High Power Unshielded SMD Inductors LanTu Micro SSD0804-220MT Suitable for Surface Mounting Equipment
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Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SSD0804 Series Unshielded SMD Power Inductors are designed for high power applications, featuring high saturation and low DC resistance. These unshielded inductors are suitable for surface mounting equipment and are available in various package sizes and inductance ranges. They comply with RoHS, Halogen Free, and REACH standards, making them ideal for use in power supplies for VTRs, LCD televisions, DC/DC converters, and other consumer electronics.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SSD0804
- Type: Unshielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Operating Temperature: -40 to +125 (including coil self-temperature rise)
Technical Specifications
| Model | Inductance (H) | Tolerance | Test Frequency | SRF (MHz) Typ | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|---|
| SSD0804-1R0M | 1.0 | 20% | 100KHz | 100 | 0.009 | 9.00 | 6.80 | 12.959.45.21 |
| SSD0804-1R5M | 1.5 | 20% | 100KHz | 90 | 0.010 | 8.00 | 6.40 | 12.959.45.21 |
| SSD0804-2R2M | 2.2 | 20% | 100KHz | 80 | 0.012 | 7.00 | 6.10 | 12.959.45.21 |
| SSD0804-3R3M | 3.3 | 20% | 100KHz | 65 | 0.015 | 6.40 | 5.40 | 12.959.45.21 |
| SSD0804-4R7M | 4.7 | 20% | 100KHz | 45 | 0.018 | 5.40 | 4.80 | 12.959.45.21 |
| SSD0804-6R8M | 6.8 | 20% | 100KHz | 38 | 0.027 | 4.60 | 4.40 | 12.959.45.21 |
| SSD0804-100M | 10 | 20% | 100KHz | 30 | 0.038 | 3.80 | 3.90 | 12.959.45.21 |
| SSD0804-150M | 15 | 20% | 100KHz | 27 | 0.046 | 3.50 | 3.10 | 12.959.45.21 |
| SSD0804-220M | 22 | 20% | 100KHz | 19 | 0.085 | 3.00 | 2.70 | 12.959.45.21 |
| SSD0804-330M | 33 | 20% | 100KHz | 15 | 0.100 | 2.60 | 2.10 | 12.959.45.21 |
| SSD0804-470M | 47 | 20% | 100KHz | 12 | 0.140 | 2.00 | 1.60 | 12.959.45.21 |
| SSD0804-680M | 68 | 20% | 100KHz | 10 | 0.200 | 1.60 | 1.40 | 12.959.45.21 |
| SSD0804-101M | 100 | 20% | 100KHz | 9 | 0.280 | 1.40 | 1.20 | 12.959.45.21 |
| SSD0804-151K | 150 | 10% | 100KHz | 6 | 0.400 | 1.20 | 1.00 | 12.959.45.21 |
| SSD0804-221K | 220 | 10% | 100KHz | 5 | 0.610 | 1.00 | 0.80 | 12.959.45.21 |
| SSD0804-331K | 330 | 10% | 100KHz | 4.5 | 1.020 | 0.60 | 0.60 | 12.959.45.21 |
| SSD0804-471K | 470 | 10% | 100KHz | 3.5 | 1.270 | 0.50 | 0.50 | 12.959.45.21 |
| SSD0804-681K | 680 | 10% | 100KHz | 2.5 | 2.020 | 0.40 | 0.40 | 12.959.45.21 |
| SSD0804-102K | 1000 | 10% | 100KHz | 2.0 | 3.000 | 0.30 | 0.30 | 12.959.45.21 |
| Part No | A (Max) | B (Max) | C (Max) | D | E | F | H | I | J |
|---|---|---|---|---|---|---|---|---|---|
| SSD0804 | 12.95 | 9.4 | 5.21 | 7.62 | 2.54 | 2.54 | 2.79 | 2.92 | 7.37 |
Note on Current Ratings:
- Saturation Current: DC current at which inductance drops 10% from its value without current.
- Temperature Rise Current: the actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
- Special Reminder: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Packaging Information
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SSD0804 | 24 | 16 | 11.5 | 24.4 | 100 | 13 | 330 | 1000 | 2000 | 8000 |
Tape and Reel Specifications:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test based on sectional area of terminal (e.g., A 8mm, force 5N, time: 30sec). Solder paste thickness: 0.12mm. Pull force applied gradually and maintained for 10 seconds. Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Applied force based on terminal diameter (e.g., 0.35d 0.50mm, Applied force: 5N, Duration: 10sec). Pull Force applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Subjected to simple harmonic motion (amplitude 1.5mm, frequency 10-55 Hz and return) for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20 sec. Stabilized at normal condition for 1~2 hours before measuring. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L 10%. Q/Q 30%. DCR/DCR 10%. | Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then dry at room temp for 5Min, then brush 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristic is normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Usage Reminders
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Do not touch electrodes directly with bare hands to prevent oil contamination affecting solderability. Handle products carefully to avoid damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals excessively to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheating is required before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should adhere to specification conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Allow sufficient thermal design margin as components self-heat when powered on.
- Layout (Non-Shielded): For non-magnetic shielded types, careful coil placement on the PCB is necessary to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina