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Low DC resistance molding SMD power inductor LanTu Micro SMS0630 R82MT for distributed power systems

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Product Description

Molding SMD Power Inductors - SMS0630 Series

Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0630 Series are ultra-high current, thin-profile SMD power inductors designed for demanding applications. Featuring magnetic shielding for strong anti-electromagnetic interference and an integral construction for high reliability and vibration resistance, these inductors offer low DC resistance, ultra-low buzz noise, and low loss due to die-casting with low-loss alloy powder. They are suitable for high-density installations and operate at frequencies up to 3MHz, making them ideal for PDAs, notebooks, desktops, servers, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.

Product Attributes

  • Brand: LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Product Series: SMS0630 Series
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: SHENZHEN

Technical Specifications

General Specifications

Item Specification
Operating Temperature -55 to +125 (Including coils self-temperature rise)
Absolute Maximum Voltage 30VDC
Frequency Range Up to 3MHz

Electrical Characteristics (Electrical specifications at 25)

Part No Inductance (L) (H) @0A Tol DCR (m) Typical DCR (m) Max Saturation Current (Isat) Typical (A) Heat Rating Current (Irms) Typical (A)
SMS0630-R10M 0.10 20% 1.40 2.20 60.00 32.00
SMS0630-R15M 0.15 20% 1.55 2.30 41.00 30.00
SMS0630-R22M 0.22 20% 1.60 3.00 35.00 25.00
SMS0630-R33M 0.33 20% 2.50 3.20 25.00 21.00
SMS0630-R47M 0.47 20% 4.00 4.50 20.00 18.00
SMS0630-R68M 0.68 20% 4.75 5.30 19.00 16.00
SMS0630-R82M 0.82 20% 5.60 7.50 18.00 14.00
SMS0630-1R0M 1.0 20% 7.60 7.25 16.00 13.00
SMS0630-1R5M 1.5 20% 13.20 16.00 14.00 12.50
SMS0630-2R2M 2.2 20% 16.50 20.00 11.50 8.50
SMS0630-3R3M 3.3 20% 24.50 35.00 9.50 7.00
SMS0630-4R7M 4.7 20% 35.00 40.00 6.55 6.00
SMS0630-5R6M 5.6 20% 36.00 42.00 6.35 5.70
SMS0630-6R8M 6.8 20% 44.30 48.00 6.00 5.10
SMS0630-8R2M 8.2 20% 60.00 64.90 6.00 5.00
SMS0630-100M 10 20% 64.50 75.00 5.50 4.50
SMS0630-150M 15 20% 103.00 115.00 4.50 3.10
SMS0630-220M 22 20% 180.00 200.00 3.50 2.60
SMS0630-330M 33 20% 250.00 270.00 3.00 2.00
SMS0630-470M 47 20% 310.00 385.00 2.00 1.50
SMS0630-680M 68 20% 506.00 580.00 1.50 1.00

Shape and Dimensions (dimensions are in mm)

Part No A B C (Max) D (Typ) E (Typ) F G H
SMS0630 7.100.30 6.600.20 3.00 3.00 1.60 3.70 8.40 3.50

Inductance Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Packing Codes: B: Bulk Package, T: Tape & Reel

Definitions:

  • Saturation Current: DC current at which inductance drops 30% from its value without current.
  • Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value of Isat or Irms.

Note: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Packaging Specifications

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SMS0630 16.0 12.0 7.5 16.4 100 13 330 1000 3000 12,000

Cover tape peel off condition:

  • a) Cover tape peel force shall be 10 to 120g.
  • b) Noodle strip peeling angle 165 to 180.

Reminders for Using These Products

  • Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
  • Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals by bare hands due to oil secretions.
  • Handle products carefully to prevent damage from dropping or improper removal.
  • Do not bend terminals with excessive stress to avoid wire fracture.
  • Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering. The temperature difference between solder temperature and chip temperature should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Self-heating occurs when power is ON; ensure sufficient thermal design margin.
  • For non-magnetic shield types, careful coil layout on the circuit board is necessary to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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