Low DC resistance power inductor LanTu Micro SMS0420-1R2MT for high density electronic installations
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Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0420 Series are ultra-high current SMD power inductors designed for high-density installations. Featuring a thin profile with low DC resistance and ultra-high current capability, these magnetically shielded inductors offer strong anti-electromagnetic interference. Their integral construction provides high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Utilizing low-loss alloy powder die-casting, they achieve low impedance and small parasitic capacitance, contributing to high efficiency and reduced core eddy-current loss. These inductors operate at frequencies up to 3MHz and have an absolute maximum voltage of 30VDC, complying with RoHS, Halogen Free, and REACH standards.
Applications include: PDA, notebook, desktop, server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Series: SMS0420
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) @ 100KHz, 1.0V | Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH) (mm) | Packaging |
|---|---|---|---|---|---|---|---|
| SMS0420-R10M | 0.10 | 20% | 3.5 | 25.00 | 13.00 | 4.600.30 4.200.20 2.00Max | Tape & Reel |
| SMS0420-R22M | 0.22 | 20% | 6.0 | 13.00 | 9.50 | 4.600.30 4.200.20 2.00Max | Tape & Reel |
| SMS0420-R33M | 0.33 | 20% | 8.0 | 11.00 | 7.00 | 4.600.30 4.200.20 2.00Max | Tape & Reel |
| SMS0420-R47M | 0.47 | 20% | 12.0 | 9.50 | 8.00 | 4.600.30 4.200.20 2.00Max | Tape & Reel |
| SMS0420-R56M | 0.56 | 20% | 14.0 | 9.00 | 7.00 | 4.600.30 4.200.20 2.00Max | Tape & Reel |
| SMS0420-R68M | 0.68 | 20% | 18.0 | 9.00 | 7.00 | 4.600.30 4.200.20 2.00Max | Tape & Reel |
| SMS0420-1R0M | 1.0 | 20% | 24.0 | 7.00 | 6.00 | 4.600.30 4.200.20 2.00Max | Tape & Reel |
| SMS0420-1R2M | 1.2 | 20% | 25.0 | 6.00 | 5.50 | 4.600.30 4.200.20 2.00Max | Tape & Reel |
| SMS0420-1R5M | 1.5 | 20% | 40.0 | 6.00 | 5.50 | 4.600.30 4.200.20 2.00Max | Tape & Reel |
| SMS0420-2R2M | 2.2 | 20% | 52.0 | 5.00 | 4.50 | 4.600.30 4.200.20 2.00Max | Tape & Reel |
| SMS0420-3R3M | 3.3 | 20% | 70.0 | 4.00 | 3.50 | 4.600.30 4.200.20 2.00Max | Tape & Reel |
| SMS0420-4R7M | 4.7 | 20% | 105.0 | 3.00 | 2.80 | 4.600.30 4.200.20 2.00Max | Tape & Reel |
| SMS0420-6R8M | 6.8 | 20% | 120.0 | 2.50 | 2.40 | 4.600.30 4.200.20 2.00Max | Tape & Reel |
| SMS0420-100M | 10 | 20% | 220.0 | 2.00 | 1.60 | 4.600.30 4.202.00Max | Tape & Reel |
| SMS0420-150M | 15 | 20% | 280.0 | 1.90 | 1.40 | 4.600.30 4.202.00Max | Tape & Reel |
| SMS0420-220M | 22 | 20% | 450.0 | 1.50 | 1.20 | 4.600.30 4.202.00Max | Tape & Reel |
Environmental Data
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
Test Equipment
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification
SMS 0420 - [Inductance] [Tolerance] [Packaging]
- Series: SMS
- Dimensions (LWH) (mm): 0420 (4.64.22.0)
- Type: Molding SMD Power Inductor
- Inductance Code Example: 100 = 10 H
- Tolerance Code: M = 20% (Other tolerances: J:5%, K: 10%, L: 15%, P: 25%, N: 30%)
- Packaging Code: T = Tape & Reel, B = Bulk Package
Shape and Dimensions
| Part No. | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|
| SMS0420 | 4.600.30 | 4.200.20 | 2.00Max | 1.50Typ | 0.80Typ | 2.20 | 5.20 | 2.50 |
Definitions
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Packaging Details
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimension A (mm) | Reel Dimension B (mm) | Reel Dimension C (mm) | Reel Dimension D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0420 | 12.0 | 8.0 | 5.5 | 12.4 | 100 | 13 | 330 | 3000 | 12,000 | 48,000 |
Cover Tape Peel Off Condition
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on terminal area (A): A8mm2 force5N, 8mm2 |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (d): 0.35d0.50 Applied force:5N, 0.50d0.80 Applied force:10N, 0.80d1.25 Applied force:20N, D1.25 Applied force:40N. Duration: 10sec. Pull Force applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Simple harmonic motion, amplitude 1.5mm, frequency 10 to 55 Hz (traversed in 1 min). Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock: (85~125) for T time, rush to (-55~40) for T time. Transforming interval: Max. 20 sec. Stabilize at normal condition for 1~2 hours before measuring. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then drying at room temp for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristics are normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjust and confirm based on user's environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH.
- Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by hand due to oils that can reduce solderability. Handle carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for self-heating (temperature increase) when power is ON.
- Non-Magnetic Shield Type: Careful coil layout is required in PCB design to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina