Compact Unshielded SMD Power Inductors LanTu Micro SCD4532-220MT with High Rated Current and Low DCR
Unshielded SMD Power Inductors - SCD4532 Series
Product Overview
The SCD4532 Series Unshielded SMD Power Inductors are low-cost, silver-plated components designed for surface mounting. These inductors offer a small size with high rated current and low DCR, making them suitable for DC/DC converters and power supplies in various electronic devices including VTRs, LCD televisions, notebook PCs, and portable communication equipment. They are compliant with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SCD4532 Series
- Type: Unshielded SMD Power Inductors
- Design: Silver plated type, Low cost design
- Certifications: RoHS, Halogen Free and REACH Compliance
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
General Specifications
| Parameter | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| External Dimensions (LWH) | 4.5 3.2 mm |
| Inductance Tolerance | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
Electrical Characteristics
| Part No. | Inductance (H) @ 0A | Tolerance | Test Freq. (KHz) | SRF Min (MHz) | DCR Typ () | DCR Max () | Saturation Current Max (A) | Temperature Rise Current Max (A) |
|---|---|---|---|---|---|---|---|---|
| SCD4532-1R0M | 1.0 | M | 100 | 120 (at 7.96MHz) | 0.0487 | - | 3.85 | 2.56 |
| SCD4532-1R4M | 1.4 | M | 100 | 95 (at 7.96MHz) | 0.0562 | - | 3.40 | 2.52 |
| SCD4532-1R8M | 1.8 | M | 100 | 75 (at 7.96MHz) | 0.0637 | - | 2.90 | 1.95 |
| SCD4532-2R2M | 2.2 | M | 100 | 62 (at 7.96MHz) | 0.0712 | - | 2.80 | 1.75 |
| SCD4532-2R7M | 2.7 | M | 100 | 53 (at 7.96MHz) | 0.0787 | - | 2.75 | 1.58 |
| SCD4532-3R3M | 3.3 | M | 100 | 47 (at 7.96MHz) | 0.0862 | - | 2.48 | 1.44 |
| SCD4532-3R9M | 3.9 | M | 100 | 41 (at 7.96MHz) | 0.0937 | - | 2.30 | 1.33 |
| SCD4532-4R7M | 4.7 | M | 100 | 38 (at 7.96MHz) | 0.1087 | - | 2.00 | 1.15 |
| SCD4532-5R6M | 5.6 | M | 100 | 33 (at 7.96MHz) | 0.1257 | - | 1.95 | 0.99 |
| SCD4532-6R8M | 6.8 | M | 100 | 31 (at 7.96MHz) | 0.1312 | - | 1.60 | 0.95 |
| SCD4532-8R2M | 8.2 | M | 100 | 27 (at 7.96MHz) | 0.1462 | - | 1.50 | 0.84 |
| SCD4532-100M | 10 | M | 100 | 23 (at 2.52MHz) | 0.1820 | - | 1.45 | 1.04 |
| SCD4532-120M | 12 | M | 100 | 21 (at 2.52MHz) | 0.2100 | - | 1.20 | 0.97 |
| SCD4532-150M | 15 | M | 100 | 19 (at 2.52MHz) | 0.2350 | - | 1.12 | 0.85 |
| SCD4532-180M | 18 | M | 100 | 17 (at 2.52MHz) | 0.3380 | - | 1.00 | 0.74 |
| SCD4532-220M | 22 | M | 100 | 15 (at 2.52MHz) | 0.3780 | - | 0.96 | 0.68 |
| SCD4532-270M | 27 | M | 100 | 14 (at 2.52MHz) | 0.5220 | - | 0.84 | 0.62 |
| SCD4532-330M | 33 | M | 100 | 12 (at 2.52MHz) | 0.5400 | - | 0.75 | 0.56 |
| SCD4532-390M | 39 | M | 100 | 11 (at 2.52MHz) | 0.5870 | - | 0.70 | 0.52 |
| SCD4532-470M | 47 | M | 100 | 10 (at 2.52MHz) | 0.8440 | - | 0.68 | 0.44 |
| SCD4532-560M | 56 | M | 100 | 9.3 (at 2.52MHz) | 0.9370 | - | 0.60 | 0.42 |
| SCD4532-680M | 68 | M | 100 | 8.4 (at 2.52MHz) | 1.1170 | - | 0.50 | 0.37 |
| SCD4532-820M | 82 | M | 100 | 8.0 (at 2.52MHz) | 1.3450 | - | 0.46 | 0.29 |
| SCD4532-101M | 100 | M | 100 | 7.2 (at 1KHz) | 1.5200 | - | 0.45 | 0.26 |
| SCD4532-121M | 120 | M | 100 | 6.5 (at 1KHz) | 1.7500 | - | 0.44 | 0.24 |
| SCD4532-151M | 150 | M | 100 | 5.8 (at 1KHz) | 2.0000 | - | 0.42 | 0.22 |
| SCD4532-181M | 180 | M | 100 | 5.0 (at 1KHz) | 3.2000 | - | 0.38 | 0.19 |
| SCD4532-221M | 220 | M | 100 | 4.3 (at 1KHz) | 3.4000 | - | 0.36 | 0.18 |
| SCD4532-331M | 330 | M | 100 | 3.5 (at 1KHz) | 5.3000 | - | 0.28 | 0.15 |
| SCD4532-391M | 390 | M | 100 | 3.0 (at 1KHz) | 5.9000 | - | 0.24 | 0.13 |
| SCD4532-471M | 470 | M | 100 | 2.6 (at 1KHz) | 6.8000 | - | 0.21 | 0.12 |
| SCD4532-561M | 560 | M | 100 | 2.0 (at 1KHz) | 8.4000 | - | 0.20 | 0.10 |
Definitions
- Saturation Current (Isat): DC current at which inductance drops 10% from its value without current.
- Temperature Rise Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Dimensions (mm)
| Part No. | A | B | C | D | H | I | J |
|---|---|---|---|---|---|---|---|
| SCD4532 | 4.50.3 | 4.00.3 | 3.20.3 | 1.2 | 4.5 | 1.75 | 1.5 |
Recommended Land Pattern (mm)
(Image or diagram would typically be placed here, but is not possible in text format.)
Packaging Information
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) | Total Quantity |
|---|---|---|---|---|---|---|---|---|---|---|---|
| SCD4532 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 | - |
Reliability Testing
The SCD4532 Series undergoes various reliability tests including Terminal Strength (SMT & DIP), Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat (Steady States), Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test. Specific requirements and test methods are detailed in the original datasheet.
Recommended Reflow Soldering Curve
(Diagram of the recommended reflow soldering curve would typically be shown here.) The recommended reflow conditions should be adjusted and confirmed according to the user's environment and equipment.
Reminders for Using These Products
- Storage period is within 12 months under conditions (5~40C, 35~65% RH).
- Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Do not touch electrodes directly with bare hands to prevent solderability issues.
- Handle products carefully to prevent damage from dropping.
- Do not bend terminals excessively.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Keep away from magnets or magnetic fields.
- Preheat components before soldering; ensure the temperature difference between solder and chip does not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
- Ensure sufficient thermal design margin as components self-heat when powered on.
- For non-magnetic shield types, careful coil placement on the circuit board is necessary to prevent malfunctions due to magnetic interference.
Get in Touch
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