Magnetic Resin Shielded SMD Power Inductor LanTu Micro SNR3015-2R2MT with Low Buzz Noise and High Current Capacity
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Product Description
Product Overview
The SNR3015 Series is an automatic assembly compatible, magnetic resin shielded SMD power inductor designed to minimize buzz noise to ultra-low levels. It features a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, along with a metallization on the ferrite core for excellent shock resistance and durability. This series offers large current handling capabilities with low DCR, contributing to space and power savings. Applications include LED backlights, flat-screen TVs, notebooks, servers, graphics cards, automotive systems, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR3015
- Construction: Magnetic Resin Shielded, Automatic Assembly
- Magnetic Circuit: Closed
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Bulk Package, Tape & Reel
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Frequency (100KHz, 1.0V) | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|---|
| SNR3015-R47M | 0.47 | 20% | 0.024 | 0.035 | 2.50 | 2.60 | 3.03.01.5 | |
| SNR3015-1R0M | 1.0 | 20% | 0.030 | 0.039 | 2.32 | 2.35 | 3.03.01.5 | |
| SNR3015-1R5M | 1.5 | 20% | 0.050 | 0.065 | 2.30 | 1.70 | 3.03.01.5 | |
| SNR3015-1R8M | 1.8 | 20% | 0.050 | 0.065 | 1.75 | 1.70 | 3.03.01.5 | |
| SNR3015-2R2M | 2.2 | 20% | 0.060 | 0.078 | 1.60 | 1.60 | 3.03.01.5 | |
| SNR3015-3R3M | 3.3 | 20% | 0.080 | 0.104 | 1.32 | 1.36 | 3.03.01.5 | |
| SNR3015-4R7M | 4.7 | 20% | 0.125 | 0.165 | 1.10 | 1.09 | 3.03.01.5 | |
| SNR3015-6R8M | 6.8 | 20% | 0.200 | 0.260 | 0.85 | 0.85 | 3.03.01.5 | |
| SNR3015-100M | 10 | 20% | 0.250 | 0.325 | 0.72 | 0.77 | 3.03.01.5 | |
| SNR3015-150M | 15 | 20% | 0.350 | 0.455 | 0.66 | 0.65 | 3.03.01.5 | |
| SNR3015-220M | 22 | 20% | 0.460 | 0.598 | 0.52 | 0.57 | 3.03.01.5 | |
| SNR3015-330M | 33 | 20% | 0.820 | 1.066 | 0.44 | 0.43 | 3.03.01.5 | |
| SNR3015-470M | 47 | 20% | 1.250 | 1.625 | 0.35 | 0.35 | 3.03.01.5 |
| Inductance Tolerance Codes | Packing Codes |
|---|---|
| J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | B: Bulk Package, T: Tape & Reel |
| Environmental Data | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Shape and Dimensions (mm) | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SNR3015 | 3.00.3 | 3.00.3 | 1.5 Max | 1.50.2 | 2.50.2 | 0.8 Typ | 1.5 Typ | 2.7 Typ |
| Test Item | Requirements | Test Method |
|---|---|---|
| Terminal Strength (SMT) | Varies by terminal cross-sectional area (5N to 20N) | Pulling test (GB/T 2423.60-2008) |
| Terminal Strength (DIP) | Varies by terminal diameter (5N to 40N) | Pulling test (GB/T 2423.60-2008) |
| Resistance to Flexure | No visible mechanical damage, 2mm flexure | JIS C 5321:1997 |
| Dropping | No case deformation, no short/open | 1m drop (GB/T 2423.7-2018) |
| Solderability | Wetting >75% coverage, Terminals 95% minimum solder coverage | 2402, 3 sec (GB/T 2423.28-2005) |
| Vibration | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | 10-55 Hz, 1.5mm amplitude (GB/T 2423.10-2019) |
| Thermal Shock | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | -55 to +125, 100 cycles (GB/T 2423.22-2012) |
| Low temperature Storage | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | -40 to -55, 962 hours (GB/T 2423.1-2008) |
| High temperature Storage | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | 85 to 125, 962 hours (GB/T 2423.2-2008) |
| Damp Heat (Steady States) | No visible mechanical damage, Inductance change: 10%, Q factor change: 20% | 60, 90%-95% RH, 962 hours (GB/T 2423.3-2016) |
| Heat endurance of Reflow soldering | No significant defects, L/L10%, Q/Q30%, DCR/DCR10% | Peak temp: 260+0/-5 (GJB 360B-2009) |
| Resistance to solvent test | No case deformation or change in appearance | IPA solvent dip (IEC 68-2-45:1993) |
| Overload test | No smoke, no peculiar smell, no fire | 2x rated current for 5 minutes (JIS C5311-6.13) |
| Voltage resistance test | No breakdown | DC1000V, 1mA, 1min (MIL-STD-202G Method 301) |
Note: Mn-Zn material has specific inductance change requirements for some tests.
Usage Reminders
- Storage period: within 12 months under conditions (5~40C, 35~66% RH).
- Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Do not touch terminals directly with bare hands to maintain solderability.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Keep away from magnets or magnetic objects.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid overheating.
- Ensure sufficient thermal design margin for self-heating when power is on.
- For non-magnetic shield types, careful layout is needed to avoid malfunction due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina