Product Overview
The SNR6045 Series are automatic assembly compatible, magnetic resin shielded SMD power inductors designed to minimize buzz noise to ultra-low levels. Featuring a closed magnetic circuit design, they offer reduced leakage flux and strong EMI resistance. These inductors provide large current handling capability with low DC resistance, making them space-saving and power-efficient. They are widely used in applications such as LED backlights, flat-screen TVs, notebooks, desktop computers, servers, graphic cards, portable gaming devices, personal navigation systems, automotive products, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR6045
- Construction: Magnetic resin shielded, automatic assembly
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Test Frequency (100KHz, 1.0V) | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
| SNR6045-1R0M | 1.0 | 20% | 1.0V | 0.011 | 0.014 | 9.85 | 5.14 |
| SNR6045-1R5M | 1.5 | 20% | 1.0V | 0.012 | 0.015 | 8.80 | 4.95 |
| SNR6045-2R2M | 2.2 | 20% | 1.0V | 0.014 | 0.018 | 6.75 | 4.60 |
| SNR6045-3R3M | 3.3 | 20% | 1.0V | 0.021 | 0.027 | 5.90 | 3.70 |
| SNR6045-4R7M | 4.7 | 20% | 1.0V | 0.026 | 0.033 | 4.97 | 3.30 |
| SNR6045-6R8M | 6.8 | 20% | 1.0V | 0.031 | 0.040 | 3.90 | 3.00 |
| SNR6045-8R2M | 8.2 | 20% | 1.0V | 0.043 | 0.055 | 3.90 | 2.60 |
| SNR6045-100M | 10 | 20% | 1.0V | 0.048 | 0.062 | 3.20 | 2.45 |
| SNR6045-150M | 15 | 20% | 1.0V | 0.068 | 0.088 | 2.50 | 2.05 |
| SNR6045-220M | 22 | 20% | 1.0V | 0.089 | 0.115 | 2.05 | 1.80 |
| SNR6045-330M | 33 | 20% | 1.0V | 0.137 | 0.178 | 1.65 | 1.50 |
| SNR6045-470M | 47 | 20% | 1.0V | 0.200 | 0.260 | 1.40 | 1.20 |
| SNR6045-680M | 68 | 20% | 1.0V | 0.286 | 0.375 | 1.20 | 1.00 |
| SNR6045-820M | 82 | 20% | 1.0V | 0.341 | 0.440 | 1.05 | 0.90 |
| SNR6045-101M | 100 | 20% | 1.0V | 0.433 | 0.562 | 0.95 | 0.80 |
| SNR6045-121M | 120 | 20% | 1.0V | 0.484 | 0.628 | 0.85 | 0.77 |
| SNR6045-151M | 150 | 20% | 1.0V | 0.580 | 0.750 | 0.80 | 0.70 |
| SNR6045-221M | 220 | 20% | 1.0V | 0.834 | 1.050 | 0.70 | 0.59 |
| SNR6045-331M | 330 | 20% | 1.0V | 1.270 | 1.650 | 0.57 | 0.57 |
| SNR6045-471M | 470 | 20% | 1.0V | 1.800 | 2.340 | 0.50 | 0.42 |
| SNR6045-681M | 680 | 20% | 1.0V | 2.500 | 3.250 | 0.42 | 0.33 |
| SNR6045-102M | 1000 | 20% | 1.0V | 4.500 | 5.850 | 0.30 | 0.30 |
| Inductance Tolerance Codes | Packing Codes |
| J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | B: Bulk Package, T: Tape & Reel |
| Dimensions (LWH) (mm) | Item | A | B | C | D | E | F (Typ) | G (Typ) | H (Typ) |
| 6.06.04.5 | SNR6045 | 6.00.3 | 6.00.3 | 4.5 Max | 2.90.3 | 4.90.3 | 1.7 | 2.8 | 5.7 |
| Environmental Data | Operating Temperature |
| (Including coils self-temperature rise) | -40 to +125 |
| Test Equipment | Instrument |
| Inductance (L) | HP4284A, HP4285A LCR meter or equivalent |
| Saturation Current (Isat) & Temperature Rise Current (Irms) | HP4284+42841A or equivalent |
| DC Resistance (DCR) | Chroma 16502 or equivalent |
| Packaging | Tape Dimension (mm) | Reel Dimensions (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
| SNR6045 | W: 16, P: 12, W1: 7.5 | A: 16.4 | 100 | 13 | 330 | 1500 | 4500 | 18,000 |
| Reliability Testing | Requirements | Test Methods and Remarks |
| Terminal Strength (SMT) | Meet requirements without loose terminal | Pulling test based on terminal area; Solder paste thickness: 0.12mm; Keep time: 101s; Speed: 1.0mm/s |
| Terminal Strength (DIP) | Meet requirements without loose terminal | Pull Force applied gradually for 10 seconds, based on terminal diameter |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm; Speed: 0.5mm/sec; Keep time: 30 sec |
| Dropping | No case deformation or change in appearance; No short and no open | Drop from 1m high, 1 angle, 3 ridges, 6 surfaces, twice each direction |
| Solderability | No visible mechanical damage; Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage | Solder temp: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Frequency: 10 to 55 Hz (and return); Duration: 2 hours in 3 perpendicular directions |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | 100 cycles of -55~40 to 85~125; Transforming interval: Max. 20 sec |
| Low temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Temperature: -55~-402; Duration: 962 hours |
| High temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Temperature: 85~1252; Duration: 962 hours |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% | Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10% | Refer to reflow curve, performed twice; Peak temp: 260+0/-5 |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times |
| Overload test | No smoke, no peculiar smell, no fire; Characteristics normal after test | Apply twice rated current for 5 minutes |
| Voltage resistance test | No breakdown during test; Characteristics normal after test | DC1000V, Current: 1mA, Time: 1Min (for parts with two coils) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to our soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months, at 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle carefully to prevent damage from dropping.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetism: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform after mounting within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is ON; ensure sufficient thermal design margin.
- Non-magnetic Shielded Type: Careful coil layout on the PCB is required to prevent malfunctions due to magnetic interference.