High current Molding SMD Power Inductors LanTu Micro SMS0865-220MT with low parasitic capacitance
Molding SMD Power Inductors - SMS0865 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0865 Series offers ultra-high current SMD power inductors designed for high-density installations. These inductors feature a thin profile with low DC resistance and ultra-high current capabilities. Their magnetic shielding provides strong anti-electromagnetic interference, while the integral construction ensures high reliability and excellent vibration resistance. The composite structure contributes to ultra-low buzz noise, and the use of low-loss alloy powder in die-casting results in low impedance and small parasitic capacitance, leading to high efficiency and reduced core eddy-current loss. These inductors are suitable for applications such as PDA, notebooks, desktops, servers, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0865
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
General Specifications
| Parameter | Value | Unit |
|---|---|---|
| Operating Temperature | -55 to +125 | (Including coil self-temperature rise) |
| Absolute Maximum Voltage | 75 | VDC |
Product Identification
Format: SMS 0865 [Inductance] [Tolerance] [Packing Type]
- Series Code: SMS0865
- External Dimensions (LWH): 9.08.16.5 mm
- Inductance Tolerance Codes: J (5%), K (10%), L (15%), M (20%), P (25%), N (30%)
- Packing Codes: B (Bulk Package), T (Tape & Reel)
Shape and Dimensions
| Part No. | A (Max) | B (0.3) | C (Max) | D (0.3) | E (0.3) | F (Ref) | G (Ref) | H (Ref) |
|---|---|---|---|---|---|---|---|---|
| SMS0865 | 9.0 | 8.10 | 6.50 | 3.00 | 1.90 | 4.50 | 9.00 | 3.50 |
Dimensions are in mm.
Electrical Characteristics (SMS0865 Series)
| Part No. | Inductance (H) | Inductance Tolerance | DCR (m) | Saturation Current (A) | Heat Rating Current (A) | |
|---|---|---|---|---|---|---|
| @ 100KHz, 1.0V | Typical | Max | Typical | Typical | ||
| SMS0865-4R7M | 4.70 | 20% | 12.50 | 15.00 | 16.00 | 11.0 |
| SMS0865-6R8M | 6.80 | 20% | 19.00 | 23.00 | 13.00 | 9.00 |
| SMS0865-100M | 10.00 | 20% | 24.00 | 29.00 | 10.00 | 8.50 |
| SMS0865-150M | 15.00 | 20% | 24.50 | 35.00 | 8.30 | 8.00 |
| SMS0865-220M | 22.00 | 20% | 42.00 | 50.00 | 7.00 | 6.00 |
| SMS0865-330M | 33.00 | 20% | 89.00 | 100.00 | 6.00 | 4.50 |
| SMS0865-470M | 47.00 | 20% | 135.00 | 155.00 | 5.50 | 3.50 |
| SMS0865-680M | 68.00 | 20% | 180.00 | 200.00 | 4.50 | 4.00 |
| SMS0865-101M | 100.00 | 20% | 214.00 | 255.00 | 3.20 | 3.00 |
Saturation Current: DC current at which inductance drops 30% from its value without current.
Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser value of Isat or Irms.
Special Remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Packaging
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0865 | 24.0 | 12.0 | 11.5 | 24.4 | 100 | 13 | 330 | 500 | 1000 | 4000 |
Tape and Reel Specifications: Dimensions are in mm.
Cover tape peel off condition: a) Cover tape peel force shall be 10 to 120g, b) Noodle strip peeling angle 165 to 180.
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Solder to jig with lead-free solder. Force applied gradually. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (GB/T 2423.60-2008). Pull Force maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Solder to test jig, apply force in specified direction. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Packaged products dropped from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. No visible mechanical damage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Solder to jig, subjected to simple harmonic motion (10-55 Hz, 1.5mm amplitude) for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature extremes (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition before measuring. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. Stabilize at normal condition before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition before measuring. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | GJB 360B-2009. Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip parts into IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. Repeat twice. |
| Voltage resistance test | During test: no breakdown. Characteristics normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. For parts with two coils. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are provided as a guideline. Users should adjust and confirm conditions based on their specific environment, equipment, and process. The temperature difference between preheating and soldering should not exceed 150C.
Reminders for Using These Products
- Storage period is within 12 months under conditions of 5~40C and 35~65% RH.
- Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions that may inhibit soldering.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact SXN if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; ensure the temperature difference between solder and chip does not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid overheating, short circuits, performance degradation, or lifespan reduction.
- Allow for sufficient thermal design margin as devices self-heat when powered on.
- For non-magnetic shield types, careful coil layout on the circuit board is required to prevent malfunctions due to magnetic interference.
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