Power Inductor LanTu Micro SNR6045-680MT Featuring Magnetic Resin Shielding for Reduced Buzz Noise and EMI
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Product Description
Product Overview
The SNR6045 Series Magnetic Resin Shielded SMD Power Inductors are automatic assembly constructed power inductors featuring magnetic resin shielding to significantly reduce buzz noise to ultra-low levels. Designed for large current capacity and low DC resistance, these inductors utilize a closed magnetic circuit for reduced leakage flux and strong EMI resistance. Their compact size saves PCB real estate and power. Applications include LED backlights, flat-screen TVs, set-top boxes, notebooks, desktop computers, servers, graphic cards, portable gaming devices, personal navigation systems, multimedia devices, automotive systems, telecommunication base stations, and DC-DC converters. They are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR6045
- Construction: Automatic assembly constructed, Magnetic Resin Shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Test Frequency (kHz) | Test Voltage (V) | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|---|
| SNR6045-1R0M | 1.0 | 20% | 100 | 1.0 | 0.011 | 0.014 | 9.85 | 5.14 |
| SNR6045-1R5M | 1.5 | 20% | 100 | 1.0 | 0.012 | 0.015 | 8.80 | 4.95 |
| SNR6045-2R2M | 2.2 | 20% | 100 | 1.0 | 0.014 | 0.018 | 6.75 | 4.60 |
| SNR6045-3R3M | 3.3 | 20% | 100 | 1.0 | 0.021 | 0.027 | 5.90 | 3.70 |
| SNR6045-4R7M | 4.7 | 20% | 100 | 1.0 | 0.026 | 0.033 | 4.97 | 3.30 |
| SNR6045-6R8M | 6.8 | 20% | 100 | 1.0 | 0.031 | 0.040 | 3.90 | 3.00 |
| SNR6045-8R2M | 8.2 | 20% | 100 | 1.0 | 0.043 | 0.055 | 3.90 | 2.60 |
| SNR6045-100M | 10 | 20% | 100 | 1.0 | 0.048 | 0.062 | 3.20 | 2.45 |
| SNR6045-150M | 15 | 20% | 100 | 1.0 | 0.068 | 0.088 | 2.50 | 2.05 |
| SNR6045-220M | 22 | 20% | 100 | 1.0 | 0.089 | 0.115 | 2.05 | 1.80 |
| SNR6045-330M | 33 | 20% | 100 | 1.0 | 0.137 | 0.178 | 1.65 | 1.50 |
| SNR6045-470M | 47 | 20% | 100 | 1.0 | 0.200 | 0.260 | 1.40 | 1.20 |
| SNR6045-680M | 68 | 20% | 100 | 1.0 | 0.286 | 0.375 | 1.20 | 1.00 |
| SNR6045-820M | 82 | 20% | 100 | 1.0 | 0.341 | 0.440 | 1.05 | 0.90 |
| SNR6045-101M | 100 | 20% | 100 | 1.0 | 0.433 | 0.562 | 0.95 | 0.80 |
| SNR6045-121M | 120 | 20% | 100 | 1.0 | 0.484 | 0.628 | 0.85 | 0.77 |
| SNR6045-151M | 150 | 20% | 100 | 1.0 | 0.580 | 0.750 | 0.80 | 0.70 |
| SNR6045-221M | 220 | 20% | 100 | 1.0 | 0.834 | 1.050 | 0.70 | 0.59 |
| SNR6045-331M | 330 | 20% | 100 | 1.0 | 1.270 | 1.650 | 0.57 | 0.57 |
| SNR6045-471M | 470 | 20% | 100 | 1.0 | 1.800 | 2.340 | 0.50 | 0.42 |
| SNR6045-681M | 680 | 20% | 100 | 1.0 | 2.500 | 3.250 | 0.42 | 0.33 |
| SNR6045-102M | 1000 | 20% | 100 | 1.0 | 4.500 | 5.850 | 0.30 | 0.30 |
| Inductance Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | ||||||||
| Packing Codes: B: Bulk Package, T: Tape & Reel | ||||||||
| Operating Temperature: -40 to +125 (Including coils self-temperature rise) | ||||||||
| Dimensions (LWH): 6.06.04.5 mm (for SNR6045 series) | ||||||||
| Saturation Current Definition: DC current at which inductance drops 30% from its value without current. | ||||||||
| Temperature Rise Current Definition: The actual value of DC current when the temperature rise is T 40 (Ta=25). | ||||||||
| Rated DC Current: The lesser value of Isat or Irms. | ||||||||
Dimensions
| Part No. | A (mm) | B (mm) | C (mm) Max | D (mm) | E (mm) | F (mm) Typ | G (mm) Typ | H (mm) Typ |
|---|---|---|---|---|---|---|---|---|
| SNR6045 | 6.00.3 | 6.00.3 | 4.5 | 2.90.3 | 4.90.3 | 1.7 | 2.8 | 5.7 |
Packaging
| Part No. | Tape Width (W) (mm) | Pitch (P) (mm) | Pocket Width (W1) (mm) | Reel Diameter (mm) | Reel Quantity (PCS) | Inside Box Quantity (PCS) | Outside Carton Quantity (PCS) | Total Quantity (PCS) |
|---|---|---|---|---|---|---|---|---|
| SNR6045 | 16 | 12 | 7.5 | 180 | 100 | 13 | 330 | 1500 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on terminal area; Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pull force applied gradually to terminal for 10 seconds, varying with terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm; Speed: 0.5mm/sec; Duration: 30 sec. |
| Dropping | No case deformation or change in appearance; No short and no open. | Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. | Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol. |
| Vibration | Inductance change: Within 10%; Q factor change: Within 20%. | Frequency: 10 to 55 Hz and return; Duration: 2 hours in each 3 mutually perpendicular directions. |
| Thermal Shock | Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | 100 cycles of temperature extremes (-55~40 to 85~125); Transforming interval: Max. 20 sec. |
| Low temperature Storage | Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: -55~-402; Duration: 962 hours. |
| High temperature Storage | Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: 85~1252; Duration: 962 hours. |
| Damp Heat (Steady States) | Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. | Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours. |
| Heat endurance of Reflow soldering | L/L 10% (Mn-Zn: L/L 30%); Q/Q 30%; DCR/DCR 10%. | Peak temperature: 260+0/-5; Performed twice. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dipped in IPA solvent for 50.5Min, dried for 5Min, brushed 10 times. |
| Overload test | No smoke, no peculiar smell, no fire during test; Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test; Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, at 5~40C and 35~65% RH. Solderability may deteriorate after the storage period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals with bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for thermal design due to self-heating when power is applied.
- Layout: For non-magnetic shielded types, carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina