Magnetic Resin Shielded Power Inductor LanTu Micro SNR3015-220MT with Automatic Assembly and EMI Resistance
Product Overview
The SNR3015 Series is an automatic assembly constructed, magnetic resin shielded SMD power inductor designed to minimize buzz noise to ultra-low levels. It features a closed magnetic circuit for reduced leakage flux and strong EMI resistance, along with a metallization on the ferrite core for excellent shock resistance and durability. This series offers large current handling capabilities and low DC resistance, making it space-saving and power-efficient. Its applications span across LED backlights, flat-screen TVs, computers, servers, multimedia devices, automotive products, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR3015
- Type: Magnetic Resin Shielded SMD Power Inductors
- Construction: Automatic assembly, magnetic resin shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part Number | Inductance (H) | Inductance Tolerance | Frequency | Voltage | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|---|---|
| SNR3015-R47M | 0.47 | 20% | 100KHz | 1.0V | 0.024 | 0.035 | 2.50 | 2.60 | 3.03.01.5 |
| SNR3015-1R0M | 1.0 | 20% | 100KHz | 1.0V | 0.030 | 0.039 | 2.32 | 2.35 | 3.03.01.5 |
| SNR3015-1R5M | 1.5 | 20% | 100KHz | 1.0V | 0.050 | 0.065 | 2.30 | 1.70 | 3.03.01.5 |
| SNR3015-1R8M | 1.8 | 20% | 100KHz | 1.0V | 0.050 | 0.065 | 1.75 | 1.70 | 3.03.01.5 |
| SNR3015-2R2M | 2.2 | 20% | 100KHz | 1.0V | 0.060 | 0.078 | 1.60 | 1.60 | 3.03.01.5 |
| SNR3015-3R3M | 3.3 | 20% | 100KHz | 1.0V | 0.080 | 0.104 | 1.32 | 1.36 | 3.03.01.5 |
| SNR3015-4R7M | 4.7 | 20% | 100KHz | 1.0V | 0.125 | 0.165 | 1.10 | 1.09 | 3.03.01.5 |
| SNR3015-6R8M | 6.8 | 20% | 100KHz | 1.0V | 0.200 | 0.260 | 0.85 | 0.85 | 3.03.01.5 |
| SNR3015-100M | 10 | 20% | 100KHz | 1.0V | 0.250 | 0.325 | 0.72 | 0.77 | 3.03.01.5 |
| SNR3015-150M | 15 | 20% | 100KHz | 1.0V | 0.350 | 0.455 | 0.66 | 0.65 | 3.03.01.5 |
| SNR3015-220M | 22 | 20% | 100KHz | 1.0V | 0.460 | 0.598 | 0.52 | 0.57 | 3.03.01.5 |
| SNR3015-330M | 33 | 20% | 100KHz | 1.0V | 0.820 | 1.066 | 0.44 | 0.43 | 3.03.01.5 |
| SNR3015-470M | 47 | 20% | 100KHz | 1.0V | 1.250 | 1.625 | 0.35 | 0.35 | 3.03.01.5 |
| Inductance Tolerance Options: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |||||||||
| Packing Options: B (Bulk Package), T (Tape & Reel) | |||||||||
| Operating Temperature: -40 to +125 (Including coils self-temperature rise) | |||||||||
| Dimensions (External): L=3.00.3, W=3.00.3, H=1.5 Max | |||||||||
| Recommended Land Pattern Dimensions: A=3.00.3, B=3.00.3, C=1.5 Max, D=1.50.2, E=2.50.2, F=0.8 Typ, G=1.5 Typ, H=2.7 Typ | |||||||||
Environmental & Reliability Data
Environmental:
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Reliability Testing:
- Terminal Strength (SMT & DIP)
- Resistance to Flexure
- Dropping Test
- Solderability
- Vibration Test
- Thermal Shock Test
- Low Temperature Storage
- High Temperature Storage
- Damp Heat (Steady States)
- Heat endurance of Reflow soldering
- Resistance to solvent test
- Overload test
- Voltage resistance test
Packaging Information
Tape and Reel Specifications:
- Reel Dimensions: 60 (Diameter) x 13 (Width) mm
- Tape Dimensions: W=8mm, P=4mm, W1=3.5mm
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
- Packing Quantity (per Reel): 2000 PCS
- Inside Box Quantity: 20,000 PCS
- Outside Carton Quantity: 80,000 PCS
Usage Precautions
- Storage period: within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
- Avoid use and storage in environments with gas corrosion (salt, acid, alkali, etc.).
- Do not touch electrodes directly with bare hands to prevent soldering inhibition due to oil secretions.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; ensure the temperature difference between solder and chip does not exceed 150C.
- Soldering corrections after mounting should be within specified conditions; overheating may cause short circuits, performance degradation, or reduced lifespan.
- Allow sufficient thermal design margin for self-heating when power is on.
Get in Touch
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