T core molding LanTu Micro SMS252010 R22MT power inductor with ultra high current and low DC resistance
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Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS252010 Series is a thin-profile, ultra-high current SMD power inductor designed for high-density installations. Featuring magnetic shielding for strong anti-electromagnetic interference, low DC resistance, and ultra-low AC losses, these inductors are ideal for high switching frequencies. Their T-core molding structure ensures excellent vibration resistance and high reliability. Applications include DC/DC converters for notebook PC CPUs, mobile phones, tablets, HDDs, DVCs, PDAs, 5G modules, servers, base stations, and various DC-DC conversion power modules. The series operates within an environmental temperature range of -40 to +125 (including coil self-temperature rise).
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Common Mode Choke / Molding SMD Power Inductor
- Series: SMS252010
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH mm) | External Dimensions (A, B, C, D, E, F, H mm) |
|---|---|---|---|---|---|---|---|---|
| SMS252010-R22M | 0.22 | 20% | 12.0 | 17.0 | 8.60 | 6.80 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-R24M | 0.24 | 20% | 12.0 | 17.5 | 8.50 | 6.70 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-R33M | 0.33 | 20% | 13.0 | 19.0 | 7.60 | 6.50 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-R47M | 0.47 | 20% | 15.0 | 22.0 | 6.90 | 6.10 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-R68M | 0.68 | 20% | 23.0 | 27.0 | 5.90 | 5.60 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-1R0M | 1.0 | 20% | 25.0 | 30.0 | 5.40 | 4.70 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-1R5M | 1.5 | 20% | 45.0 | 55.0 | 4.30 | 3.40 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-2R2M | 2.2 | 20% | 62.0 | 70.0 | 3.30 | 2.40 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-3R3M | 3.3 | 20% | 86.0 | 100.0 | 2.80 | 2.50 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-4R7M | 4.7 | 20% | 160.0 | 180.0 | 2.60 | 2.00 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-6R8M | 6.8 | 20% | 270.0 | 320.0 | 2.40 | 1.60 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-100M | 10 | 20% | 500.0 | 560.0 | 1.55 | 1.05 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| SMS252010-220M | 22 | 20% | 1100.0 | 1300.0 | 1.10 | 0.85 | 2.52.01.0 | A: 2.500.20, B: 2.000.20, C: 1.00 Max, D: 0.90Typ, E: 2.80 Typ, F: 1.00 Typ, H: 2.10 Typ |
| Definitions: - Saturation Current: DC current at which inductance drops 30% from its value without current. - Heat Rating Current: the actual value of DC current when the temperature rise is T 40(Ta=25). - Rated DC Current: The lesser value of Isat or Irms. - Special remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. | ||||||||
| Product Identification | Description |
|---|---|
| SMS | Molding SMD Power Inductor |
| 252010 | External Dimensions (LWH) in mm (2.52.01.0) |
| R47 | Inductance value (0.47 H) |
| M | Inductance Tolerance (20%) |
| T | Packing (Tape & Reel) |
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|
| SMS252010 | 8.0 | 4.0 | 3.5 | 3000 | 30,000 | 120,000 |
| Reliability Test Item | Requirements | Test Method and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008 with varying forces based on terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping Test | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. No visible mechanical damage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration Test | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Amplitude: 1.5mm. Frequency: 10 to 55 Hz and return. Duration: 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock Test | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature from (85~125) to (-55~40). Transforming interval: Max. 20 sec. |
| Low Temperature Storage Test | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High Temperature Storage Test | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | GJB 360B-2009. Peak temperature: 260+0/-5. Tested twice. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | JIS C5311-6.13. Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | MIL-STD-202G Method 301. For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. |
Usage Precautions
- Storage: Within 12 months. Conditions: temperature 5~40C, humidity 35~65% RH or less. Solderability of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that may inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheating is required before soldering. The temperature difference between solder temperature and chip temperature should not exceed 150C.
- Soldering Correction: Soldering corrections after mounting must be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
- Thermal Design: Allow sufficient margin for thermal design as self-heating occurs when power is turned ON.
- Non-Magnetic Shield Type: Carefully lay out the coil on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina