Magnetic Resin Shielded LanTu Micro SNR4030-101MT SMD Inductor with Power and Space Saving Features
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Product Description
Product Overview
The SNR4030 Series is an automatic assembly constructed, magnetic resin shielded SMD power inductor designed to significantly reduce buzz noise to ultra-low levels. It features a closed magnetic circuit design, minimizing leakage flux and enhancing Electro Magnetic Interference (EMI) resistance. This series offers large current handling capability with low DCR, metallized ferrite core electrodes for excellent shock resistance and durability, and a space-saving, power-efficient design. It is widely applied in LED backlights, flat-screen TVs, notebooks, servers, graphic cards, automotive systems, and DC-DC converters. The product complies with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR4030 Series
- Construction: Magnetic Resin Shielded, Automatic Assembly
- Certifications: RoHS, Halogen Free, REACH Compliance
- Core Material: Ferrite Core
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Test Frequency | Test Voltage | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|---|---|
| SNR4030-1R0M | 1.0 | 20% | 100KHz | 1.0V | 0.014 | 0.018 | 5.26 | 4.15 | 4.04.03.0 |
| SNR4030-1R2M | 1.2 | 20% | 100KHz | 1.0V | 0.015 | 0.020 | 5.26 | 3.82 | 4.04.03.0 |
| SNR4030-1R5M | 1.5 | 20% | 100KHz | 1.0V | 0.020 | 0.026 | 4.84 | 3.34 | 4.04.03.0 |
| SNR4030-1R8M | 1.8 | 20% | 100KHz | 1.0V | 0.025 | 0.033 | 4.84 | 3.20 | 4.04.03.0 |
| SNR4030-2R2M | 2.2 | 20% | 100KHz | 1.0V | 0.030 | 0.039 | 4.40 | 2.95 | 4.04.03.0 |
| SNR4030-3R3M | 3.3 | 20% | 100KHz | 1.0V | 0.040 | 0.050 | 3.30 | 2.40 | 4.04.03.0 |
| SNR4030-4R7M | 4.7 | 20% | 100KHz | 1.0V | 0.060 | 0.076 | 2.90 | 2.00 | 4.04.03.0 |
| SNR4030-5R6M | 5.6 | 20% | 100KHz | 1.0V | 0.073 | 0.091 | 2.75 | 1.90 | 4.04.03.0 |
| SNR4030-6R8M | 6.8 | 20% | 100KHz | 1.0V | 0.090 | 0.115 | 2.60 | 1.60 | 4.04.03.0 |
| SNR4030-8R2M | 8.2 | 20% | 100KHz | 1.0V | 0.095 | 0.122 | 2.10 | 1.60 | 4.04.03.0 |
| SNR4030-100M | 10 | 20% | 100KHz | 1.0V | 0.100 | 0.130 | 1.95 | 1.50 | 4.04.03.0 |
| SNR4030-120M | 12 | 20% | 100KHz | 1.0V | 0.135 | 0.172 | 1.70 | 1.30 | 4.04.03.0 |
| SNR4030-150M | 15 | 20% | 100KHz | 1.0V | 0.190 | 0.230 | 1.65 | 1.11 | 4.04.03.0 |
| SNR4030-220M | 22 | 20% | 100KHz | 1.0V | 0.225 | 0.290 | 1.30 | 1.00 | 4.04.03.0 |
| SNR4030-330M | 33 | 20% | 100KHz | 1.0V | 0.330 | 0.420 | 1.10 | 0.84 | 4.04.03.0 |
| SNR4030-470M | 47 | 20% | 100KHz | 1.0V | 0.445 | 0.570 | 0.95 | 0.72 | 4.04.03.0 |
| SNR4030-680M | 68 | 20% | 100KHz | 1.0V | 0.868 | 1.100 | 0.72 | 0.52 | 4.04.03.0 |
| SNR4030-820M | 82 | 20% | 100KHz | 1.0V | 1.060 | 1.280 | 0.66 | 0.47 | 4.04.03.0 |
| SNR4030-101M | 100 | 20% | 100KHz | 1.0V | 1.150 | 1.480 | 0.60 | 0.45 | 4.04.03.0 |
| SNR4030-121M | 120 | 20% | 100KHz | 1.0V | 1.350 | 1.700 | 0.55 | 0.42 | 4.04.03.0 |
| Inductance Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |||||||||
| Packing Codes: B: Bulk Package, T: Tape & Reel | |||||||||
| Operating Temperature: -40 to +125 (Including coils self-temperature rise) | |||||||||
| Saturation Current Definition: DC current at which inductance drops 30% from its value without current. | |||||||||
| Temperature Rise Current Definition: The actual value of DC current when the temperature rise is T 40 (Ta=25). | |||||||||
| Rated DC Current: The lesser value of Isat or Irms. | |||||||||
| Shape and Dimensions: 4.04.03.0 mm (LWH) | |||||||||
| Recommended Land Pattern: Provided in datasheet (Dimensions A-H) | |||||||||
| Packaging Quantity: Reel: 2000 PCS, Inside Box: 8000 PCS, Outside Carton: 32,000 PCS | |||||||||
Applications
- LED backlight
- Flat-screen TVs
- Blue-ray disc players
- Set-top boxes
- Notebooks
- Desktop computers
- Servers
- Graphic cards
- Portable gaming devices
- Personal navigation systems
- Personal multimedia devices
- Automotive systems
- Telecommunication base stations
- DC-DC Converters
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet specified force and time requirements without loose terminal. Solder paste thickness: 0.12mm. | Pulling test based on GB/T 2423.60-2008. Force varies with terminal cross-sectional area. |
| Terminal Strength (DIP) | Meet specified force and time requirements without loose terminal. | Pull Force applied gradually and maintained for 10 seconds, based on terminal diameter (GB/T 2423.60-2008). |
| Resistance to Flexure | No visible mechanical damage. | Inductor soldered to jig, flexure of 2mm applied at 0.5mm/sec for 30 sec (JIS C 5321:1997). |
| Dropping Test | No case deformation or appearance change. No short or open circuit. | Packaged products dropped from 1m high, 1 angle, 3 ridges, 6 surfaces, twice in each direction (GB/T 2423.7-2018). |
| Solderability | No visible mechanical damage. Wetting >75% coverage. Terminals 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin/75% ethanol (GB/T 2423.28-2005). |
| Vibration Test | No visible mechanical damage. Inductance change: 10%. Q factor change: 20%. | Simple harmonic motion, 10-55 Hz, 1.5mm amplitude, 2 hours per direction (3 directions total) (GB/T 2423.10-2019). |
| Thermal Shock | No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. | 100 cycles of temperature extremes (-55~40 to 85~125), max 20 sec transfer (GB/T 2423.22-2012 Method Na). |
| Low Temperature Storage | No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. | -55~-402 for 962 hours (GB/T 2423.1-2008 Method Ab). |
| High Temperature Storage | No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. | 125~852 for 962 hours (GB/T 2423.2-2008 Method Bb). |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: 10% (Mn-Zn: 30%). Q factor change: 20%. | 602, 90%-95% RH for 962 hours (GB/T 2423.3-2016). |
| Heat Endurance of Reflow Soldering | No significant defects. L/L 10% (Mn-Zn: 30%). Q/Q 30% (SMD only). DCR/DCR 10%. | Two reflow cycles, peak temperature 260+0/-5 (GJB 360B-2009). |
| Resistance to Solvent Test | No case deformation, appearance change, or obliteration of marking. | Dip in IPA solvent for 50.5 min, dry 5 min, brush 10 times (IEC 68-2-45:1993). |
| Overload Test | No smoke, odor, or fire during test. Characteristics normal after test. | Apply twice rated current for 5 minutes (JIS C5311-6.13). |
| Voltage Resistance Test | No breakdown during test. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min (MIL-STD-202G Method 301). For parts with two coils. |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user equipment and process conditions.
Reminders for Using These Products
- Storage: Within 12 months, at 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle carefully to prevent damage from dropping.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting corrections must be within specified conditions. Overheating can cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is ON; ensure sufficient thermal design margin.
- Non-Magnetic Shielded Type: Careful coil layout is needed on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina