Molding SMD Power Inductors - SMS1360 Series

Product Overview: The SMS1360 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors featuring a thin design with low DC resistance and excellent current handling capabilities. These magnetically shielded inductors provide strong anti-electromagnetic interference, making them ideal for high-density installations. Their integral construction ensures high reliability and superior vibration resistance, while the composite structure minimizes buzz noise. Designed for high efficiency, these inductors utilize low-loss alloy powder die-casting, resulting in low impedance, small parasitic capacitance, and reduced core eddy-current loss. They are suitable for applications requiring frequencies up to 3MHz and an absolute maximum voltage of 30VDC, complying with RoHS, Halogen Free, and REACH standards.

Applications:

• PDA, notebook, desktop, server applications
• High current POL converters
• Battery powered devices
• DC/DC converters in distributed power systems

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Product Series: SMS1360
• Type: Molding SMD Power Inductor
• Certifications: RoHS, Halogen Free, REACH Compliance
• Origin: China (Implied by company location)

Technical Specifications

Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Packaging: Bulk Package (B), Tape & Reel (T)

Test Equipment:

• Inductance: WK3260B LCR meter or equivalent
• Saturation & Heat Rating Current: WK3260B+WK3265B or equivalent
• DCR: Chroma 16502 or equivalent

Definitions:

• Saturation Current: DC current at which inductance drops 30% from its value without current.
• Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value of Isat or Irms.

Note: Part temperature should be verified in the end application due to the influence of circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions.

Recommended Land Pattern: (Refer to Shape and Dimensions section for diagram)

Recommended Reflow Soldering Curve: (Refer to specific diagram in source document for curve details. Conditions may need adjustment based on user's environment/equipment.)

Reminders for Using These Products:

• Storage Period: within 12 months. Storage Conditions: temperature 5~40C, humidity 35~65% RH or less.
• Avoid use and storage in environments with gas corrosion (salt, acid, alkali, etc.).
• Do not touch electrodes directly with bare hands.
• Handle products carefully to prevent damage.
• Do not bend terminals with excessive stress.
• Do not rinse coils; contact SXN if cleaning is necessary.
• Do not expose products to magnets or magnetic fields.
• Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions to avoid overheating.
• Allow sufficient thermal design margin for self-heating when power is on.
• For non-magnetic shield types, careful layout is needed to avoid malfunctions due to magnetic interference.