Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Molding SMD Power Inductors LanTu Micro SMS1350-100MT with ultra high current and low DC resistance

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Product Description

Molding SMD Power Inductors - SMS1350 Series

Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1350 Series offers ultra-high current SMD power inductors designed for high-density installations. These thin-profile inductors feature low DC resistance and ultra-high current capabilities, coupled with magnetic shielding for strong anti-electromagnetic interference. Their integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Utilizing low-loss alloy powder die-casting, these inductors offer low impedance, small parasitic capacitance, high efficiency, and reduced core eddy-current loss, supporting frequencies up to 3MHz and an absolute maximum voltage of 30VDC. They are RoHS, Halogen Free, and REACH compliant.

Applications
Ideal for PDA, notebook, desktop, and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SMS1350
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

Electrical Characteristics (at 25)

Part No Inductance (L) (H) @ 0A Tolerance DCR (m) Typical DCR (m) Max Saturation Current (A) Typical Heat Rating Current (A) Typical
SMS1350-R36M 0.36 20% 0.85 1.1 60.00 41.00
SMS1350-R47M 0.47 20% 1.1 1.3 52.00 39.00
SMS1350-R68M 0.68 20% 1.2 1.5 40.00 32.00
SMS1350-R82M 0.82 20% 1.5 1.7 42.00 30.00
SMS1350-1R0M 1.0 20% 1.9 2.2 35.00 26.00
SMS1350-1R5M 1.5 20% 2.7 3.2 30.00 23.00
SMS1350-2R2M 2.2 20% 4.0 5.0 26.00 20.00
SMS1350-3R3M 3.3 20% 7.0 9.0 22.00 15.00
SMS1350-4R7M 4.7 20% 9.0 11.0 17.00 12.00
SMS1350-6R8M 6.8 20% 15.0 18.0 14.00 11.00
SMS1350-100M 10 20% 20.0 23.0 12.00 8.00
SMS1350-150M 15 20% 28.0 32.0 10.00 6.00
SMS1350-220M 22 20% 45.0 52.0 7.00 4.50
SMS1350-330M 33 20% 66.0 75.0 6.00 4.00
SMS1350-470M 47 20% 100.0 120.0 5.00 3.00
SMS1350-680M 68 20% 115.0 135.0 4.50 2.50

General Specifications

Item Specification
Operating Temperature -55 to +125 (Including coils self-temperature rise)
Frequency Up to 3MHz
Absolute Maximum Voltage 30VDC
Test Equipment (Inductance) WK3260B LCR meter or equivalent
Test Equipment (Current) WK3260B+WK3265B or equivalent
Test Equipment (DCR) Chroma 16502 or equivalent

Shape and Dimensions

Part No A (mm) B (mm) C (mm) D (mm) E (mm) F (mm) G (mm) H (mm)
SMS1350 13.800.50 12.600.20 6.00Max 3.70 Typ 2.50 Typ 8.00 14.60 5.00

Inductance Tolerance Codes

J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Packing Options

  • Bulk Package
  • Tape & Reel

Packaging Details (Tape & Reel)

Part No Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SMS1350 24.0 16.0 11.5 24.4 100 13 330 500 1000 4000

Cover Tape Peel Off Condition

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing

Includes Terminal Strength (SMT & DIP), Resistance to Flexure, Dropping Test, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat (Steady States), Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage Resistance Test.

Recommended Reflow Soldering Curve

Refer to the provided graph for recommended reflow conditions. Adjust based on user's environment and equipment.

Reminders for Using These Products

  • Storage: Within 12 months, at 5~40C and 35~66% RH.
  • Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid touching terminals with bare hands; handle carefully to prevent damage.
  • Terminal Bending: Do not bend terminals excessively.
  • Cleaning: Do not rinse coils; contact manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose to magnets or magnetic fields.
  • Preheating: Ensure preheating before soldering, with a temperature difference not exceeding 150C.
  • Soldering Corrections: Perform within specified conditions; overheating may cause issues.
  • Thermal Design: Account for self-heating when power is on.
  • Non-Magnetic Shield Type: Careful PCB layout is needed to avoid malfunction due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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