-331K | 330 | 10% | 60 @ 0.796MHz | 3.4 | 11.1 | 100 | 3.27.62 |
| AL0307-391K | 390 | 10% | 60 @ 0.796MHz | 2.8 | 12.6 | 95 | 3.27.62 |
| AL0307-471K | 470 | 10% | 60 @ 0.796MHz | 2.5 | 14.0 | 90 | 3.27.62 |
| AL0307-561K | 560 | 10% | 60 @ 0.796MHz | 2.3 | 15.5 | 85 | 3.27.62 |
| AL0307-681K | 680 | 10% | 60 @ 0.796MHz | 2.0 | 25.3 | 75 | 3.27.62 |
| AL0307-821K | 820 | 10% | 60 @ 0.796MHz | 1.5 | 27.5 | 65 | 3.27.62 |
| AL0307-102K | 1000 | 10% | 50 @ 0.796MHz | 1.2 | 31.4 | 60 | 3.27.62 |
| Environmental Data | Value |
|---|---|
| Operating Temperature | -25 to +85 (Including coils self-temperature rise) |
| Product Model | Inductance Tolerance | Inductance (uH) | Type | External Dimensions (LH) (mm) | Packing |
|---|---|---|---|---|---|
| AL0307 | J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | 10 uH | Axial Fixed Inductors | 0307 (3.27.62) | Bulk Package (B), Tape (TF) |
| Shape and Dimensions (mm) | A | B | C | F2 |
|---|---|---|---|---|
| AL0307 | - | 7.62 Max | 0.500.1 | 3.0/ 3.2 |
| Packaging | Series Type | Packaging | Quantity (pcs) | Carton Size (mm) L | Carton Size (mm) W | Carton Size (mm) H | Parts/Box | Parts/Reel | Parts/Carton |
|---|---|---|---|---|---|---|---|---|---|
| Tape and reel | T5A | Tape | 3000 | 440 | 275 | 392 | - | - | 72,000 |
| Reliability Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet the above requirements without any loose terminal | 1. Pulling test: Define: A: sectional area of terminal A8mm2 force5N time:30s 8mm2 |
| Terminal Strength (DIP) | Meet the above requirements without any loose terminal. | 1.Terminal diameter(d) mm 0.35d 0.50Applied force:5N Duration: 10s 2.Terminal diameter(d) mm0.50d 0.80Applied force:10N Duration: 10s 3.Terminal diameter(d) mm0.80d 1.25Applied force:20N Duration: 10s 4.Terminal diameter(d) mmD 1.25Applied force:40N Duration: 10s Pull Force:the force shall be applied gradually to the terminal and then maintained for 10 seconds. |
| Resistance to Flexure | 1.No visible mechanical damage. 2.shown in Using a leadfree solder. 3.Flexure: 2mm. 4.Pressurizing Speed: 0.5mm/s. 5.Keep time: 30 s. | JIS C 5321:1997 |
| Dropping | 1.No case deformation or change inappearance. 2.No short and no open. | GB/T 2423.7-2018 1.Drop the packaged products from 1m high in 1 angle, 3 ridges and 6surfaces, twice in each direction. |
| Solderability | 1.No visible mechanical damage. 2. Wetting shall exceed 75% coverage for 3.Terminals must have 95% minimum solder coverage | GB/T 2423.28-2005 1.Solder temperature:2402 2.Duration: 3 s. 3. Solder: Sn/3.0Ag/0.5Cu. 4.Flux: 25% Resin and 75% ethanol in weight |
| Vibration | 1.No visible mechanical damage. 2. Inductance change: Within 10%. 3.Q factor change: Within 20%. | GB/T 2423.10-2019 1.Solder the inductor to the testing jig (glass epoxy boardshown in ) using leadfree solder. 2.The inductor shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varieduniformly between the approximate limits of 10 and 55 Hz. 3.The frequency range from 10 to 55 Hz and return to 10 Hz shallbe traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3mutually perpendicular directions(total of 6 hours). |
| Thermal Shock | 1.No visible mechanical damage. 2. Inductance change: Within 10%.(Mn-Zn: Within 30% ) 3.Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na 1.Start at ( 85~125) for T time, rush to (-55~40) for T time as one cycle, go through100 cycles. 2.Transforming interval: Max. 20 s. 3.Tested cycle: 100 cycles. 4.The chip shall be stabilized at normal condition for 1~2 hours |
| Low temperature Storage | 1.No visible mechanical damage. 2. Inductance change: Within 10%.(Mn-Zn: Within 30% ) 3.Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab 1.Temperature:M(-55~-402) 2.Duration: 962 hours 3.The chip shall be stabilized at normal condition for 1~2 hoursbefore measuring. |
| High temperature Storage | 1.No visible mechanical damage. 2. Inductance change: Within 10%.(Mn-Zn: Within 30% ) 3.Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb 1.Temperature:N(125~852). 2.Duration: 962 hours 3.The chip shall be stabilized at normal condition for 1~2 hoursbefore measuring. |
| Damp Heat (Steady States) | 1.No visible mechanical damage. 2. Inductance change: Within 10%.(Mn-Zn: Within 30% ) 3.Q factor change: Within 20%. | GB/T 2423.3-2016 1.Temperature: 602 2.Humidity: 90% to 95% RH. 3.Duration: 962 hours. 4.The chip shall be stabilized at normal condition for 1~2 hoursbefore measuring. |
| Heat endurance of Reflow soldering | 1.No significant defalts in appearance. 2.L/L10% (Mn-Zn: L/L30% ) 3.Q/Q30% SMD series only 4.DCR/DCR10% | GJB 360B-2009 1.Refer to the above reflow curve and go through the reflow for twice. 2.The peak temperature : 260+0/-5 |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | IAL 68-2-45:1993 1.To dip parts into IPA solvent for 50.5Min,then drying them at room temp for 5Min,at last ,to brushing making 10 times. |
| Overload test | 1.During the test no smoke, no peculiar smell, no fire 2.The characteristic is normal after test | JIS C5311-6.13 1.Apply twice as rated current for 5 minutes. |
| Voltage resistance test | 1.During the test no breakdown 2.The characteristic is normal after test | MIL-STD-202G Method 301 1. For parts with two coils 2. DC1000V, Current: 1mA, Time: 1Min. 3. Refer to catalogue of specific products |
| Lead-free Recommended Wave Soldering (DIP-TYP) | Notes |
|---|---|
| The recommended wave soldering is a reference to a single wave soldering recommended by the manufacturer, because the various manufacturers of soldering equipment, product process conditions, set methods and so on, when setting the soldering conditions, Please adjust and confirm according to users' environment/equipments. | Appendix 2: Soldering Iron (Rework) 1) Use soldering iron to solder inductors by hand, times Does Not exceed 350 degrees 3 times. 2) When soldering iron welding, please try to avoid contacting the Inductor itself. (definitely do not contact the wire) 3) To solder inductors by soldering iron is not recommended). |
Usage Precautions
- Storage Period: Within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less. Soldering of terminal electrodes may deteriorate after the storage period.
- Environment: Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that may inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Correction: Soldering corrections after mounting should be within specified conditions. Overheating can lead to short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Devices generate heat when powered on; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina