Product Overview
The SNR4012 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. is an automatic assembly compatible, magnetic resin shielded SMD power inductor. It features a magnetic-resin shielded construction that significantly reduces buzz noise to ultra-low levels. Designed for large current and low DCR applications, it boasts metallization on the ferrite core for excellent shock resistance and durability. The closed magnetic circuit design minimizes leakage flux and enhances EMI resistance, while its compact size saves PCB space and power. This series is widely used in various electronic devices including LED backlights, flat-screen TVs, notebooks, servers, graphics cards, multimedia devices, automotive products, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR4012
- Construction: Magnetic Resin Shielded, Automatic Assembly
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Frequency | Test Voltage | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH mm) |
| SNR4012-1R0M | 1.0 | 20% | 100KHz | 1.0V | 0.050 | 0.065 | 2.61 | 1.65 | 4.04.01.2 |
| SNR4012-1R5M | 1.5 | 20% | 100KHz | 1.0V | 0.065 | 0.094 | 2.50 | 1.46 | 4.04.01.2 |
| SNR4012-2R2M | 2.2 | 20% | 100KHz | 1.0V | 0.080 | 0.104 | 1.76 | 1.32 | 4.04.01.2 |
| SNR4012-3R3M | 3.3 | 20% | 100KHz | 1.0V | 0.110 | 0.143 | 1.72 | 1.12 | 4.04.01.2 |
| SNR4012-4R7M | 4.7 | 20% | 100KHz | 1.0V | 0.125 | 0.163 | 1.15 | 1.05 | 4.04.01.2 |
| SNR4012-6R8M | 6.8 | 20% | 100KHz | 1.0V | 0.198 | 0.257 | 0.85 | 0.84 | 4.04.01.2 |
| SNR4012-100M | 10 | 20% | 100KHz | 1.0V | 0.265 | 0.345 | 0.80 | 0.77 | 4.04.01.2 |
| SNR4012-150M | 15 | 20% | 100KHz | 1.0V | 0.340 | 0.442 | 0.56 | 0.64 | 4.04.01.2 |
| SNR4012-220M | 22 | 20% | 100KHz | 1.0V | 0.587 | 0.763 | 0.46 | 0.49 | 4.04.01.2 |
| SNR4012-330M | 33 | 20% | 100KHz | 1.0V | 0.810 | 1.053 | 0.42 | 0.42 | 4.04.01.2 |
| SNR4012-470M | 47 | 20% | 100KHz | 1.0V | 1.100 | 1.430 | 0.35 | 0.37 | 4.04.01.2 |
Environmental Data
| Parameter | Value |
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
Test Equipment
| Parameter | Equipment |
| Inductance (L) | HP4284A, HP4285A LCR meter or equivalent |
| Saturation Current (Isat) & Temperature Rise Current (Irms) | HP4284+42841A or equivalent |
| DC Resistance (DCR) | Chroma 16502 or equivalent |
Product Identification
Model Structure: SNR 4012 100 M T
- SNR: Series Type (Shielded SMD Power Inductors)
- 4012: External Dimensions (LWH in mm: 4.04.01.2)
- 100: Inductance Value (e.g., 100 means 10 H)
- M: Inductance Tolerance (20%)
- T: Packing (Tape & Reel)
Recommended Land Pattern
| ITEM | A | B | C | D | E | F | G | H |
| SNR4012 | 4.00.3 | 4.00.3 | 1.2 Max | 2.10.2 | 3.30.2 | 1.1 Typ | 1.9 Typ | 3.7 Typ |
Packaging Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel Quantity (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
| SNR4012 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 4500 | 18,000 | 72,000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test: Defined forces based on sectional area. Solder with lead-free solder. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Applied force based on terminal diameter. Duration: 10sec. Pull Force applied gradually. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig. Apply force as shown. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | Inductance change: Within 10%. Q factor change: Within 20%. | Solder to jig. Subject to simple harmonic motion (1.5mm amplitude, 10-55 Hz). Applied for 2 hours in 3 mutually perpendicular directions. |
| Thermal Shock | Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature change (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| High temperature Storage | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 85~1252. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| Heat endurance of Reflow soldering | L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristic normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test: no breakdown. Characteristic normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals excessively to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Correction: Post-mounting soldering corrections must be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is ON; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Careful coil layout is required on the circuit board to prevent malfunctions due to magnetic interference.